摘要:
Disclosed is a method of processing a semiconductor gate structure on a semiconductor wafer, the method comprising providing a semiconductor structure with an active device area capped with a pad oxide layer bounded by one or more isolation trenches, providing a sacrificial oxide layer by thickening said pad oxide layer to a desired oxide thickness, in using said thickened pad oxide layer as said sacrificial oxide layer for device implantation, stripping said sacrificial pad oxide layer after use, and capping said semiconductor gate with a final gate oxide layer.
摘要:
An improved capacitor is formed by a process where an improved node dielectric layer is formed with an improved dielectric constant by performing an Free Radical Enhanced Rapid Thermal Oxidation (FRE RTO) step during formation of the node dielectric layer. Use of an FRE RTO step instead of the conventional furnace oxidation step produces a cleaner oxide with a higher dielectric constant and higher capacitance. Other specific embodiments of the invention include improved node dielectric layer by one or more additional nitridation steps, done by either Remote Plasma Nitridation (RPN), Rapid Thermal Nitridation (RTN), Decoupled Plasma Nitridation (DPN) or other nitridation method; selective oxidation; use of a metal layer rather than a SiN layer as the dielectric base; and selective oxidation of the metal layer.
摘要:
A method for manufacturing III-V semiconductor layers containing nitrogen whereby during the growth of the layers, the setting of the material sources for Al, In and Ga remains fixed. During the transition to the growth of a layer with another mixed-crystal composition, the nitrogen flow is altered. A greater nitrogen flow leads to an increased installation of the more weakly bound group III elements into the growing material.
摘要:
A method for manufacturing a heterobipolar transistor having and at least greatly diminished extrinsic base-collector capacitance provides an insulation implantation in a sub-collector layer grown onto a semi-insulating substrate via a first mask that covers a region provided for the sub-collector to be constructed or the sub-collector is formed by doping the semi-insulating substrate through a mask. The semiconductor layers for the collector, the base and the emitter, the sub-collector being fashioned in a limited region provided therefore and the emitter is aligned on the sub-collector with a second mask.
摘要:
A method for the manufacture of a planar, self-aligned emitter-base complex, whereby a semiconductor layer structure standard for hetero-bipolar transistors is first grown on a substrate, the base regions are subsequently etching through a mask technique and are provided with the base metallization and with a first dielectric layer and insulation implantations and spacers for electrical insulation of the base are manufactured, and, following thereupon, the emitter region is provided with the emitter metallization and with a third dielectric layer.
摘要:
A method for fabricating a field-effect transistor with local source/drain insulation. The method includes forming and patterning a gate stack with a gate layer and a gate dielectric on a semiconductor substrate; forming source and drain depressions at the gate stack in the semiconductor substrate; forming a depression insulation layer at least in a bottom region of the source and drain depressions; and filling the at least partially insulated source and drain depressions with a filling layer for realizing source and drain regions.
摘要:
A patterning method with a filling material with a T-shaped cross section is used as a mask during patterning to produce structures having sublithographic dimensions, such as a double-fin field effect transistor.
摘要:
A vertical field-effect transistor having a semiconductor layer, in which a doped channel region is arranged along a depression. A “buried” terminal region leads as far as a surface of the semiconductor layer. The field-effect transistor also has a doped terminal region near an opening of the depression as well as the doped terminal region remote from the opening, a control region arranged in the depression, and an electrical insulating region between the control region and the channel region. The terminal region remote from the opening leads as far as a surface containing the opening or is electrically conductively connected to an electrically conductive connection leading to the surface. The control region is arranged in only one depression. The field-effect transistor is a drive transistor at a word line or at a bit line of a memory cell array.
摘要:
A field-effect transistor (FET) with local source-drain insulation is described. The FET includes a semiconductor substrate, source and drain depressions, a depression insulation layer, an electrically conductive filling layer, a gate dielectric, and a gate layer. The depression insulation layer is formed at least in bottom regions of the source and drain depressions. The electrically conductive filling layer realizes source and drain regions and fills the source and drain depressions at a surface of the depression insulation layer. The gate dielectric is formed at a substrate surface between the source and drain depressions. The gate layer (is formed at a surface of the gate dielectric. The source and drain depressions have, in an upper region, a widening with a predetermined death for realizing defined channel connection regions.
摘要:
A method for producing a field effect transistor, in which a plurality of layers are in each case deposited, planarized and etched back, in particular a gate electrode layer, is disclosed. This method allows the manufacturing of transistors having outstanding electrical properties and having outstanding reproducibility.