公开(公告)号：US07271024B2

公开(公告)日：2007-09-18

申请号：US11163310

申请日：2005-10-13

申请人： Chien-Ping Huang ,  Chih-Ming Huang ,  Cheng-Yi Chang

发明人： Chien-Ping Huang ,  Chih-Ming Huang ,  Cheng-Yi Chang

IPC分类号： H01L21/00 ,  H01L31/113

CPC分类号： H01L27/14683 ,  H01L23/49816 ,  H01L23/5389 ,  H01L24/24 ,  H01L24/81 ,  H01L24/82 ,  H01L24/97 ,  H01L27/14618 ,  H01L27/14634 ,  H01L2224/81801 ,  H01L2224/82 ,  H01L2224/85 ,  H01L2224/86 ,  H01L2924/14 ,  H01L2924/00

摘要： A sensor semiconductor device and a method for fabricating the same are proposed. A plurality of metal bumps and a sensor chip are mounted on a substrate. A dielectric layer and a circuit layer are formed on the substrate, wherein the circuit layer is electrically connected to the metal bumps and the sensor chip. Thus, the sensor chip is electrically connected to the substrate via the circuit layer and the metal bumps. The dielectric layer is formed with an opening for exposing a sensor region of the sensor chip. A light-penetrable lid covers the opening of the dielectric layer, such that light is able to penetrate the light-penetrable lid to reach the sensor region and activate the sensor chip. A plurality of solder balls are mounted on a surface of the substrate free of mounting the sensor chip, for electrically connecting the sensor chip to an external device.

摘要翻译： 提出了一种传感器半导体器件及其制造方法。 多个金属凸块和传感器芯片安装在基板上。 在基板上形成电介质层和电路层，其中电路层电连接到金属凸块和传感器芯片。 因此，传感器芯片经由电路层和金属凸块电连接到基板。 电介质层形成有用于暴露传感器芯片的传感器区域的开口。 透光盖子覆盖电介质层的开口，使得光线能够穿透透光盖子到达传感器区域并激活传感器芯片。 多个焊球安装在基板的表面上，无需安装传感器芯片，用于将传感器芯片电连接到外部设备。

公开(公告)号：US07365364B2

公开(公告)日：2008-04-29

申请号：US11162135

申请日：2005-08-30

申请人： Chien-Ping Huang ,  Chih-Ming Huang ,  Cheng-Yi Chang

发明人： Chien-Ping Huang ,  Chih-Ming Huang ,  Cheng-Yi Chang

IPC分类号： H01L29/267 ,  H01L29/22

CPC分类号： H01L27/14683 ,  H01L27/14618 ,  H01L2224/24226

摘要： A sensor semiconductor device and a method for fabricating the same are proposed. A sensor chip is mounted on a substrate, and a dielectric layer and a circuit layer are formed on the substrate, wherein the circuit layer is electrically connected to the substrate and the sensor chip. The dielectric layer is formed with an opening for exposing a sensor region of the sensor chip. A light-penetrable lid covers the opening of the dielectric layer, such that light is able to penetrate the light-penetrable lid to reach the sensor region and activate the sensor chip. The sensor chip can be electrically connected to an external device via a plurality of solder balls implanted on a surface of the substrate not for mounting the sensor chip. Therefore, the sensor semiconductor device is fabricated in a cost-effective manner, and circuit cracking and a know good die (KGD) problem are prevented.

摘要翻译： 提出了一种传感器半导体器件及其制造方法。 传感器芯片安装在基板上，并且在基板上形成电介质层和电路层，其中电路层电连接到基板和传感器芯片。 电介质层形成有用于暴露传感器芯片的传感器区域的开口。 透光盖子覆盖电介质层的开口，使得光线能够穿透透光盖子到达传感器区域并激活传感器芯片。 传感器芯片可以通过植入在基板的表面上的多个焊球电连接到外部设备，而不用于安装传感器芯片。 因此，传感器半导体器件以成本有效的方式制造，并且防止了电路破裂和知道的裸芯片（KGD）问题。

