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公开(公告)号：US07784673B2
公开(公告)日：2010-08-31
申请号：US12189388
申请日：2008-08-11
CPC分类号： B23K3/0638 , B23K35/02 , B23K2101/40 , H01L2224/11
摘要： A system and method for injection molding conductive bonding material into a plurality of cavities in a non-rectangular mold is disclosed. The method comprises aligning a fill head with a non-rectangular mold. The non-rectangular mold includes a plurality of cavities. The fill head is placed in substantial contact with the non-rectangular mold. Rotational motion is provided to at least one of the non-rectangular mold and the fill head while the fill head is in substantial contact with the non-rectangular mold. Conductive bonding material is forced out of the fill head toward the non-rectangular mold. The conductive bonding material is provided into at least one cavity of the plurality of cavities contemporaneous with the at least one cavity being in proximity to the fill head.
摘要翻译： 公开了一种用于将导电接合材料注射成非矩形模具中的多个空腔的系统和方法。 该方法包括将填充头与非矩形模具对准。 非矩形模具包括多个空腔。 填充头被放置成与非矩形模具基本接触。 旋转运动提供给非矩形模具和填充头中的至少一个，同时填充头基本上与非矩形模具接触。 将导电接合材料从填充头推向非矩形模具。 导电接合材料被提供到与填充头附近的至少一个空腔同时的多个空腔的至少一个空腔中。
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52.发明申请Method and Apparatus Providing Fine Alignment of a Structure Relative to a Support 失效提供相对于支撑件的结构的精细对准的方法和装置公开(公告)号：US20090291263A1
公开(公告)日：2009-11-26
申请号：US12536175
申请日：2009-08-05
IPC分类号： B32B3/10 , B23K37/047 , B23K31/12
CPC分类号： B32B7/045 , B23K3/0623 , B23K2101/40 , B32B7/14 , B32B15/01 , H01L2224/0554 , H01L2224/0557 , H01L2224/05571 , H01L2224/05573 , H01L2224/16225 , H01L2924/00014 , Y10T428/12347 , Y10T428/24562 , Y10T428/24826 , Y10T428/249921 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： A method for fine positioning a component through the use of fusible elements having two or more melting points so as to establish intermediate displacements between totally melted fusible elements and unmelted fusible elements. Because of the use of non-eutectic fusible materials, fine adjustments in the displacement may be achieved.
摘要翻译： 一种通过使用具有两个或多个熔点的可熔元件来精细定位部件的方法，以便在完全融化的可熔元件和未熔化的可熔元件之间建立中间位移。 由于使用非共晶的易熔材料，可以实现位移的微调。
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公开(公告)号：US20090037016A1
公开(公告)日：2009-02-05
申请号：US11830349
申请日：2007-07-30
IPC分类号： G06F19/00
CPC分类号： B23K3/0623 , B23K2101/40 , H01L24/742 , H01L2224/11334 , H01L2924/01004 , H01L2924/01006 , H01L2924/01013 , H01L2924/01033 , H01L2924/01075 , H01L2924/01082 , H01L2924/14 , H01L2924/00
摘要： An apparatus for placing solder bumps on a mold plate includes: a solder fill head configured for dispensing molten solder onto the mold plate, the solder fill head also configured for relative movement over the mold plate; and a control mechanism configured for controlling positions of the solder fill head relative to the mold plate. The control mechanism includes: a control input signal containing data about an ideal positioning of the solder fill head; a plurality of sensors positioned on the solder fill head, the sensors configured for providing data about a gap between the solder fill head and the mold plate; a position controller configured for receiving the gap data and comparing the gap data with the control input signal, wherein said position controller provides an inequality signal if the gap data and the control input signal are not equal; an amplifier configured for receiving the inequality signal and amplifying it; and an actuator configured for receiving the amplified inequality signal and controlling movement of the solder fill head in response to the inequality signal received. The control mechanism may be a servo control mechanism. The sensors may be gap sensors.
