公开(公告)号：US07299991B2

公开(公告)日：2007-11-27

申请号：US10409544

申请日：2003-04-08

申请人： Kong Leong Teng ,  Kee Yean Ng ,  Hon-Choong Yip ,  Douglas W. Pocius

发明人： Kong Leong Teng ,  Kee Yean Ng ,  Hon-Choong Yip ,  Douglas W. Pocius

IPC分类号： G06K7/10 ,  G06K19/06

CPC分类号： G01D5/34707

摘要： Reflective members for use in encoder systems are provided. One embodiment comprises a reflective member comprising a reflective layer, at least another layer, and a reflective pattern comprising a first portion having a first reflective property and a second portion having a different reflective property. The reflective layer forms at least a part of the reflective pattern. In addition, the aforementioned first portion of the reflective member has a width of less than half of the grating period. The reflective member enables measurement of at least one operational attribute of an object.

摘要翻译： 提供了用于编码器系统的反射构件。 一个实施例包括反射构件，其包括反射层，至少另一层，以及包括具有第一反射性质的第一部分和具有不同反射性质的第二部分的反射图案。 反射层形成反射图案的至少一部分。 此外，反射构件的上述第一部分具有小于光栅周期的一半的宽度。 反射构件能够测量对象的至少一个操作属性。

公开(公告)号：US07279355B2

公开(公告)日：2007-10-09

申请号：US10608606

申请日：2003-06-27

申请人： Kong Weng Lee ,  Kee Yean Ng ,  Yew Cheong Kuan ,  Gin Ghee Tan ,  Cheng Why Tan

发明人： Kong Weng Lee ,  Kee Yean Ng ,  Yew Cheong Kuan ,  Gin Ghee Tan ,  Cheng Why Tan

IPC分类号： H01I21/00

CPC分类号： H01L24/97 ,  H01L23/3121 ,  H01L23/49827 ,  H01L23/49838 ,  H01L33/62 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2224/97 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2924/00012

摘要： A substantially planar substrate having opposed major surfaces is provided. The substrate includes a through hole that extends between the major surfaces. The through hole is filled with a conductive interconnecting element. A conductive mounting pad and a conductive connecting pad are formed on different ones of the major surfaces in electrical contact with the conductive interconnecting element. The packaging device formed by the method has a volume that is only a few times that of the semiconductor die and can be fabricated from materials that can withstand high-temperature die attach processes. The packaging device can be configured as the only packaging device used in the semiconductor device or as a submount for a semiconductor die that requires a high-temperature die attach process.

摘要翻译： 提供具有相对的主表面的基本平坦的基板。 基板包括在主表面之间延伸的通孔。 通孔填充有导电互连元件。 导电安装焊盘和导电连接焊盘形成在与导电互连元件电接触的不同主表面上。 通过该方法形成的包装装置的体积仅为半导体管芯的体积的几倍，并且可以由能够承受高温管芯附接工艺的材料制成。 包装装置可以被配置为在半导体器件中使用的唯一的包装装置或者需要高温管芯附接工艺的半导体管芯的基座。

公开(公告)号：US07261454B2

公开(公告)日：2007-08-28

申请号：US11234509

申请日：2005-09-23

申请人： Kee Yean Ng

发明人： Kee Yean Ng

IPC分类号： F21Y101/02

CPC分类号： G02B19/0066 ,  G02B19/0028 ,  G02B19/0061 ,  G02B19/0071 ,  G02F1/133603 ,  G02F1/133611

摘要： An omni-directional LED device is constructed such that light is prevented from exiting from the top of the LED device. In one embodiment, an opaque barrier is created and in some embodiments enhancement surfaces are created below the opaque barrier to increase lumen output from the device sides. In one embodiment, a reflecting structure is created to assist with horizontal light mixing. The horizontally mixed light is then redirected through a structure, such as an LED structure, to create a high lumen output, slender back-lighted display.

摘要翻译： 构造全向LED器件，使得防止光从LED器件的顶部离开。 在一个实施例中，产生不透明屏障，并且在一些实施例中，在不透光屏障下面创建增强表面以增加装置侧的流明输出。 在一个实施例中，产生反射结构以辅助水平光混合。 水平混合的光然后通过诸如LED结构的结构重新定向，以产生高流明输出，细长的背光显示。

公开(公告)号：US07256486B2

公开(公告)日：2007-08-14

申请号：US10608605

申请日：2003-06-27

申请人： Kong Weng Lee ,  Kee Yean Ng ,  Yew Cheong Kuan ,  Gin Ghee Tan ,  Cheng Why Tan

发明人： Kong Weng Lee ,  Kee Yean Ng ,  Yew Cheong Kuan ,  Gin Ghee Tan ,  Cheng Why Tan

IPC分类号： H01L29/22

CPC分类号： H01L24/97 ,  H01L23/49844 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/05599 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2224/73265 ,  H01L2224/85399 ,  H01L2224/85444 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/04953 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

摘要： The packaging device includes a substrate, a mounting pad, a connecting pad and an interconnecting element. The substrate is substantially planar and has opposed major surfaces. The mounting pad is conductive and is located on one of the major surfaces. The connecting pad is conductive and is located on the other of the major surfaces. The conductive interconnecting element extends through the substrate and electrically interconnects the mounting pad and the connecting pad. The packaging device has a volume that is only a few times that of the semiconductor die and can be fabricated from materials that can withstand high-temperature die attach processes. The packaging device can be configured as the only packaging device used in the semiconductor device or as a submount for a semiconductor die that requires a high-temperature die attach process.