公开(公告)号：US20080105941A1

公开(公告)日：2008-05-08

申请号：US11982514

申请日：2007-11-02

申请人： Tse-Wen Chang ,  Chang-Yueh Chan ,  Chih-Ming Huang ,  Cheng-Hsu Hsiao

发明人： Tse-Wen Chang ,  Chang-Yueh Chan ,  Chih-Ming Huang ,  Cheng-Hsu Hsiao

IPC分类号： H01L31/0203 ,  H01L21/00

CPC分类号： H01L31/0203 ,  H01L23/3128 ,  H01L24/97 ,  H01L27/14618 ,  H01L27/14683 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49175 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/15311 ,  H01L2924/16235 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2224/85 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： The invention provides a sensor-type semiconductor package and fabrication method thereof. The fabrication method includes steps of: attaching a sensor chip to a chip carrier; electrically connecting the sensor chip and a chip carrier via a plurality of bonding wires; mounting a light-permeable body to the sensor chip with an adhesive layer as a partition therebetween, wherein the planar size of the light-permeable body is larger than a predefined planar size of the sensor-type semiconductor package to be formed; forming an encapsulant on the chip carrier for encapsulating the sensor chip and the bonding wires with the upper surface of the light-permeable body being exposed from the encapsulant; and cutting through the light-permeable body, the encapsulant and the chip carrier according to the predefined planar size. Accordingly the contacting area between the cut light-permeable body and the cut encapsulant increased and the bonding therebetween is reinforced.

摘要翻译： 本发明提供一种传感器型半导体封装及其制造方法。 该制造方法包括以下步骤：将传感器芯片附接到芯片载体; 经由多根接合线电连接传感器芯片和芯片载体; 将透光体安装到传感器芯片上，其中粘合剂层作为其间的隔板，其中透光体的平面尺寸大于要形成的传感器型半导体封装的预定平面尺寸; 在所述芯片载体上形成密封剂，用于封装所述传感器芯片，并且所述接合线与所述透光体的上表面暴露于所述密封剂; 并根据预定的平面尺寸切穿透光体，密封剂和芯片载体。 因此，切割的透光体和切割的密封剂之间的接触面积增加，并且增强了它们之间的粘结。

公开(公告)号：US20070202633A1

公开(公告)日：2007-08-30

申请号：US11651708

申请日：2007-01-09

申请人： Wen-Tsung Tseng ,  Fang-Lin Tsai ,  Ho-Yi Tsai ,  Cheng-Hsu Hsiao ,  Chih-Ming Huang

发明人： Wen-Tsung Tseng ,  Fang-Lin Tsai ,  Ho-Yi Tsai ,  Cheng-Hsu Hsiao ,  Chih-Ming Huang

IPC分类号： H01L21/00

CPC分类号： H01L21/4882 ,  H01L23/3675 ,  H01L23/544 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2223/5442 ,  H01L2223/54473 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2924/01079 ,  H01L2924/16152 ,  H01L2924/16315 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/00015

摘要： A semiconductor package and a method for fabricating the same are provided. The method includes providing a substrate having recognition points and a heat sink having openings, and placing the heat sink on the substrate with the recognition points being exposed through the openings; using a checking system to inspect the recognition points through the openings so as to ensure that the heat sink is placed at a predetermined position on the substrate; and attaching the heat sink to the substrate via an adhesive. By the above semiconductor package and method, there is no need to form positioning holes in the substrate such that any adverse effect on the circuit layout and reliability of the semiconductor package is avoided, and any positional shifting of the heat sink relative to the substrate can be determined in a real time manner.

