公开(公告)号：US07452057B2

公开(公告)日：2008-11-18

申请号：US11119308

申请日：2005-04-28

申请人： Kevin Von Essen ,  Antai Xu ,  Andreas Bibl ,  John A. Higginson

发明人： Kevin Von Essen ,  Antai Xu ,  Andreas Bibl ,  John A. Higginson

IPC分类号： B41J2/14 ,  B41J2/05

CPC分类号： B41J2/14072 ,  B41J2002/14491 ,  H05K1/118 ,  H05K1/189 ,  H05K2201/053 ,  H05K2201/10689

摘要： A flexible circuit for use within a printhead assembly and to connect a printhead body to an external circuit includes a substantially planar portion having one or more layers of conductive material and having a top surface substantially parallel to a top surface of the printhead body. One or more integrated circuits can be mounted onto the planar portion. Multiple leads extend from each integrated circuit, the leads electrically connected to the printhead body. One or more arms are attached to, and substantially perpendicular to, the planar portion, each arm including one or more external connectors configured to connect to the external circuit.

摘要翻译： 用于打印头组件内并将打印头主体连接到外部电路的柔性电路包括具有一层或多层导电材料并且具有基本上平行于打印头主体顶表面的顶表面的基本上平面的部分。 一个或多个集成电路可以安装在平面部分上。 多个引线从每个集成电路延伸，引线电连接到打印头主体。 一个或多个臂附接到并且基本上垂直于平面部分，每个臂包括被配置为连接到外部电路的一个或多个外部连接器。

公开(公告)号：US20140084240A1

公开(公告)日：2014-03-27

申请号：US13625825

申请日：2012-09-24

申请人： Hsin-Hua Hu ,  Andreas Bibl ,  John A. Higginson

发明人： Hsin-Hua Hu ,  Andreas Bibl ,  John A. Higginson

IPC分类号： H01L33/04

CPC分类号： H01L21/52 ,  H01L21/6835 ,  H01L21/6836 ,  H01L24/83 ,  H01L24/93 ,  H01L24/95 ,  H01L25/0753 ,  H01L25/50 ,  H01L27/156 ,  H01L33/0079 ,  H01L33/40 ,  H01L2221/6835 ,  H01L2224/95136 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/1461 ,  H01L2924/00

摘要： A method and structure for stabilizing an array of micro devices is disclosed. The array of micro devices is formed on an array of stabilization posts formed from a thermoset material. Each micro device includes a bottom surface that is wider than a corresponding stabilization post directly underneath the bottom surface.

公开(公告)号：US08518204B2

公开(公告)日：2013-08-27

申请号：US13436314

申请日：2012-03-30

申请人： Hsin-Hua Hu ,  Andreas Bibl ,  John A. Higginson ,  Hung-Fai Stephen Law

发明人： Hsin-Hua Hu ,  Andreas Bibl ,  John A. Higginson ,  Hung-Fai Stephen Law

IPC分类号： B29C65/02 ,  B29C65/48 ,  B32B37/04 ,  B32B39/00 ,  B32B43/00

CPC分类号： H01L24/83 ,  H01L21/67144 ,  H01L24/75 ,  H01L24/95 ,  H01L33/0079 ,  H01L33/46 ,  H01L2224/7598 ,  H01L2224/83 ,  H01L2924/01322 ,  H01L2924/12041 ,  H01L2924/12042 ,  Y10T156/1153 ,  H01L2924/00

摘要： A method of fabricating and transferring a micro device and an array of micro devices to a receiving substrate are described. In an embodiment, an electrically insulating layer is utilized as an etch stop layer during etching of a p-n diode layer to form a plurality of micro p-n diodes. In an embodiment, an electrically conductive intermediate bonding layer is utilized during the formation and transfer of the micro devices to the receiving substrate.

