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    LED chips having fluorescent substrates with microholes and methods for fabricating
    51.
    发明授权
    LED chips having fluorescent substrates with microholes and methods for fabricating 有权
    具有带微孔的荧光基板的LED芯片及其制造方法

    公开(公告)号：US09196799B2

    公开(公告)日：2015-11-24

    申请号：US12229366

    申请日：2008-08-22

    申请人： Ashay Chitnis ,  Bernd Keller

    发明人： Ashay Chitnis ,  Bernd Keller

    IPC分类号： H01L33/00 ,  H01L33/44 ,  H01L33/50 ,  H01L33/62 ,  H01L23/31 ,  H01L33/38

    CPC分类号： H01L33/44 ,  H01L23/3114 ,  H01L33/38 ,  H01L33/505 ,  H01L33/508 ,  H01L33/62 ,  H01L2924/0002 ,  H01L2924/00

    摘要： Methods for fabricating semiconductor devices such as LED chips at the wafer level, and LED chips and LED chip wafers fabricated using the methods. An LED chip wafer according to the present invention comprises a plurality of LEDs on a wafer and a plurality of pedestals, each of which is on one of the LEDs. A fluorescent substrate or preform (“preform”) is provided covering at least some of the LEDs, the preform comprising holes with the pedestals arranged within the holes. During operation of the covered ones of said LEDs at least some light from the LEDs passes through the preform and is converted. LED chips are provided that are singulated from this LED chip wafer. One embodiment of a method for fabricating LED chips from a wafer comprises depositing LED epitaxial layers on an LED growth wafer to form a plurality of LEDs on the growth wafer. Pedestals are formed on the LEDs and a fluorescent preform is formed with holes. The fluorescent preform is bonded over at least some of the plurality of LEDs so that at least some light from the covered ones of said LEDs passes through the preform and is converted. The pedestals are arranged in the holes so that an electrical signal is applied to the LEDs through the pedestals.

    摘要翻译： 用于制造晶片级的半导体器件如LED芯片的方法，以及使用该方法制造的LED芯片和LED芯片晶片。 根据本发明的LED芯片晶片包括晶片上的多个LED和多个基座，每个基座位于一个LED上。 提供了覆盖至少一些LED的荧光基板或预制件（“预制件”），预成型件包括具有布置在孔内的基座的孔。 在所述LED的被覆盖的操作期间，来自LED的至少一些光通过预型件并被转换。 提供从该LED芯片晶片分离的LED芯片。 从晶片制造LED芯片的方法的一个实施例包括在LED生长晶片上沉积LED外延层，以在生长晶片上形成多个LED。 在LED上形成基座，荧光预制件形成有孔。 所述荧光预制件被粘结在所述多个LED中的至少一些上，使得来自所述LED的被覆盖的LED的至少一些光通过所述预型件并被转换。 基座布置在孔中，使得电信号通过基座施加到LED。

    Multiple component solid state white light
    52.
    发明授权
    Multiple component solid state white light 有权
    多组分固态白光

    公开(公告)号：US08901585B2

    公开(公告)日：2014-12-02

    申请号：US12845629

    申请日：2010-07-28

    申请人： Eric Joseph Tarsa ,  Michael Dunn ,  Bernd Keller

    发明人： Eric Joseph Tarsa ,  Michael Dunn ,  Bernd Keller

    IPC分类号： H01L21/00 ,  H01L25/075 ,  H01L33/50

    CPC分类号： H01L25/0753 ,  H01L33/50 ,  H01L2924/0002 ,  H01L2933/0091 ,  Y10S362/80 ,  H01L2924/00

    摘要： A white light emitting lamp is disclosed comprising a solid state ultra violet (UV) emitter that emits light in the UV wavelength spectrum. A conversion material is arranged to absorb at least some of the light emitting from the UV emitter and re-emit light at one or more different wavelengths of light. One or more complimentary solid state emitters are included that emit at different wavelengths of light than the UV emitter and the conversion material. The lamp emits a white light combination of light emitted from the complimentary emitters and from the conversion material, with the white light having high efficacy and good color rendering. Other embodiments of white light emitting lamp according to the present invention comprises a solid state laser instead of a UV emitter. A high flux white emitting lamp embodiment according to the invention comprises a large area light emitting diode (LED) that emits light at a first wavelength spectrum and includes a conversion material. A plurality of complimentary solid state emitters surround the large area LED, with each emitter emitting light in a spectrum different from the large area LED and conversion material such that the lamp emits a balanced white light. Scattering particles can be included in each of the embodiments to scatter the light from the emitters, conversion material and complimentary emitters to provide a more uniform emission.