摘要翻译： 提供半导体封装及其制造方法。 该方法包括提供具有识别点的基板和具有开口的散热器，并且将散热器放置在基板上，识别点通过开口露出; 使用检查系统通过开口检查识别点，以确保散热器被放置在基板上的预定位置; 以及通过粘合剂将散热器附接到基板。 通过上述半导体封装和方法，不需要在衬底中形成定位孔，从而避免对半导体封装的电路布局和可靠性的任何不利影响，并且散热片相对于衬底的任何位置偏移可以 以实时的方式确定。

公开(公告)号：US20080265385A1

公开(公告)日：2008-10-30

申请号：US12215543

申请日：2008-06-27

申请人： Han-Lung Tsai ,  Chih-Ming Huang ,  Cheng-Hsu Hsiao

发明人： Han-Lung Tsai ,  Chih-Ming Huang ,  Cheng-Hsu Hsiao

IPC分类号： H01L21/60 ,  H01L23/495

CPC分类号： H01L24/85 ,  H01L23/49811 ,  H01L24/45 ,  H01L24/48 ,  H01L24/78 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/4845 ,  H01L2224/48465 ,  H01L2224/48475 ,  H01L2224/4848 ,  H01L2224/48482 ,  H01L2224/48499 ,  H01L2224/48599 ,  H01L2224/78301 ,  H01L2224/85051 ,  H01L2224/85181 ,  H01L2224/85205 ,  H01L2224/85444 ,  H01L2224/85455 ,  H01L2224/85986 ,  H01L2924/00014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00015 ,  H01L2924/00012 ,  H01L2224/4554

摘要： A semiconductor package using copper wires and a wire bonding method for the same are proposed. The package includes a carrier having fingers and a chip mounted on the carrier. The method includes implanting stud bumps on the fingers of the carrier and electrically connecting the chip and the carrier by copper wires with one ends of the copper wires being bonded to bond pads of the chip and the other ends of the copper wires being bonded to the stud bumps on the carrier. The implanted stud bumps on the carrier improve bondability of the copper wires to the carrier and thus prevent stitch lift. With good bonding, residues of copper wires left behind after a bonding process have even tail ends and uniform tail length to enable fabrication of solder balls of uniform size, thereby eliminating a conventional step of implanting stud bumps on the bond pads of chips and preventing ball lift from occurring.

摘要翻译： 提出了使用铜线的半导体封装及其引线接合方法。 封装包括具有指状物的载体和安装在载体上的芯片。 该方法包括在支架的指状物上注入螺柱凸块，并用铜线电连接芯片和载体，铜线的一端被接合到芯片的接合焊盘，并且铜线的另一端被接合到 支架上的螺柱凸起。 载体上植入的柱形突起提高了铜线对载体的粘结性，从而防止了针迹提升。 通过良好的接合，在接合工艺之后留下的铜线的残留物具有均匀的尾端和均匀的尾部长度，以使得能够制造均匀尺寸的焊球，从而消除了在芯片的接合焊盘上植入凸块凸起并防止球的常规步骤 提升不发生。

公开(公告)号：US07939383B2

公开(公告)日：2011-05-10

申请号：US11928708

申请日：2007-10-30

申请人： Chien Ping Huang ,  Yu-Po Wang ,  Chih-Ming Huang

发明人： Chien Ping Huang ,  Yu-Po Wang ,  Chih-Ming Huang

IPC分类号： H01L21/00

CPC分类号： H01L21/4857 ,  H01L21/4832 ,  H01L21/561 ,  H01L21/568 ,  H01L23/3121 ,  H01L23/58 ,  H01L24/48 ,  H01L24/49 ,  H01L24/97 ,  H01L2221/68345 ,  H01L2224/05554 ,  H01L2224/16 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/15183 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/18161 ,  H05K3/007 ,  H05K3/3457 ,  H05K3/4682 ,  H05K2203/0152 ,  H01L2224/85 ,  H01L2224/81 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor package and a fabrication method thereof are provided in which a dielectric material layer formed with a plurality of openings is used and a solder material is applied into each of the openings. A first copper layer and a second copper layer are in turn deposited over the dielectric material layer and solder materials, and the first and second copper layers are patterned to form a plurality of conductive traces each of which has a terminal coated with a metal layer. A chip is mounted on the conductive traces and electrically connected to the terminals by bonding wires, with the dielectric material layer and solder materials being exposed to the outside. This package structure can flexibly arrange the conductive traces and effectively shorten the bonding wires, thereby improve trace routability and quality of electrical connection for the semiconductor package.

