Abstract:
An appropriate pulse width of a driving pulse for driving a piezoelectric element of ink jet head is determined by using the head difference. That is, the pulse width with which the least change in the ink speed occurs can be used as the pulse width of the driving signal for the piezoelectric actuator. As a result, a reliable ink jet printer head capable of stably ejecting ink droplets over a long period of time and having excellent frequency characteristics can be provided.
Abstract:
A plurality of heaters are provided on a silicon substrate in a plurality of individual ink channels. Each heater is constructed from a thin-film resistor and a thin-film conductor. The thin-film resistor is formed with an electrical insulation layer at its upper surface. The electrical insulation layer is formed through subjecting the thin-film resistor to a high-temperature thermal oxidation process. The thin-film resistor formed with the electrical insulation layer may be covered with an additional insulation layer of a thickness substantially equal to the thin-film resistor.
Abstract:
In an ink ejection recording head, a silicon dioxide layer is formed on the surface of a silicon substrate, a silicon nitride layer is formed on the silicon dioxide layer, and a plurality of heaters are formed on the silicon nitride layer. The heater is constituted by a thin film resistor made from a Ta--Si--O alloy and a thin film conductor made from nickel. Further, a gold layer is formed through plating on at least a portion of the thin film conductor to be connected to another conductor prior to thermally oxidizing the heaters.
Abstract:
To provide a method of fabricating, using thin-film processes only, a 1,600 dpi head with nozzles arranged two-dimensionally on a substrate, e.g., silicon wafer, a drive LSI, thin-film resistors and thin-film conductors are formed on the silicon wafer. Thereafter, ink channels and through-holes are formed by silicon anisotropic etching from both sides of the silicon wafer. After connecting the orifice plate to the silicon wafer, nozzles are formed in the orifice plate using photoetching.
Abstract:
A silicon carbide whisker production apparatus manufactured by placing a plurality of lidded reaction vessels in the longitudinal direction of an Acheson furnace at intervals, packing graphite grains in the gaps between the adjacent reaction vessels and around the reaction vessels along the longitudinal direction of the furnace starting with the furnace-side ends of terminal electrodes to form a surrounding heating zone, and packing a heat insulating packing around the surrounding heating zone.
Abstract:
An electro-mechanical transducer element is disclosed. The electro-mechanical transducer element includes a first electrode formed on a substrate; an electro-mechanical transducer film formed on at least a part of the first electrode; and a second electrode formed on at least a part of the electro-mechanical transducer film. In at least one cross section of the electro-mechanical transducer film, a film thickness distribution shape is convex to the second electrode side.
Abstract:
An electronic device includes a substrate; and a plurality of thin-film elements formed on the substrate. Further, the thin-film element includes a thin-film section having a function selected from a group including piezoelectric effect, inverse piezoelectric effect, charge storage, semiconductivity, and conductivity, and the plurality of thin-film elements includes the thin-film sections having two or more different functions.
Abstract:
A precursor sol-gel solution is provided that has been subjected to a partial hydrolysis process and is used for forming an oxide dielectric film having a perovskite structure represented by the general formula ABO3. The precursor sol-gel solution is subjected to a stabilization process for controlling a viscosity change resulting from the partial hydrolysis process to be less than or equal to 50%, and water contained in the precursor sol-gel solution is controlled to be greater than or equal to 0.50 times and less than or equal to 10 times by molar ratio with respect to a B site atom contained in the precursor sol-gel solution.
Abstract:
Disclosed is a method of fabricating an electromechanical transducer film. The method includes treating a surface of a first electrode to be liquid-repellent, the first electrode being formed on one surface of a substrate, irradiating the surface of the first liquid-repellent electrode with an energy ray while moving an irradiation position in accordance with a shape of the electromechanical transducer film to be formed and a shape of an alignment mark to be formed, and forming the alignment mark by applying an application liquid to an area including a portion irradiated with the energy ray in accordance with the shape of the alignment mark in the irradiating step, the application liquid being applied by an inkjet method.
Abstract:
A thin film forming apparatus which automatically forms, on an electrode layer formed on a substrate, a functional thin film which is crystallized from a precursor layer is disclosed, including a water-repellant film forming unit which forms, on a region other than a region on which is to be formed the functional thin film on the electrode layer, a water-repellant film which includes a self-assembled monolayer; an inkjet coating unit which coats, on the region on which is to be formed the functional thin film on the electrode layer, the precursor layer by an inkjet method; and a controller which controls, to within a predetermined time, a time from forming the water-repellant film with the water-repellant film forming unit to coating the precursor layer with the inkjet coating unit.