    摘要翻译： 公开了一种白光发射灯，其包括在UV波长光谱中发射光的固态紫外（UV）发射器。 转换材料被布置成吸收从UV发射器发射的光中的至少一些，并且在一个或多个不同波长的光下重新发射光。 包括一个或多个互补固态发射器，其发射在不同于UV发射器和转换材料的波长的光。 灯发出从互补发射器和转换材料发出的光的白光组合，白光具有高效率和良好的显色性。 根据本发明的白光发射灯的其它实施例包括固态激光器而不是UV发射器。 根据本发明的高通量白光发光灯实施例包括发射第一波长光谱的光并包括转换材料的大面积发光二极管（LED）。 多个互补固态发射器围绕大面积的LED，每个发射器发射的光与大面积的LED和转换材料不同，使得灯发出平衡的白光。 可以在每个实施例中包括散射颗粒以散射来自发射器，转换材料和互补发射体的光，以提供更均匀的发射。

    Light emitting diode package with optical element
    53.
    发明授权
    Light emitting diode package with optical element 有权
    具有光学元件的发光二极管封装

    公开(公告)号：US08735920B2

    公开(公告)日：2014-05-27

    申请号：US11496922

    申请日：2006-07-31

    申请人： James Ibbetson ,  Eric Tarsa ,  Michael Leung ,  Maryanne Becerra ,  Bernd Keller

    发明人： James Ibbetson ,  Eric Tarsa ,  Michael Leung ,  Maryanne Becerra ,  Bernd Keller

    IPC分类号： H01L33/00

    CPC分类号： H01L33/486 ,  H01L33/56 ,  H01L33/58 ,  H01L2224/48091 ,  H01L2933/005 ,  H01L2924/00014

    摘要： A light emitting diode (LED) package comprising a substrate with an LED chip mounted to the substrate and in electrical contact with it. An inner material covers the LED chip, and a lens covers the inner material with the lens material being harder than the inner material. An adhesive is arranged between the substrate and the lens to hold the lens to the substrate and to compensate for different coefficients of thermal expansion (CTE) between the lens and the remainder of the package. A method for forming an LED package comprises providing a substrate with a first meniscus ring on a surface of the substrate. An LED chip is mounted to the substrate, within the meniscus ring. An inner material is deposited over the LED chip, and a lens material in liquid form is deposited over the inner material. The lens material held in a hemispheric shape by the first meniscus feature and the lens material is cured making it harder than the inner material.

    摘要翻译： 一种发光二极管（LED）封装，其包括具有安装到所述衬底并与其电接触的LED芯片的衬底。 内部材料覆盖LED芯片，透镜覆盖内部材料，透镜材料比内部材料硬。 在基板和透镜之间布置粘合剂以将透镜保持在基板上并补偿透镜与封装的其余部分之间的不同热膨胀系数（CTE）。 一种用于形成LED封装的方法，包括在基板的表面上提供具有第一弯液面环的基板。 LED芯片安装在弯液面环内的基板上。 内部材料沉积在LED芯片上，液体形式的透镜材料沉积在内部材料上。 通过第一弯液面特征和透镜材料保持半球形状的透镜材料固化使其比内部材料更硬。

    LED LAMP OR BULB WITH REMOTE PHOSPHOR AND DIFFUSER CONFIGURATION WITH ENHANCED SCATTERING PROPERTIES
    59.
    发明申请
    LED LAMP OR BULB WITH REMOTE PHOSPHOR AND DIFFUSER CONFIGURATION WITH ENHANCED SCATTERING PROPERTIES 有权
    带有远程磷光体的LED灯或灯泡和具有增强散射特性的差分配置

    公开(公告)号：US20110267801A1

    公开(公告)日：2011-11-03

    申请号：US13018291

    申请日：2011-01-31

    申请人： Tao Tong ,  Ronan Le Toquin ,  Bernd Keller ,  Eric Tarsa ,  Mark Youmans ,  Theodore Lowes ,  Nicholas Medendorp, JR. ,  Antony van de Ven ,  Gerald Negley

    发明人： Tao Tong ,  Ronan Le Toquin ,  Bernd Keller ,  Eric Tarsa ,  Mark Youmans ,  Theodore Lowes ,  Nicholas Medendorp, JR. ,  Antony van de Ven ,  Gerald Negley

    IPC分类号： F21V9/16 ,  F21V9/00

    CPC分类号： F21V9/30 ,  F21K9/232 ,  F21K9/64 ,  F21V3/00 ,  F21V3/02 ,  F21V29/505 ,  F21V29/767 ,  F21V29/773 ,  F21Y2115/10

    摘要： An LED lamp or bulb is disclosed that comprises a light source, a heat sink structure and an optical cavity. The optical cavity comprises a phosphor carrier having a conversions material and arranged over an opening to the cavity. The phosphor carrier comprises a thermally conductive transparent material and is thermally coupled to the heat sink structure. An LED based light source is mounted in the optical cavity remote to the phosphor carrier with light from the light source passing through the phosphor carrier. A diffuser dome is included that is mounted over the optical cavity, with light from the optical cavity passing through the diffuser dome. The properties of the diffuser, such as geometry, scattering properties of the scattering layer, surface roughness or smoothness, and spatial distribution of the scattering layer properties may be used to control various lamp properties such as color uniformity and light intensity distribution as a function of viewing angle.

    摘要翻译： 公开了一种LED灯或灯泡，其包括光源，散热结构和光学腔。 光学腔包括具有转换材料的荧光体载体并且布置在通向空腔的开口上。 荧光体载体包括导热透明材料并且热耦合到散热器结构。 基于LED的光源通过来自光源的光穿过荧光体载体而安装在远离荧光体载体的光学腔中。 包括安装在光学腔上的扩散器圆顶，来自光学腔的光通过扩散器圆顶。 扩散器的性质，如几何形状，散射层的散射特性，表面粗糙度或平滑度以及散射层性质的空间分布可用于控制各种灯具性能，如颜色均匀性和光强度分布，作为 可视角度。