摘要翻译： 描述了将微器件和微器件阵列制造和传送到接收衬底的方法。 在一个实施例中，在蚀刻p-n二极管层以形成多个微p-n二极管期间，电绝缘层被用作蚀刻停止层。 在一个实施例中，在将微器件形成和传送到接收衬底期间，使用导电中间接合层。

公开(公告)号：US20130127020A1

公开(公告)日：2013-05-23

申请号：US13372277

申请日：2012-02-13

申请人： Andreas Bibl ,  John A. Higginson ,  Hung-Fai Stephen Law ,  Hsin-Hua Hu

发明人： Andreas Bibl ,  John A. Higginson ,  Hung-Fai Stephen Law ,  Hsin-Hua Hu

IPC分类号： H01L29/06

CPC分类号： H01L24/83 ,  B32B37/025 ,  B32B37/06 ,  B32B2457/20 ,  H01L21/67144 ,  H01L21/6833 ,  H01L24/75 ,  H01L24/95 ,  H01L24/97 ,  H01L2224/75725 ,  H01L2224/7598 ,  H01L2224/83005 ,  H01L2224/97 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12041 ,  H01L2924/1421 ,  H01L2924/1431 ,  H01L2924/1434 ,  H01L2924/1461 ,  H01L2924/15153 ,  Y10T156/1153 ,  Y10T156/1707 ,  Y10T156/1744 ,  Y10T156/1749 ,  Y10T156/1776 ,  H01L2224/83 ,  H01L2924/00

摘要： A micro device transfer head and head array are disclosed. In an embodiment, the micro device transfer head includes a base substrate, a mesa structure with sidewalls, an electrode formed over the mesa structure, and a dielectric layer covering the electrode. A voltage can be applied to the micro device transfer head and head array to pick up a micro device from a carrier substrate and release the micro device onto a receiving substrate.

摘要翻译： 公开了一种微器件转印头和头阵列。 在一个实施例中，微器件转移头包括基底，具有侧壁的台面结构，形成在台面结构上的电极以及覆盖电极的电介质层。 可以将电压施加到微器件转移头和头阵列以从载体衬底拾取微器件并将微器件释放到接收衬底上。

公开(公告)号：US20130126891A1

公开(公告)日：2013-05-23

申请号：US13372222

申请日：2012-02-13

申请人： Andreas Bibl ,  John A. Higginson ,  Hung-Fai Stephen Law ,  Hsin-Hua Hu

发明人： Andreas Bibl ,  John A. Higginson ,  Hung-Fai Stephen Law ,  Hsin-Hua Hu

IPC分类号： H01L33/32 ,  H01L33/08

CPC分类号： H01L33/06 ,  F21V7/00 ,  H01L25/0753 ,  H01L27/15 ,  H01L29/0684 ,  H01L33/0079 ,  H01L33/04 ,  H01L33/20 ,  H01L33/28 ,  H01L33/30 ,  H01L2224/95

摘要： A micro light emitting diode (LED) and a method of forming an array of micro LEDs for transfer to a receiving substrate are described. The micro LED structure may include a micro p-n diode and a metallization layer, with the metallization layer between the micro p-n diode and a bonding layer. A conformal dielectric barrier layer may span sidewalls of the micro p-n diode. The micro LED structure and micro LED array may be picked up and transferred to a receiving substrate.

摘要翻译： 描述了微型发光二极管（LED）和形成用于传送到接收基板的微型LED阵列的方法。 微型LED结构可以包括微型p-n二极管和金属化层，金属化层位于微型p-n二极管和结合层之间。 保形介质阻挡层可以跨越微型p-n二极管的侧壁。 微型LED结构和微型LED阵列可以被拾取并转移到接收衬底。

