公开(公告)号：US20190150271A1

公开(公告)日：2019-05-16

申请号：US16184571

申请日：2018-11-08

Applicant: RAYTHEON COMPANY

Inventor： Semira M. Azadzoi ,  James E. Benedict ,  John P. Haven ,  Thomas V. Sikina ,  Andrew R. Southworth

IPC: H05K1/02 ,  H01P3/08 ,  H01P11/00 ,  H05K1/11 ,  H05K3/00 ,  H05K3/10 ,  H05K3/40 ,  H05K3/46

CPC classification number: H05K1/0218 ,  H01P3/08 ,  H01P11/003 ,  H05K1/0219 ,  H05K1/0221 ,  H05K1/0251 ,  H05K1/112 ,  H05K3/0044 ,  H05K3/107 ,  H05K3/4007 ,  H05K3/4038 ,  H05K3/4611 ,  H05K2201/0707 ,  H05K2201/09036 ,  H05K2201/09545 ,  H05K2203/0228

Abstract: A radio frequency circuit includes at least one dielectric substrate, a trench formed in the dielectric substrate, and an electrically continuous conductive material in the trench. The radio frequency circuit further may include a first dielectric substrate, a second dielectric substrate, with the trench being formed in the first and second dielectric substrates. A method of fabricating an electromagnetic circuit includes providing at least one dielectric substrate, machining a trench in the at least one dielectric substrate, and filling the trench with an electrically conductive material to form an electrically continuous conductor.

公开(公告)号：US20190148832A1

公开(公告)日：2019-05-16

申请号：US16180822

申请日：2018-11-05

Applicant: RAYTHEON COMPANY

Inventor： Peter J. Adams ,  Thomas V. Sikina ,  John P. Haven ,  James E. Benedict

IPC: H01Q9/27 ,  H01Q1/38

Abstract: The concepts, systems, circuits and techniques described herein are directed toward a spiral antenna which may be provided using additive manufacturing technology so as to provide an antenna capable of operation at frequencies which are higher than spiral antennas manufactured using standard photo-etch or printed circuit board (PCB) manufacturing processes.

公开(公告)号：US09974160B1

公开(公告)日：2018-05-15

申请号：US15392142

申请日：2016-12-28

Applicant: Raytheon Company

Inventor： Thomas V. Sikina ,  Mary K. Herndon ,  John P. Haven ,  Alkim Akyurtlu

IPC: H01P3/08 ,  H05K1/02 ,  H05K1/11 ,  H05K3/46 ,  H05K3/40

CPC classification number: H05K1/0237 ,  H01P3/08 ,  H01P3/085 ,  H01P5/028 ,  H05K1/11 ,  H05K3/40 ,  H05K3/403 ,  H05K3/46 ,  H05K2201/0919

Abstract: Systems and methods described herein are provided for electrically coupling conductors within a multilayered printed circuit board (PCB) using an interconnect formed along an outer surface of one or more stripline boards making up the multilayered PCB. The multilayered PCB may include first and second stripline boards each having multiple dielectric layers. A first conductor may be formed in the first stripline between the multiple dielectric layers and a second conductor may be formed in the second stripline between the multiple dielectric layers. The interconnect may be formed over an outer surface the dielectric layers such that the interconnect extends from the first conductor to the second conductor. An electrically conductive wall may be formed over the edge or side portion of the dielectric layers to form a cavity that encloses the interconnect and the outer surface of the multilayered PCB.

公开(公告)号：US20240305011A1

公开(公告)日：2024-09-12

申请号：US18668328

申请日：2024-05-20

Applicant: Raytheon Company

Inventor： Thomas V. Sikina ,  Channing P. Favreau ,  Erika Klek

IPC: H01Q21/00 ,  H01Q21/24 ,  H05K1/02

CPC classification number: H01Q21/0025 ,  H01Q21/24 ,  H05K1/0243 ,  H05K2201/10098

Abstract: A dual-polarized PCB array antenna includes one or more PCBs and a radiating antenna array. Each PCB has a PCB mounting surface that extends from a first PCB end to an opposing second PCB end. The radiating antenna array includes one or more radiator substrates. Each radiator substrate has a patch mounting surface that extends from a first substrate end to an opposing second substrate end. The dual-polarized PCB array antenna further includes one or more orthogonal interfaces configured to arrange the patch mounting surface of a given radiator substrates in an orthogonal position with respect to the PCB mounting surface of a given PCB.

