SECONDARY BATTERY SYSTEM
    51.
    发明申请
    SECONDARY BATTERY SYSTEM 有权
    二次电池系统

    公开(公告)号:US20110234162A1

    公开(公告)日:2011-09-29

    申请号:US13131917

    申请日:2009-12-15

    IPC分类号: H02J7/04

    摘要: A secondary battery system that is light in weight and low in cost is provided, which comprises a plurality of secondary batteries connected in series. A plurality of first diodes each has an anode connected to a negative electrode of the corresponding secondary battery. A plurality of second diodes each has a cathode connected to a positive electrode of the corresponding secondary battery. A plurality of capacitors is each connected to a junction portion between the cathode of the first diode and the anode of the second diode. An alternating current power source is commonly connected to the junction portions through the capacitors.

    摘要翻译: 提供重量轻且成本低的二次电池系统,其包括串联连接的多个二次电池。 多个第一二极管各自具有连接到相应的二次电池的负极的阳极。 多个第二二极管各自具有连接到相应的二次电池的正极的阴极。 多个电容器各自连接到第一二极管的阴极和第二二极管的阳极之间的接合部分。 交流电源通常通过电容器连接到接合部分。

    Semiconductor device and method of manufacturing the same
    52.
    发明授权
    Semiconductor device and method of manufacturing the same 有权
    半导体装置及其制造方法

    公开(公告)号:US07768035B2

    公开(公告)日:2010-08-03

    申请号:US12066145

    申请日:2006-08-02

    IPC分类号: H01L31/0328

    摘要: A semiconductor device has a semiconductor base of a first conductivity type; a hetero semiconductor region in contact with the semiconductor base; a gate electrode adjacent to a portion of a junction between the hetero semiconductor region and the semiconductor base across a gate insulating film; a source electrode connected to the hetero semiconductor region; and a drain electrode connected to the semiconductor base. The hetero semiconductor region has a band gap different from that of the semiconductor base. The hetero semiconductor region includes a first hetero semiconductor region and a second hetero semiconductor region. The first hetero semiconductor region is formed before the gate insulating film is formed. The second hetero semiconductor region is formed after the gate insulating film is formed.

    摘要翻译: 半导体器件具有第一导电类型的半导体基底; 与半导体基底接触的异质半导体区域; 与栅极绝缘膜相邻的异质半导体区域和半导体基底之间的结的部分相邻的栅电极; 连接到所述异质半导体区的源电极; 以及连接到半导体基底的漏电极。 异质半导体区域具有与半导体基底不同的带隙。 异质半导体区域包括第一异质半导体区域和第二异质半导体区域。 在形成栅极绝缘膜之前形成第一异质半导体区域。 在形成栅极绝缘膜之后形成第二异质半导体区域。

    Semiconductor device manufacturing method
    53.
    发明授权
    Semiconductor device manufacturing method 有权
    半导体器件制造方法

    公开(公告)号:US07749845B2

    公开(公告)日:2010-07-06

    申请号:US11988944

    申请日:2006-06-26

    IPC分类号: H01L21/336

    摘要: A method of manufacturing a semiconductor device having a polycrystalline silicon layer (5) includes; a step of forming a mask layer (7) on the polycrystalline silicon layer (5); a step of forming a side wall (8) that is provided on a side face of the mask layer (7) and covers part of the polycrystalline silicon layer (6); a step of doping an impurity (52) into the polycrystalline silicon layer (5) by using at least one of the mask layer (7) and the side wall (8) as a mask; and a step of etching the polycrystalline silicon layer (5, 6) by using at least one of the mask layer (7) and the side wall (8) as a mask.

    摘要翻译: 一种制造具有多晶硅层(5)的半导体器件的方法包括: 在多晶硅层(5)上形成掩模层(7)的步骤; 形成设置在掩模层(7)的侧面并覆盖多晶硅层(6)的一部分的侧壁(8)的步骤; 通过使用掩模层(7)和侧壁(8)中的至少一个作为掩模将杂质(52)掺杂到多晶硅层(5)中的步骤; 以及通过使用掩模层(7)和侧壁(8)中的至少一个作为掩模来蚀刻多晶硅层(5,6)的步骤。

    Semiconductor device and method of manufacturing the same
    54.
    发明授权
    Semiconductor device and method of manufacturing the same 有权
    半导体装置及其制造方法

    公开(公告)号:US07521731B2

    公开(公告)日:2009-04-21

    申请号:US11444433

    申请日:2006-06-01

    IPC分类号: H01L31/0328

    摘要: A semiconductor device of the invention includes a first conductive type semiconductor base substrate; and a switching mechanism which is formed on a first main surface of the semiconductor base substrate and switches ON/OFF of a current. In the semiconductor base substrate, a plurality of columnar hetero-semiconductor regions are formed at spaced intervals within the semiconductor substrate, and the hetero-semiconductor regions are made of a semiconductor material having a different band gap from the semiconductor substrate and extend between the first main surface and a second main surface opposite to the first main surface.

    摘要翻译: 本发明的半导体器件包括:第一导电型半导体基底; 以及切换机构,其形成在所述半导体基板的第一主面上并切换电流的开/关。 在半导体基板中,多个柱状异质半导体区域在半导体衬底内隔开间隔地形成,并且异质半导体区域由与半导体衬底具有不同带隙的半导体材料制成,并且在第一 主表面和与第一主表面相对的第二主表面。

    Stacked semiconductor module and assembling method of the same
    58.
    发明授权
    Stacked semiconductor module and assembling method of the same 有权
    堆叠半导体模块及其组装方法相同

    公开(公告)号:US07042086B2

    公开(公告)日:2006-05-09

    申请号:US10678208

    申请日:2003-10-06

    IPC分类号: H01L23/34

    摘要: A stacked semiconductor module encompasses (a) a upper switching element having a first semiconductor chip, a first top electrode disposed at a top surface of the first semiconductor chip, a first bottom electrode disposed at a bottom surface of the first semiconductor chip, and a first control electrode configured to control conduction between the first top and first bottom electrodes; (b) a first wiring plate disposed beneath the upper switching element, electrically connected to the first bottom electrode; and (c) a lower switching element disposed beneath the wiring plate, having a second semiconductor chip, a second top electrode disposed at a top surface of the second semiconductor chip, electrically connected to the first wiring plate, a second bottom electrode disposed at a bottom surface of the second semiconductor chip, and a second control electrode configured to control conduction between the second top and second bottom electrodes.

    摘要翻译: 叠层半导体模块包括(a)具有第一半导体芯片的上开关元件,设置在第一半导体芯片的顶表面的第一顶电极,设置在第一半导体芯片的底表面处的第一底电极,以及 第一控制电极,被配置为控制第一顶部电极和第一底部电极之间的导通; (b)设置在所述上​​开关元件下方的电连接到所述第一底电极的第一布线板; 以及(c)设置在所述布线板下方的下开关元件,具有第二半导体芯片,设置在所述第二半导体芯片的顶表面处的第二上电极,电连接到所述第一布线板, 第二半导体芯片的底面以及第二控制电极,被配置为控制第二顶电极和第二底电极之间的导通。