摘要翻译： 包装装置包括基板，安装垫，连接垫和互连元件。 基板基本上是平面的并且具有相对的主表面。 安装垫是导电的并且位于主要表面中的一个上。 连接垫是导电的并且位于另一个主表面上。 导电互连元件延伸穿过基板并将安装焊盘和连接焊盘电互连。 包装装置的体积仅为半导体管芯的体积的几倍，并且可以由能够承受高温管芯附着工艺的材料制成。 包装装置可以被配置为在半导体器件中使用的唯一的包装装置或者需要高温管芯附接工艺的半导体管芯的基座。

公开(公告)号：US07230222B2

公开(公告)日：2007-06-12

申请号：US11205580

申请日：2005-08-15

申请人： Heng Yow Cheng ,  Kee Yean Ng ,  Joon Chok Lee

发明人： Heng Yow Cheng ,  Kee Yean Ng ,  Joon Chok Lee

IPC分类号： G01J1/32 ,  H01L27/15 ,  H01L29/20

CPC分类号： H05B33/0869 ,  H01L25/167 ,  H01L2924/0002 ,  H05B33/0821 ,  H05B33/0866 ,  H01L2924/00

摘要： A light source and method for making the same are disclosed. The light source includes a plurality of LEDs mounted on a substrate and a sensor for measuring light from the LEDs. Each LED emits light having a different spectrum from the other LEDs, the average intensity of light from that LED being determined by a drive signal coupled to that LED. The sensor generates a plurality of signals, each signal being characterized by a sensor value that is proportional to the intensity of light emitted by a corresponding one of the LEDs. A controller generates the drive signals and stores a current target value for each LED. The drive signals for each of the LEDs is generated such that the sensor value for that LED matches the stored current target value for that LED.

摘要翻译： 公开了一种光源及其制造方法。 光源包括安装在基板上的多个LED和用于测量来自LED的光的传感器。 每个LED发射与其他LED具有不同光谱的光，来自该LED的光的平均强度由耦合到该LED的驱动信号确定。 传感器产生多个信号，每个信号的特征在于与相应的一个LED发射的光的强度成比例的传感器值。 控制器产生驱动信号并存储每个LED的当前目标值。 生成每个LED的驱动信号，使得该LED的传感器值与该LED的存储的当前目标值匹配。

公开(公告)号：US07220017B2

公开(公告)日：2007-05-22

申请号：US11086138

申请日：2005-03-22

申请人： Joon Chok Lee ,  Kevin Len-Li Lim ,  Jaffar Rizal ,  Kee Yean Ng

发明人： Joon Chok Lee ,  Kevin Len-Li Lim ,  Jaffar Rizal ,  Kee Yean Ng

IPC分类号： F21Y101/02

CPC分类号： H05B33/0869 ,  H05B33/086

摘要： A light source that generates light that is perceived to have a predetermined color is disclosed. The light source includes first and second red LEDs and a non-red light emitter. The first and second red LEDs emit light in the red portion of the spectrum but at different wavelengths. The non-red light emitter emits light at a wavelength in a non-red portion of the spectrum. A controller varies the intensity of the first and second red LEDs to provide a combined light signal that is perceived as having the predetermined color. In one embodiment, the non-red light emitter includes a fluorescent light, and the controller adjusts the intensities of the red LEDs to provide a source that is perceived as an incandescent source of a predetermined color temperature.

摘要翻译： 公开了产生感知为具有预定颜色的光的光源。 光源包括第一和第二红色LED和非红色光发射器。 第一和第二红色LED在光谱的红色部分发射不同波长的光。 非红色发光体在光谱的非红色部分发射波长的光。 控制器改变第一和第二红色LED的强度，以提供被感知为具有预定颜色的组合光信号。 在一个实施例中，非红色光发射器包括荧光，并且控制器调节红色LED的强度以提供被感知为预定色温的白炽源的光源。

公开(公告)号：US07009343B2

公开(公告)日：2006-03-07

申请号：US10798010

申请日：2004-03-11

申请人： Kevin Len Li Lim ,  Joon Chok Lee ,  Kee Yean Ng

发明人： Kevin Len Li Lim ,  Joon Chok Lee ,  Kee Yean Ng

IPC分类号： H05B37/02

CPC分类号： H05B33/0869 ,  G02F2001/133614 ,  G02F2001/133624 ,  G09G3/3413 ,  G09G3/3426 ,  G09G2320/0242 ,  G09G2320/0666 ,  G09G2360/145 ,  H05B33/086

摘要： A system and method for generating white light involves using a combination of white, red, green, and blue LEDs to produce white light and adjusting the emitted light in response to feedback signals. A light system has a light source that includes at least one white LED and multiple color LEDs and a spectral feedback control system configured to detect light that is output from the light source and to adjust the light that is output from the light source in response to the light detection. The spectral feedback control system may include a color sensor configured to provide color-specific feedback signals, a controller configured to generate color-specific control signals in response to the color-specific feedback signals, and a driver configured to generate color-specific drive signals in response to the color-specific control signals.