公开(公告)号：US20230231371A1

公开(公告)日：2023-07-20

申请号：US17658344

申请日：2022-04-07

Applicant: Raytheon Company

Inventor： Channing P. Favreau ,  Alexander Gilbert ,  Thomas V. Sikina

IPC: H02G15/10 ,  H05K5/02

CPC classification number: H02G15/10 ,  H05K5/0247

Abstract: Methods and apparatus for a housing assembly including a housing comprising a conductive material, a conductor extending through the housing, and a dielectric material at least partially surrounding the conductor. Portions of the housing may surround the conductor such that the conductor, the dielectric, and the portions of the housing form a channel through the housing.

公开(公告)号：US11470725B2

公开(公告)日：2022-10-11

申请号：US17395977

申请日：2021-08-06

Applicant: RAYTHEON COMPANY

Inventor： Mikhail Pevzner ,  James E. Benedict ,  Andrew R. Southworth ,  Thomas V. Sikina ,  Kevin Wilder ,  Matthew Souza ,  Aaron Michael Torberg

IPC: H05K3/10 ,  B21F11/00

Abstract: An apparatus for automating the fabrication of a copper vertical launch (CVL) within a printed circuit board (PCB) includes a feed mechanism to feed and extrude copper wire from a spool of copper wire and a wire cutting and gripping mechanism to receive copper wire from the feed mechanism, cut and secure a segment of copper wire, insert the segment of copper wire into a hole formed within the PCB, solder an end of the segment of copper wire to a signal trace of the PCB, and flush cut an opposite end of the segment of the copper wire to a surface of the PCB. The wire cutting and gripping mechanism includes a wire cutter to flush cut the segment of copper wire and an integrated heated gripper device to receive the copper wire from the spool of copper wire and cut and grab a segment from copper wire.

公开(公告)号：US11444365B2

公开(公告)日：2022-09-13

申请号：US16822399

申请日：2020-03-18

Applicant: RAYTHEON COMPANY

Inventor： James Benedict ,  Erika Klek ,  John P. Haven ,  Michael Souliotis ,  Thomas V. Sikina ,  Andrew R. Southworth ,  Kevin Wilder

IPC: H01P5/08 ,  H01P3/08

Abstract: A RAMP-radio frequency (RAMP-RF) assembly is provided and includes an RF panel including a microstrip interface, a plate including a stripline interface and a microstrip-to-stripline transition element operably connectable to the microstrip interface and to the stripline interface.

公开(公告)号：US11432408B2

公开(公告)日：2022-08-30

申请号：US16414112

申请日：2019-05-16

Applicant: RAYTHEON COMPANY

Inventor： Thomas V. Sikina ,  John P. Haven ,  Peter J. Adams ,  James E. Benedict ,  Carolyn R. Reistad

IPC: H05K1/02 ,  H05K3/40 ,  H05K1/09 ,  H05K3/22 ,  B33Y10/00 ,  B33Y80/00

Abstract: A reactive beamformer includes a radiator disposed within a substrate and configured to radiate a received electromagnetic signal, a plurality of receptors disposed within the substrate, each of the plurality of receptors configured to receive a portion of the radiated electromagnetic signal, and a plurality of signal lines. Each signal line of the plurality of signal lines is coupled to a respective receptor of the plurality of receptors to convey the portion of the radiated electromagnetic signal from the respective receptor and to provide the portion of the radiated electromagnetic signal to an output.

公开(公告)号：US20220264745A1

公开(公告)日：2022-08-18

申请号：US17174904

申请日：2021-02-12

Applicant: RAYTHEON COMPANY

Inventor： Channing Paige Favreau ,  James E. Benedict ,  Mikhail Pevzner ,  Thomas V. Sikina

IPC: H05K1/11 ,  H05K3/46 ,  H05K3/32 ,  H05K1/02

Abstract: A method of fabricating a printed circuit assembly includes providing a flexible-hybrid circuit having a base and at least one side panel. The at least one side panel is hingedly connected to the base. The method further includes disposing a support structure on the flexible-hybrid circuit. The support structure includes a base, which is disposed on the base of the flexible-hybrid circuit, and at least one side that corresponds to the at least one side panel of the flexible-hybrid circuit. The method further includes folding the at least one side panel of the flexible-hybrid circuit so that the at least one side panel is disposed co-planar with the at least one side of the support structure to create a printed circuit assembly.

公开(公告)号：US11336032B2

公开(公告)日：2022-05-17

申请号：US16874790

申请日：2020-05-15

Applicant: Raytheon Company

Inventor： Thomas V. Sikina ,  John P. Haven ,  Channing P. Favreau

IPC: H01Q1/22 ,  H01Q23/00 ,  H01L23/66 ,  H01Q1/48 ,  H01Q9/04

Abstract: Methods and apparatus for providing a radiator having an antenna comprising a patch antenna layer and a first ground plane layer, wherein the antenna has a reactive field region of the radiator between the patch antenna layer and the first ground plane layer, and an integrated circuit located in the active region.