摘要翻译： 用于将焊料凸块放置在模板上的装置包括：焊料填充头，其被配置用于将熔融焊料分配到模板上，焊料填充头还构造成用于相对于模具板上的移动; 以及控制机构，被配置为控制焊料填充头相对于模板的位置。 控制机构包括：控制输入信号，其包含关于焊料填充头的理想定位的数据; 定位在焊料填充头上的多个传感器，所述传感器被配置为提供关于焊料填充头和模板之间的间隙的数据; 位置控制器，被配置为接收所述间隙数据并将所述间隙数据与所述控制输入信号进行比较，其中如果所述间隙数据和所述控制输入信号不相等，则所述位置控制器提供不等式信号; 放大器，被配置为接收不等式信号并对其进行放大; 以及致动器，被配置为接收放大的不等式信号，并响应于所接收的不等式信号控制焊料填充头的移动。 控制机构可以是伺服控制机构。 传感器可以是间隙传感器。
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公开(公告)号：US20080302502A1
公开(公告)日：2008-12-11
申请号：US12189822
申请日：2008-08-12
IPC分类号： B22D17/00
CPC分类号： B23K3/0638 , B23K1/20 , B23K2101/40 , H01L24/11 , H01L24/742 , H01L2224/13099 , H01L2924/01005 , H01L2924/01006 , H01L2924/01018 , H01L2924/01027 , H01L2924/01033 , H01L2924/01042 , H01L2924/01078 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/181 , H01L2924/00
摘要： A system, method, and apparatus for injection molding conductive bonding material into a plurality of cavities in a surface are disclosed. The method comprises aligning a fill head with a surface. The mold includes a plurality of cavities. The method further includes placing the fill head in substantial contact with the surface. At least a first gas is channeled about a first region of the fill head. The at least first gas has a temperature above a melting point of conductive bonding material residing in a reservoir thereby maintaining the conductive bonding material in a molten state. The conductive bonding material is forced out of the fill head toward the surface. The conductive bonding material is provided into at least one cavity of the plurality of cavities contemporaneous with the at least one cavity being in proximity to the fill head.
摘要翻译： 公开了一种用于将导电接合材料注射成表面中的多个空腔的系统，方法和装置。 该方法包括将填充头与表面对准。 模具包括多个空腔。 该方法还包括将填充头与表面实质接触。 至少第一气体围绕填充头的第一区域引导。 所述至少第一气体具有高于位于储存器中的导电接合材料的熔点的温度，从而将导电接合材料保持在熔融状态。 导电接合材料从表面压出填料头。 导电接合材料被提供到与填充头附近的至少一个空腔同时的多个空腔的至少一个空腔中。
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公开(公告)号：US20080029686A1
公开(公告)日：2008-02-07
申请号：US11499365
申请日：2006-08-04
IPC分类号： B29C33/56
CPC分类号： B29C33/405 , B29C33/56 , B29C33/60 , B29K2083/00
摘要： The invention provides a reusable precision fabricated silicon mold comprising a mold made of silicon which comprises a desired pattern of physical features cavities etched into the mold to transfer a patter on bumps to a semiconductor wafer, e.g., computer chip, semiconductor device, silicon on insulator device, etc.; an aperture etched into the mold adapted to allow gases to escape but does not to allow a solder to escape during the process of transferring solder bumps to a chip; a protective oxide or nitride on the mold; alignment marks adapted to properly align the mold with a semiconductor wafer; an organic release material on the mold adapted to release the mold from the semiconductor wafer, wherein the mold precisely defines a conductive adhesive material volume for interconnects on the semiconductor wafer.
摘要翻译： 本发明提供了一种可重复使用的精密制造硅模，其包括由硅制成的模具，其包括蚀刻到模具中的物理特征空腔的图案，以将凸块上的图案转移到半导体晶片，例如计算机芯片，半导体器件，绝缘体上硅 设备等; 蚀刻到模具中的孔径适于允许气体逸出，但是在将焊料凸块转移到芯片的过程中不允许焊料逸出; 模具上的保护性氧化物或氮化物; 对准标记适于使模具与半导体晶片正确对准; 模具上的有机剥离材料适于从半导体晶片释放模具，其中模具精确地限定用于半导体晶片上的互连的导电粘合剂材料体积。
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56.发明授权Solder reflow type electrical apparatus packaging having integrated circuit and discrete components 失效具有集成电路和分立元件的焊接回流型电器包装公开(公告)号：US06910615B2
公开(公告)日：2005-06-28
申请号：US10400944
申请日：2003-03-27
IPC分类号： B23K1/00 , B23K1/008 , H01L21/56 , H01L21/60 , H01L21/66 , H01L21/68 , H05K3/22 , H05K3/26 , H05K3/34 , B23K31/02 , B23K37/00
CPC分类号： H01L21/6835 , B23K1/0016 , B23K1/008 , H01L21/563 , H01L22/14 , H01L24/81 , H01L2224/05568 , H01L2224/05573 , H01L2224/11003 , H01L2224/11334 , H01L2224/13111 , H01L2224/16 , H01L2224/73203 , H01L2224/8121 , H01L2224/81815 , H01L2224/8191 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/0105 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/14 , H01L2924/19041 , H01L2924/3011 , H05K3/225 , H05K3/26 , H05K3/341 , H05K3/3463 , H05K2203/047 , H05K2203/1476 , H05K2203/162 , H05K2203/176 , Y02P70/613 , H01L2224/05599
摘要： In a solder reflow type building of modular electrical apparatus involving integrated circuit and discrete components, fabrication operations are arranged to include the providing of a general type series of steps for each component element involving a reflow or joining step at the highest joining temperature, immediately followed by a solder flux cleaning step and immediately followed by a testing of the entire module constructed thus far. There is provided a further specific type operation for each different type of component element that includes the providing of a loop for the introduction of a replacement for any broken discrete component with joining being achieved with use of a lower fusion temperature solder, flux cleaning and testing at each joining followed by reinsertion into the module. There is further provided an operation at the encapsulation stage of the module building for introducing underfill between the component and supporting carrier.