摘要翻译： 提供一种半导体封装及其制造方法，其中使用形成有多个开口的电介质材料层，并且将焊料材料施加到每个开口中。 第一铜层和第二铜层又沉积在介电材料层和焊料材料上，并且第一和第二铜层被图案化以形成多个导电迹线，每个导电迹线具有涂覆有金属层的端子。 芯片安装在导电迹线上，并通过接合线电连接到端子，电介质材料层和焊料材料暴露于外部。 该封装结构可以灵活地布置导电迹线并有效地缩短接合线，从而提高半导体封装的迹线布线性和电连接质量。

公开(公告)号：US20100170709A1

公开(公告)日：2010-07-08

申请号：US12727307

申请日：2010-03-19

申请人： Fang-Lin Tsai ,  Ho-Yi Tsai ,  Chih-Ming Huang ,  Chien-Ping Huang

发明人： Fang-Lin Tsai ,  Ho-Yi Tsai ,  Chih-Ming Huang ,  Chien-Ping Huang

IPC分类号： H05K1/16 ,  H05K1/00

CPC分类号： H01L23/3121 ,  H01L2924/0002 ,  H01L2924/19041 ,  H01L2924/3025 ,  H05K3/284 ,  H05K3/3442 ,  H05K3/3452 ,  H05K2201/0989 ,  H05K2201/10636 ,  Y02P70/611 ,  H01L2924/00

摘要： An electronic carrier board and a package structure thereof are provided. The electronic carrier board includes a carrier, at least one pair of bond pads formed on the carrier, and a protective layer covering the carrier. The protective layer is formed with openings for exposing the bond pads. A groove is formed between the paired bond pads and has a length larger than a width of an electronic component mounted on the paired bond pads. The groove is adjacent to one of the paired bond pads and communicates with a corresponding one of the openings where this bond pad is exposed. Accordingly, a clearance between the electronic component and the electronic carrier board can be effectively filled with an insulating resin for encapsulating the electronic component, thereby preventing voids and undesirable electrical bridging between the paired bond pads from occurrence.

摘要翻译： 提供电子载体板及其封装结构。 电子载板包括载体，形成在载体上的至少一对接合焊盘和覆盖载体的保护层。 保护层形成有用于暴露接合焊盘的开口。 在成对的接合焊盘之间形成有一个沟槽，其长度大于安装在成对接合焊盘上的电子部件的宽度。 该沟槽与一对接合焊盘相邻，并与该接合焊盘露出的相应的一个开口连通。 因此，电子部件和电子载体板之间的间隙可以有效地填充用于封装电子部件的绝缘树脂，从而防止成对焊盘之间的空隙和不期望的电桥发生。

公开(公告)号：US07696623B2

公开(公告)日：2010-04-13

申请号：US11643147

申请日：2006-12-20

申请人： Fang-Lin Tsai ,  Ho-Yi Tsai ,  Chih-Ming Huang ,  Chien-Ping Huang

发明人： Fang-Lin Tsai ,  Ho-Yi Tsai ,  Chih-Ming Huang ,  Chien-Ping Huang

IPC分类号： H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC分类号： H01L23/3121 ,  H01L2924/0002 ,  H01L2924/19041 ,  H01L2924/3025 ,  H05K3/284 ,  H05K3/3442 ,  H05K3/3452 ,  H05K2201/0989 ,  H05K2201/10636 ,  Y02P70/611 ,  H01L2924/00

摘要： An electronic carrier board and a package structure thereof are provided. The electronic carrier board includes a carrier, at least one pair of bond pads formed on the carrier, and a protective layer covering the carrier. The protective layer is formed with openings for exposing the bond pads. A groove is formed between the paired bond pads and has a length larger than a width of an electronic component mounted on the paired bond pads. The groove is adjacent to one of the paired bond pads and communicates with a corresponding one of the openings where this bond pad is exposed. Accordingly, a clearance between the electronic component and the electronic carrier board can be effectively filled with an insulating resin for encapsulating the electronic component, thereby preventing voids and undesirable electrical bridging between the paired bond pads from occurrence.

