摘要:
In order to attain an object to realize an ion beam capable of (i) immediately determining energy of the ion beam to be generated, and (ii) measuring an ion beam in real time while carrying out laser irradiation, an ion beam detector (1) of the present invention includes a light conversion section (7) transmitting X-rays mixed in with ions (3) and converting the ions (3) to light; a light detection section (9) detecting, as an electric signal, the light converted from the ions (3) by the light converting section (7); a time-of-flight measurement section (10) measuring a time of flight for the ions (3) to reach the light conversion section (7); an electron removal section (5) removing electrons mixed in with the ions (3) and a light shielding section (6) shielding light mixed in with the ions (3), each of which is provided in an upstream of the light conversion section from which the ion beam comes to the light conversion section; and a curved section (8) between the light conversion section (7) and the light detection section (9), curved with respect to an optical axis of the ions (3) incident on the light conversion section (7).
摘要:
A plate member includes a frame portion (51) provided in a state of coupling both one end portion and other end portion and mounting terminal portions (44) protruding from the one end portion and the other end portion of said frame portion (51) to approach each other, from which a PCB joint portions (46) to be a mounting portion to a PCB are formed by cutting and bending when manufacturing a magnetic element. Further, a winding number adjustment means (41), which is capable of selecting joint portions with ends of a coil and adjusting the winding number of the coil in accordance with the selection, protrudes from the one end portion and the other end portion to approach each other farther as compared to the mounting terminal portions (44).
摘要:
Provided is a holographic recording composition comprising an imine compound having a pKa of 11 or more in water at 25° C., and, an acidic compound having a pKa of below 11 in water at 25° C. Preferably, the imine compound having a pKa of 11 or more in water at 25° C. is expressed by General Formula (1) below: in the General Formula (1), R1, R2 and R3, which may be identical or different each other, each represents an alkyl group, an aryl group, an amino group or an acyl group; the alkyl group, the aryl group, the amino group or the acyl group may further have a substituent.
摘要翻译:本发明提供一种全息记录组合物,其包含在25℃下在水中pKa为11以上的亚胺化合物和在25℃下在水中pKa低于11的酸性化合物。优选地,具有 在25℃的水中的11K以上的pKa由下述通式(1)表示:在通式(1)中,R 1,R 2,和 R 3可以相同或不同,各自表示烷基,芳基,氨基或酰基; 烷基,芳基,氨基或酰基可以进一步具有取代基。
摘要:
A method for forming a semiconductor device having a polymetal gate electrode includes the steps of forming a gate oxide film on a silicon substrate, forming a polysilicon film and a tungsten film on the gate oxide film, patterning the polysilicon film and tungsten film, and thermally oxidizing the polysilicon film in an oxidizing atmosphere including water and hydrogen at a substrate-surface temperature of 850 degrees C. and a water content of 7% to 20%.
摘要:
In a semiconductor device of a polysilicon gate electrode structure having three or more different Fermi levels, a P type polysilicon having a lowest Fermi level is disposed on a first N type surface channel MOS transistor. A first N type polysilicon having a highest Fermi level is disposed on a second N type surface channel MOS transistor. A second N type polysilicon having an intermediate Fermi level between the highest and the lowest Fermi levels and doped with both an N type impurity and a P type impurity is disposed on a P channel MOS transistor.
摘要:
A method for forming a deposition film from an aqueous solution by electrochemical reaction includes the steps of: forming the targeted deposition film under primary deposition conditions; replacing at least part of members in contact with the solution or removing deposit on surfaces of the members; and depositing a film under secondary deposition conditions. These steps are performed in that order. Then, the deposition film is formed again under the primary deposition conditions. In the method, the resulting deposition film exhibits desired characteristics even after maintenance of the deposition apparatus.
摘要:
The semiconductor device is formed according to the following steps. A TiN film 71 and a W film 72 are deposited on a silicon oxide film 64 including the inside of a via-hole 66 by the CVD method and thereafter, the W film 72 and TiN film 71 on the silicon oxide film 64 are etched back to leave only the inside of the via-hole 66 and form a plug 73. Then, a TiN film 74, Al-alloy film 75, and Ti film 76 are deposited on the silicon oxide film 64 including the surface of the plug 73 by the sputtering method and thereafter, the Ti film 76, Al-alloy film 75, and TiN film 74 are patterned to form second-layer wirings 77 and 78.
摘要:
A DRAM of an open bit line structure has a cell area smaller than that of a DRAM of a folded bit line structure and is susceptible to noise. A conventional DRAM of an open bit line structure has a large bit line capacitance and is susceptible to noise or has a large cell area. There has been no DRAM of an open bit line structure having a small bit line capacitance, unsusceptible to noise and having a small cell area. The present invention forms capacitor lower electrode plug holes not aligned with bit lines to reduce bit line capacitance. Bit lines are formed in a small width, capacitor lower electrode plugs are dislocated from positions corresponding to the centers of the bit lines in directions away from the bit lines and the contacts are formed in a reduced diameter to avoid increasing the cell area. Thus a semiconductor storage device of an open bit line structure resistant to noise and having a small cell area is provided.
摘要:
In a peripheral circuit region of a DRAM, two connection holes 17a, 17b for connecting a first layer line 14 and a second layer line 26 electrically are opened separately in two processes. After forming the connection holes 17a and 17b, plugs 18a and 215a are formed in the connection holes 17a and 17b, respectively.
摘要:
A retaining substrate for mounting a semiconductor element thereon, having a circuit pattern for said semiconductor element, characterized in that said substrate comprises an insulative material, said substrate has a surface configuration having a cross section comprising (a) an uneven shaped portion and (b) a concave shaped portion which are arranged in tandem wherein a surface of said uneven shaped portion (a) makes a bottom face of said concave portion (b), and said uneven shaped portion (a) has a structure in that (a-i) an insulative convex shaped portion and (a-ii) an insulative concave shaped portion are alternately arranged so as to neighbor with each other, and said circuit pattern is provided in said concave shaped portion (a-ii) of said uneven shaped portion (a).