摘要翻译： 在涉及集成电路和分立组件的模块化电气设备的回流焊接建筑物中，制造操作被布置为包括为在最高接合温度下涉及回流或接合步骤的每个部件元件提供一般类型的一系列步骤，紧接着 通过焊剂清洁步骤，并立即进行到目前为止构成的整个模块的测试。 为每个不同类型的元件提供了另外的特定类型的操作，包括提供一个环，用于引入任何破损的分立元件的替换，使用较低的熔融温度焊料，焊剂清洁和测试 在每次连接之后重新插入模块。 在模块建筑物的封装阶段进一步提供了在组件和支撑载体之间引入底部填充物的操作。
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公开(公告)号：US06362557B1
公开(公告)日：2002-03-26
申请号：US09649486
申请日：2000-08-28
IPC分类号： H01L4108
CPC分类号： H01L41/0906
摘要： An actuator scaled to macroscopic or microscopic sizes, uses ultrasonic energy to induce motion of an object in a desired direction. The actuator includes one or more pair of piezoelectric transducers connected with a transducer tip. Supplying the piezoelectric transducers with alternating current electrical power causes the tip to vibrate at ultrasonic frequencies. Urging the vibrating tip into contact with a surface on the object at a selected angle of inclination induces the object to move in the desired direction at a rate determined by the inclination angle. Multiple actuators can be used to induce a fall range of movements of variously shaped objects. In microscopic form, the actuator can be used to create a MEMS device. The optional application of a compliant material either on the transducer tip or on the object's surface enhances the movement induced by the actuator.
摘要翻译： 按照宏观或微观尺寸的致动器，使用超声波能量来诱导物体沿所需方向的运动。 致动器包括与换能器尖端连接的一对或多对压电换能器。 为具有交流电功率的压电换能器提供使尖端以超声频率振动。 将振动尖端以选定的倾斜角度与物体上的表面接触，使得物体以由倾斜角确定的速率在所需方向上移动。 可以使用多个致动器来引起各种形状物体的运动的下降范围。 在微观形式中，致动器可用于创建MEMS装置。 在换能器尖端或物体表面上可选地应用柔性材料增强了由致动器引起的运动。
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58.发明授权Low temperature solder column attach by injection molded solder and structure formed 失效低温焊料柱通过注塑焊料附着并形成结构公开(公告)号：US06276596B1
公开(公告)日：2001-08-21
申请号：US09649487
申请日：2000-08-28
申请人： Peter A. Gruber , Lannie R. Bolde , Guy P. Brouillette , James H. Covell , David Danovitch , Chon C. Lei
发明人： Peter A. Gruber , Lannie R. Bolde , Guy P. Brouillette , James H. Covell , David Danovitch , Chon C. Lei
IPC分类号： B23K3102
CPC分类号： H05K3/3468 , B23K3/0638 , B23K35/0222 , B23K2101/40 , H01L21/4846 , H05K2203/0113 , H05K2203/0338 , H05K2203/0415 , H05K2203/074 , H05K2203/128
摘要： A method for joining a multiplicity of multi-alloy solder columns to an electronic substrate and the structure formed by such method are disclosed. In the method, a mold plate equipped with a multiplicity of cavities is first filled by an injection molded solder technique with a high temperature solder forming a multiplicity of solder columns. The mold plate is then sandwiched between an extraction plate and a transfer plate by utilizing a multiplicity of displacement means equipped in the extraction plate to displace the multiplicity of solder columns from the mold plate into a multiplicity of apertures equipped in the transfer plate. The multiplicity of cavities in the transfer plate each has a straight opening and a flared opening. The flared opening is then filled with a low temperature solder paste to encapsulate one end of the high temperature solder column. The low temperature solder paste is then reflown on top of a conductive pad on an electronic substrate at a temperature lower than the melting temperature of the high temperature solder to form a bond between the solder column and the conductive pad.