摘要翻译： 提供电子载体板及其封装结构。 电子载板包括载体，形成在载体上的至少一对接合焊盘和覆盖载体的保护层。 保护层形成有用于暴露接合焊盘的开口。 在成对的接合焊盘之间形成有一个沟槽，其长度大于安装在成对接合焊盘上的电子部件的宽度。 该沟槽与一对接合焊盘相邻，并与该接合焊盘露出的相应的一个开口连通。 因此，电子部件和电子载体板之间的间隙可以有效地填充用于封装电子部件的绝缘树脂，从而防止成对焊盘之间的空隙和不期望的电桥发生。

公开(公告)号：US06972216B2

公开(公告)日：2005-12-06

申请号：US10768307

申请日：2004-01-29

申请人： Chien-Ping Huang ,  Chih-Ming Huang

发明人： Chien-Ping Huang ,  Chih-Ming Huang

IPC分类号： H01L23/31 ,  H01L23/433 ,  H01L23/495 ,  H01L23/50 ,  H01L21/50

CPC分类号： H01L23/552 ,  H01L23/3128 ,  H01L23/4334 ,  H01L23/49568 ,  H01L23/50 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/91 ,  H01L2224/05554 ,  H01L2224/48091 ,  H01L2224/48095 ,  H01L2224/4813 ,  H01L2224/48227 ,  H01L2224/48235 ,  H01L2224/49 ,  H01L2224/73221 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/014 ,  H01L2924/10161 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2924/00012

摘要： A BGA (ball grid array) package with enhanced electrical and thermal performance, and a method for fabricating the BGA package, are proposed. This BGA package is characterized by the use of a power-connecting heat spreader and a ground-connecting heat spreader, which are respectively used to electrically connect power pad and ground pad to a packaged chip as well as to dissipate heat generated by the chip during operation. The ground-connecting heat spreader is arranged to entirely cover the chip, and thereby provides good shielding effect for the chip, which helps improve electrical performance of the chip during operation. Further, the ground-connecting heat spreader is partly exposed to outside of an encapsulation body that encapsulates the chip, by which satisfactory heat-dissipation efficiency can be achieved.

摘要翻译： 提出了具有增强的电气和热性能的BGA（球栅阵列）封装以及制造BGA封装的方法。 该BGA封装的特征在于使用功率连接散热器和接地连接散热器，其分别用于将电源焊盘和接地焊盘电连接到封装芯片，以及散发由芯片产生的热量 操作。 地面连接散热器布置成完全覆盖芯片，从而为芯片提供良好的屏蔽效果，有助于提高芯片在运行过程中的电气性能。 此外，地连接散热器部分地暴露于封装芯片的封装体的外部，由此可以实现令人满意的散热效率。

公开(公告)号：US06703698B2

公开(公告)日：2004-03-09

申请号：US10157069

申请日：2002-05-29

申请人： Chien-Ping Huang ,  Chih-Ming Huang

发明人： Chien-Ping Huang ,  Chih-Ming Huang

IPC分类号： H01L2322

CPC分类号： H01L23/552 ,  H01L23/3128 ,  H01L23/4334 ,  H01L23/49568 ,  H01L23/50 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/91 ,  H01L2224/05554 ,  H01L2224/48091 ,  H01L2224/48095 ,  H01L2224/4813 ,  H01L2224/48227 ,  H01L2224/48235 ,  H01L2224/49 ,  H01L2224/73221 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/014 ,  H01L2924/10161 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2924/00012

摘要： A BGA (ball grid array) package with enhanced electrical and thermal performance, and a method for fabricating the BGA package, are proposed. This BGA package is characterized by the use of a power-connecting heat spreader and a ground-connecting heat spreader, which are respectively used to electrically connect power pad and ground pad to a packaged chip as well as to dissipate heat generated by the chip during operation. The ground-connecting heat spreader is arranged to entirely cover the chip, and thereby provides good shielding effect for the chip, which helps improve electrical performance of the chip during operation. Further, the ground-connecting heat spreader is partly exposed to outside of an encapsulation body that encapsulates the chip, by which satisfactory heat-dissipation efficiency can be achieved.