摘要翻译： 用于产生白光的系统和方法涉及使用白色，红色，绿色和蓝色LED的组合来产生白光并响应于反馈信号调节发射的光。 光系统具有光源，其包括至少一个白色LED和多个彩色LED以及光谱反馈控制系统，其被配置为检测从光源输出的光并响应于光源调节从光源输出的光 光检测。 光谱反馈控制系统可以包括被配置为提供颜色特定反馈信号的颜色传感器，被配置为响应于颜色特定反馈信号而生成颜色特定控制信号的控制器以及被配置为产生颜色特定驱动信号的驱动器 响应颜色特定的控制信号。

公开(公告)号：US09887338B2

公开(公告)日：2018-02-06

申请号：US12510821

申请日：2009-07-28

申请人： Kee Yean Ng ,  Siang Ling Oon ,  Chin Nyap Tan

发明人： Kee Yean Ng ,  Siang Ling Oon ,  Chin Nyap Tan

IPC分类号： H01L33/64

CPC分类号： H01L33/642 ,  H01L2224/48091 ,  H01L2924/00014

摘要： An electronic assembly includes a Light Emitting Diode (LED) and a substrate. The LED has a solderable surface other than the contacts. The substrate has an opening. The solderable surface is mounted substantially over the opening. When the opening is filled with solder, the solderable surface is metallically bonded with the solder in the opening.

公开(公告)号：US09159886B2

公开(公告)日：2015-10-13

申请号：US13089698

申请日：2011-04-19

申请人： Kee Yean Ng ,  Bit Tie Chan

发明人： Kee Yean Ng ,  Bit Tie Chan

IPC分类号： H01L33/50 ,  H01L25/075

CPC分类号： H01L33/504 ,  H01L25/0753 ,  H01L33/505 ,  H01L33/507 ,  H01L33/508 ,  H01L2924/0002 ,  H01L2924/00

摘要： A lighting apparatus having wavelength-converting materials formed in a carrier layer is disclosed. In one embodiment, the lighting apparatus has a light source attached to a substrate that is assembled in a housing. The light source is configured to emit a substantially narrow band light that is transformed into broad-spectrum white light by the wavelength-converting materials positioned on the carrier layer. The wavelength-converting materials and the carrier layer are distanced away from the light source, such that the carrier layer is thermally isolated from the light source.

摘要翻译： 公开了一种在载体层中形成波长转换材料的照明装置。 在一个实施例中，照明装置具有附接到组装在壳体中的基板的光源。 光源被配置为发射通过位于载体层上的波长转换材料转变成广谱白光的基本上窄的带状光。 波长转换材料和载体层远离光源远离，使得载体层与光源热隔离。

公开(公告)号：US20110147788A1

公开(公告)日：2011-06-23

申请号：US13036829

申请日：2011-02-28

申请人： Kong Weng Lee ,  Kee Yean Ng ,  Yew Cheong Kuan ,  Cheng Why Tan ,  Gin Ghee Tan

发明人： Kong Weng Lee ,  Kee Yean Ng ,  Yew Cheong Kuan ,  Cheng Why Tan ,  Gin Ghee Tan

IPC分类号： H01L33/62

CPC分类号： H01L33/486 ,  H01L23/49844 ,  H01L33/62 ,  H01L2224/48227 ,  H01L2924/01322

摘要： A semiconductor device includes a light emitting semiconductor die mounted on at least one of first and second electrically conductive bonding pads, which are located on a first major surface of a substrate of the device. The light emitting semiconductor die has an anode and a cathode, which are electrically connected to the first and second electrically conductive bonding pads. The semiconductor device further includes first and second electrically conductive connecting pads, which are located on a second major surface of the substrate. The first and second electrically conductive bonding pads are electrically connected to the first and second electrically conductive connecting pads via first and second electrically conductive edge interconnecting elements.

摘要翻译： 半导体器件包括安装在位于器件的衬底的第一主表面上的第一和第二导电焊盘中的至少一个的发光半导体管芯。 发光半导体管芯具有与第一和第二导电接合焊盘电连接的阳极和阴极。 半导体器件还包括位于衬底的第二主表面上的第一和第二导电连接焊盘。 第一和第二导电接合焊盘通过第一和第二导电边缘互连元件电连接到第一和第二导电连接焊盘。