公开(公告)号：US08349116B1

公开(公告)日：2013-01-08

申请号：US13372422

申请日：2012-02-13

申请人： Andreas Bibl ,  John A. Higginson ,  Hung-Fai Stephen Law ,  Hsin-Hua Hu

发明人： Andreas Bibl ,  John A. Higginson ,  Hung-Fai Stephen Law ,  Hsin-Hua Hu

IPC分类号： B29C65/02 ,  B29C65/48 ,  B32B37/04 ,  B32B39/00 ,  B32B43/00

CPC分类号： H01L29/167 ,  B32B38/18 ,  H01L21/67144 ,  H01L24/75 ,  H01L24/83 ,  H01L24/95 ,  H01L24/97 ,  H01L25/0753 ,  H01L33/62 ,  H01L2224/75725 ,  H01L2224/7598 ,  H01L2224/83005 ,  H01L2224/97 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1421 ,  H01L2924/1431 ,  H01L2924/1434 ,  H01L2924/1461 ,  H01L2933/0066 ,  Y10T156/1153 ,  Y10T156/17 ,  Y10T156/1705 ,  Y10T156/1707 ,  Y10T156/1744 ,  Y10T156/1749 ,  Y10T156/1776 ,  Y10T156/1911 ,  H01L2224/83 ,  H01L2924/00

摘要： A method of transferring a micro device and an array of micro devices are disclosed. A carrier substrate carrying a micro device connected to a bonding layer is heated to a temperature below a liquidus temperature of the bonding layer, and a transfer head is heated to a temperature above the liquidus temperature of the bonding layer. Upon contacting the micro device with the transfer head, the heat from the transfer head transfers into the bonding layer to at least partially melt the bonding layer. A voltage applied to the transfer head creates a grip force which picks up the micro device from the carrier substrate.

摘要翻译： 公开了一种传送微型装置和微型装置阵列的方法。 承载连接到接合层的微型器件的载体衬底被加热到低于接合层的液相线温度的温度，并且转移头被加热到高于接合层的液相线温度的温度。 当微型装置与转印头接触时，来自转印头的热量转移到粘结层中以至少部分地熔化粘结层。 施加到转印头的电压产生从载体衬底拾取微器件的夹持力。

公开(公告)号：US08333860B1

公开(公告)日：2012-12-18

申请号：US13372310

申请日：2012-02-13

申请人： Andreas Bibl ,  John A. Higginson ,  Hung-Fai Stephen Law ,  Hsin-Hua Hu

发明人： Andreas Bibl ,  John A. Higginson ,  Hung-Fai Stephen Law ,  Hsin-Hua Hu

IPC分类号： B29C65/02 ,  B29C65/48 ,  B32B37/04 ,  B32B39/00 ,  B32B43/00

CPC分类号： H01L24/83 ,  B32B37/025 ,  B32B37/06 ,  B32B2457/20 ,  H01L21/67144 ,  H01L21/6833 ,  H01L24/75 ,  H01L24/95 ,  H01L24/97 ,  H01L2224/75725 ,  H01L2224/7598 ,  H01L2224/83005 ,  H01L2224/97 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12041 ,  H01L2924/1421 ,  H01L2924/1431 ,  H01L2924/1434 ,  H01L2924/1461 ,  H01L2924/15153 ,  Y10T156/1153 ,  Y10T156/1707 ,  Y10T156/1744 ,  Y10T156/1749 ,  Y10T156/1776 ,  H01L2224/83 ,  H01L2924/00

摘要： A micro device transfer head and head array are disclosed. In an embodiment, the micro device transfer head includes a base substrate, a mesa structure with sidewalls, an electrode formed over the mesa structure, and a dielectric layer covering the electrode. A voltage can be applied to the micro device transfer head and head array to pick up a micro device from a carrier substrate and release the micro device onto a receiving substrate.

