Abstract:
Some embodiments include integrated devices, such as memory cells. The devices may include chalcogenide material, an electrically conductive material over the chalcogenide material, and a thermal sink between the electrically conductive material and the chalcogenide material. The thermal sink may be of a composition that includes an element in common with the electrically conductive material and includes an element in common with the chalcogenide material. Some embodiments include a method of forming a memory cell. Chalcogenide material may be formed over heater material. Electrically conductive material may be formed over the chalcogenide material. A thermal sink may be formed between the electrically conductive material and the chalcogenide material. The thermal sink may be of a composition that includes an element in common with the electrically conductive material and includes an element in common with the chalcogenide material.
Abstract:
Some embodiments include integrated devices, such as memory cells. The devices may include chalcogenide material, an electrically conductive material over the chalcogenide material, and a thermal sink between the electrically conductive material and the chalcogenide material. The thermal sink may be of a composition that includes an element in common with the electrically conductive material and includes an element in common with the chalcogenide material. Some embodiments include a method of forming a memory cell. Chalcogenide material may be formed over heater material. Electrically conductive material may be formed over the chalcogenide material. A thermal sink may be formed between the electrically conductive material and the chalcogenide material. The thermal sink may be of a composition that includes an element in common with the electrically conductive material and includes an element in common with the chalcogenide material.
Abstract:
Some embodiments include an assembly having a stack of alternating dielectric levels and conductive levels. Channel material pillars extend through the stack. Some of the channel material pillars are associated with a first sub-block, and others of the channel material pillars are associated with a second sub-block. Memory cells are along the channel material pillars. An insulative level is over the stack. A select gate configuration is over the insulative level. The select gate configuration includes a first conductive gate structure associated with the first sub-block, and includes a second conductive gate structure associated with the second sub-block. The first and second conductive gate structures are laterally spaced from one another by an intervening insulative region. The first and second conductive gate structures have vertically-spaced conductive regions, and have vertically-extending conductive structures which electrically couple the vertically-spaced conductive regions to one another. Some embodiments include methods of forming assemblies.
Abstract:
A memory system may implement a read operation including a delay if a channel is at stable state, and may implement a read operation without a delay if the channel is in a transient state. Upon receiving a read command to a set of memory cells sharing the channel, the memory system may determine whether the channel is in a stable or transient state. If the channel is in a stable state, the memory system may perform a read operation including a delay between boosting the channel and driving respective word lines, such that the channel partially discharges prior to driving the word lines. If the channel is in a transient state, the memory system may perform a read operation without a delay between boosting the channel and driving the word lines.
Abstract:
A system includes a memory device including multiple memory cells and a processing device operatively coupled to the memory device. The processing device is to receive a first read command at a first time. The processing device is further to receive a second read command at a second time. The processing device is further to determine that the first read command and the second read command are directed to an at least partially same set of memory cells of the plurality of memory cells. The processing device is further to perform a media management operation with respect to the at least partially same set of memory cells.
Abstract:
Methods of operating a memory, and apparatus configured to perform similar methods, include determining a voltage level of a stepped sense operation that activates a memory cell of the memory during a programming operation for the memory cell, and determining a voltage level of a ramped sense operation that activates the memory cell during a read operation for the memory cell.
Abstract:
A memory device comprises an array of memory cells organized into a plurality of wordlines, and a processing device to perform processing operations that receive a program command specifying a memory unit and data comprising first received data, where the plurality of wordlines includes one or more first active data wordlines and a group of consecutive retired wordlines. The processing operations also program the specified data to the memory unit by programming the first received data to the one or more first active data wordlines, identifying a first retired boundary wordline that is in the group of consecutive retired wordlines and is adjacent to one of the first active data wordlines, generating a first data pattern comprising a first plurality of threshold voltage levels, and programming the first data pattern to the first retired boundary wordline.
Abstract:
Control logic in a memory device executes a first operation comprising a first set of programming pulses and a first set of program verify operations on a first portion of a first subset of memory cells to be programmed to identify a first start voltage level. A second set of programming pulses including at least one programming pulse having the first start voltage level is caused to be applied to program a second portion of the first subset of memory cells. A second operation including a third set of programming pulses and a second set of program verify operations are executed on a first portion of the second subset of memory cells to identify a second start voltage level.
Abstract:
Control logic in a memory device executes a first operation comprising a first set of programming pulses and a first set of program verify operations on a first portion of a first subset of memory cells to be programmed to identify a first start voltage level. A second set of programming pulses including at least one programming pulse having the first start voltage level is caused to be applied to program a second portion of the first subset of memory cells. A second operation including a third set of programming pulses and a second set of program verify operations are executed on a first portion of the second subset of memory cells to identify a second start voltage level.
Abstract:
Devices and techniques for adjustable memory device write performance are described herein. An accelerated write request can be received at a memory device from a controller of the memory device. The memory device can identify that a target block for external writes is opened as a multi-level cell block. The memory device can then write data for the accelerated write request to the target block using a single-level cell encoding.