摘要翻译： 公开了一种将多种多合金焊料柱连接到电子基板的方法以及通过这种方法形成的结构。 在该方法中，首先通过注射成型的焊接技术填充配备有多个空腔的模板，其中高温焊料形成多个焊料柱。 然后通过利用设置在提取板中的多个位移装置将模板夹在提取板和转印板之间，以将多个焊料柱从模板移位成装配在转印板中的多个孔。 传递板中的多个空腔各具有直的开口和扩口的开口。 然后用扩散的开口填充低温焊膏以封装高温焊料柱的一端。 然后在低于高温焊料的熔融温度的温度下，将低温焊膏在电子基板上的导电焊盘的顶部上进行退火，以在焊料柱和导电焊盘之间形成接合。
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公开(公告)号：US4964458A
公开(公告)日：1990-10-23
申请号：US161880
申请日：1988-02-29
IPC分类号： H01L23/367 , H01L23/433 , H01L23/467
CPC分类号： H01L23/3672 , H01L23/4338 , H01L23/467 , H01L2224/16225 , H01L2224/32245 , H01L2224/73253
摘要： A heat exchanger for cooling an array of electric circuit chips disposed on a common substrate is formed as a flexible sheet of thermally conducting material with understanding fins for transference of heat from the chips to a coolant flowing through the fins. Pin fins may be employed with air coolant. The sheet may be provided with corrugations set between sites of the chips for improved flexibility to accommodate individual orientations of the chips. The sheet is sufficiently large to cover an array of chips and is thermally joined, as by use of a thermally conductive grease, to the chips. The sheet hermetically seals the chips from contamination by the coolant. For liquid coolant, the heat exchanger may be fabricated of copper with a nickel coating, wherein the copper provides the heat conduction and the nickel protects the copper from a corrosive coolant such as water. In one embodiment of the heat exchanger, the fin thickness, the fin spacing and the sheet thickness are all approximately equal, a typical sheet thickness being approximately two mils. Another embodiment uses air cooling, and uses metal pin fins bonded to a metal sheet which is moderately thin and flexible. Transverse motion between the sheet and the array of chips is introduced concurrently with the application of pressure between the sheet and the chips to reduce the thickness of the layers of grease between the chips and the sheet, thereby to improve thermal conductivity between the heat exchanger and each of the chips.
摘要翻译： 用于冷却设置在共同基板上的电路芯片阵列的热交换器形成为导热材料的柔性片，其具有用于将热从芯片传递到流过翅片的冷却剂的散热片。 引脚散热片可以与空气冷却剂一起使用。 片材可以设置在芯片的位置之间设置的波纹，以提高柔性以适应芯片的各个取向。 片材足够大以覆盖芯片阵列，并且通过使用导热油脂与芯片热连接。 片材气密地密封芯片以免受冷却剂的污染。 对于液体冷却剂，热交换器可以由具有镍涂层的铜制成，其中铜提供热传导，并且镍保护铜免受诸如水的腐蚀性冷却剂的影响。 在热交换器的一个实施例中，翅片厚度，翅片间距和片材厚度大致相等，典型的片材厚度约为2密耳。 另一实施例使用空气冷却，并且使用结合到中等薄度和柔性的金属片的金属销散热片。 片材与芯片阵列之间的横向运动与片材和芯片之间的压力施加同时引入，以减小芯片和片材之间的润滑脂层的厚度，从而改善热交换器和 每个芯片。
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公开(公告)号：US4685606A
公开(公告)日：1987-08-11
申请号：US861696
申请日：1986-05-09
IPC分类号： H01L23/36 , H01L23/373 , H01L23/433 , H01L23/473 , B23K31/02
CPC分类号： H01L23/3736 , H01L23/433 , H01L23/473 , H01L2224/16 , H01L2924/01014
摘要： A method of joining a thermally conductive element to an electric circuit chip for cooling the chip includes initial steps of forming an oxide-free preform of a fusible metal alloy by extrusion of alloy between two mold blocks or plates. During the extrusion, the oxide coating is left behind so that the extruded alloy is essentially free of oxide. The extrusion takes place at a temperature elevated to approximately the liquidus temperature of the alloy. The preform, which may be in the form of a pill or section of thin foil, is placed between interfacing surfaces of the thermally conductive element and the chip, and is then extruded along the interfacing surfaces under pressure and elevated temperature to form a thermally conductive, oxide-free bonding layer of superior thermal conductivity.
摘要翻译： 将导热元件接合到用于冷却芯片的电路芯片的方法包括通过在两个模块或板之间挤出合金来形成易熔金属合金的无氧化物预制件的初始步骤。 在挤出过程中，留下氧化物涂层，使得挤出的合金基本上不含氧化物。 挤压在升至约合金的液相线温度的温度下进行。 预成型件（其可以是薄片形式的片或薄片形式）放置在导热元件和芯片的接合表面之间，然后在压力和升高的温度下沿着界面表面挤出以形成导热 ，无氧化物结合层，导热性优良。
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