摘要翻译： 公开了一种微器件转印头和头阵列。 在一个实施例中，微器件转移头包括基底，具有侧壁的台面结构，形成在台面结构上的电极以及覆盖电极的电介质层。 可以将电压施加到微器件转移头和头阵列以从载体衬底拾取微器件并将微器件释放到接收衬底上。

公开(公告)号：US08297742B2

公开(公告)日：2012-10-30

申请号：US12728020

申请日：2010-03-19

申请人： Kevin Von Essen ,  John A. Higginson ,  Andreas Bibl

发明人： Kevin Von Essen ,  John A. Higginson ,  Andreas Bibl

IPC分类号： B41J2/045

CPC分类号： B41J2/14233 ,  B41J2/161 ,  B41J2/1623 ,  B41J2/1632 ,  B41J2/1642 ,  B41J2/1643 ,  B41J2/1646 ,  B41J2002/14362 ,  B41J2202/03 ,  Y10T29/49401

摘要： A fluid ejection device includes a circuit layer having a fluid outlet on a lower surface, a chamber substrate having a fluid inlet on an upper surface, an electrical contact electrically connecting the chamber substrate to the lower surface of the circuit layer, and a seal forming a fluid connection between the fluid outlet of the circuit layer and the fluid inlet of the chamber substrate. The seal and the electrical contact are a eutectic material. The seal and the electrical contact may be the same material.

摘要翻译： 流体喷射装置包括在下表面上具有流体出口的电路层，具有在上表面上的流体入口的腔室基底，将腔室基底电连接到电路层的下表面的电接触，以及密封形成 电路层的流体出口和腔室衬底的流体入口之间的流体连接。 密封和电接触是共晶材料。 密封和电接触可以是相同的材料。

公开(公告)号：US20090066758A1

公开(公告)日：2009-03-12

申请号：US12271707

申请日：2008-11-14

申请人： Kevin Von Essen ,  Antai Xu ,  Andreas Bibl ,  John A. Higginson

发明人： Kevin Von Essen ,  Antai Xu ,  Andreas Bibl ,  John A. Higginson

IPC分类号： B41J2/14

CPC分类号： B41J2/14072 ,  B41J2002/14491 ,  H05K1/118 ,  H05K1/189 ,  H05K2201/053 ,  H05K2201/10689

摘要： A flexible circuit for use within a printhead assembly and to connect a printhead body to an external circuit includes a substantially planar portion having one or more layers of conductive material and having a top surface substantially parallel to a top surface of the printhead body. One or more integrated circuits can be mounted onto the planar portion. Multiple leads extend from each integrated circuit, the leads electrically connected to the printhead body. One or more arms are attached to, and substantially perpendicular to, the planar portion, each arm including one or more external connectors configured to connect to the external circuit.

摘要翻译： 用于打印头组件内并将打印头主体连接到外部电路的柔性电路包括具有一层或多层导电材料并且具有基本上平行于打印头主体顶表面的顶表面的基本上平面的部分。 一个或多个集成电路可以安装在平面部分上。 多个引线从每个集成电路延伸，引线电连接到打印头主体。 一个或多个臂附接到并且基本上垂直于平面部分，每个臂包括被配置为连接到外部电路的一个或多个外部连接器。

公开(公告)号：US07420317B2

公开(公告)日：2008-09-02

申请号：US10967073

申请日：2004-10-15

申请人： Andreas Bibl ,  John A. Higginson

发明人： Andreas Bibl ,  John A. Higginson

IPC分类号： H01K41/08

CPC分类号： B41J2/1626 ,  B41J2/14233 ,  B41J2/161 ,  B41J2/1623 ,  B41J2/1631 ,  B41J2/1632 ,  B41J2/1637 ,  B41J2/1645 ,  B41J2/1646 ,  H01L27/20 ,  H01L41/0973 ,  H01L41/313 ,  H01L41/337 ,  Y10T29/42 ,  Y10T29/43 ,  Y10T29/435

摘要： Microelectromechanical systems with structures having piezoelectric actuators are described. The structures each have a body that supports piezoelectric islands. The piezoelectric islands have a first surface and a second opposite surface. The piezoelectric islands can be formed, in part, by forming cuts into a thick layer of piezoelectric material, attaching the cut piezoelectric layer to a body having etched features and grinding the piezoelectric layer to a thickness that is less than the depths of the cuts. Conductive material can be formed on the piezoelectric layer to form electrodes.