公开(公告)号：US07371617B2

公开(公告)日：2008-05-13

申请号：US11580736

申请日：2006-10-12

申请人： Ho-Yi Tsai ,  Chien-Ping Huang

发明人： Ho-Yi Tsai ,  Chien-Ping Huang

IPC分类号： H01L21/00

CPC分类号： H01L23/4334 ,  H01L23/3128 ,  H01L23/4951 ,  H01L23/49816 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/97 ,  H01L2224/16225 ,  H01L2224/16245 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/4824 ,  H01L2224/48247 ,  H01L2224/73204 ,  H01L2224/73215 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/05599 ,  H01L2224/0401

摘要： A semiconductor package with a heat sink and a method for fabricating the same are proposed. The heat sink is provided with a rigid and thermally resistant detach member on a top surface thereof, and is attached via its bottom surface to a chip mounted on a chip carrier. The detach member is sized larger than the heat sink and can be easily removed from the top surface of the heat sink. Subsequently, a molding process is performed to form an encapsulant for completely encapsulating the chip, the heat sink and the detach member. Then, a singulation process is performed to cut along predetermined cutting lines located between sides of the heat sink and corresponding sides of the detach member. Finally, the detach member and a portion of the encapsulant formed on the detach member are removed from the heat sink. The above fabrication method reduces the packaging cost.

摘要翻译： 提出了具有散热器的半导体封装及其制造方法。 散热器在其顶表面上设置有刚性且耐热的分离构件，并且经由其底表面附接到安装在芯片载体上的芯片。 分离构件的尺寸大于散热器，并且可以容易地从散热器的顶表面去除。 随后，进行模制处理以形成用于完全封装芯片，散热器和分离构件的密封剂。 然后，进行切割处理，以沿着位于散热片的侧面和分离构件的相应侧面之间的预定切割线切割。 最后，分离构件和形成在分离构件上的密封剂的一部分从散热器移除。 上述制造方法降低了包装成本。

公开(公告)号：US20070296079A1

公开(公告)日：2007-12-27

申请号：US11818225

申请日：2007-06-12

申请人： Chien-Ping Huang ,  Han-Ping Pu ,  Ho-Yi Tsai

发明人： Chien-Ping Huang ,  Han-Ping Pu ,  Ho-Yi Tsai

IPC分类号： H01L23/34 ,  H01L21/58

CPC分类号： H01L23/4334 ,  H01L23/3121 ,  H01L24/48 ,  H01L2224/4824 ,  H01L2224/73204 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01079 ,  H01L2924/1815 ,  H01L2924/18165 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A heat sink package structure and a method for fabricating the same are disclosed. The method includes mounting and electrically connecting a semiconductor chip to a chip carrier, forming an interface layer or a second heat dissipating element having the interface layer on the semiconductor chip and installing a first heat dissipating element having a heat dissipating portion and a supporting portion onto the chip carrier. The method further includes forming openings corresponding to the semiconductor chip in the heat dissipating portion, and forming an encapsulant for covering the semiconductor chip, the interface layer or the second heat dissipating element, and the first heat dissipating element. A height is reserved on top of the interface layer for the formation of the encapsulant for covering the interface layer. The method further includes cutting the encapsulant along edges of the interface layer, and removing the redundant encapsulant on the interface layer. Therefore, the drawbacks of the prior art of the burrs caused by a cutting tool for cutting the heat dissipating element and wearing of the cutting tool are overcome.

摘要翻译： 公开了一种散热器封装结构及其制造方法。 该方法包括将半导体芯片安装并电连接到芯片载体，在半导体芯片上形成具有界面层的界面层或第二散热元件，并将具有散热部分和支撑部分的第一散热元件安装到 芯片载体。 该方法还包括形成对应于散热部分中的半导体芯片的开口，以及形成用于覆盖半导体芯片，界面层或第二散热元件的密封剂和第一散热元件。 在接口层顶部保留一个高度，用于形成覆盖界面层的密封剂。 该方法还包括沿着界面层的边缘切割密封剂，以及去除界面层上的冗余密封剂。 因此，克服了用于切割散热元件的切削工具和切削工具的磨损引起的毛刺现有技术的缺陷。

公开(公告)号：US20070273019A1

公开(公告)日：2007-11-29

申请号：US11709992

申请日：2007-02-23

申请人： Chien Ping Huang ,  Ho-Yi Tsai

发明人： Chien Ping Huang ,  Ho-Yi Tsai

IPC分类号： H01L23/52 ,  H01L21/00

CPC分类号： H01L23/24 ,  H01L21/561 ,  H01L21/563 ,  H01L21/565 ,  H01L23/3128 ,  H01L23/36 ,  H01L24/48 ,  H01L24/97 ,  H01L25/0655 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/73203 ,  H01L2224/73253 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/16195 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2924/19105 ,  H01L2924/3011 ,  H01L2924/3511 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor package, a chip carrier structure thereof, and a method for fabricating the chip carrier structure are provided. A substrate having a mounting region and a covering region is disposed in an opening of a carrier. A molding process is performed to form an encapsulant on the covering region of the substrate, with the mounting region of the substrate being exposed from the encapsulant. A cutting process is performed along edges of the substrate, such that the chip carrier structure is fabricated. A semiconductor chip is mounted on the mounting region of the substrate in a flip-chip manner, such that the semiconductor package is completed. The encapsulant formed on the covering region of the substrate provides the substrate with supporting strength and prevents poor electrical contact for the semiconductor package caused by substrate warpage.

摘要翻译： 提供半导体封装，其芯片载体结构和制造芯片载体结构的方法。 具有安装区域和覆盖区域的基板设置在载体的开口中。 进行成型工艺以在衬底的覆盖区域上形成密封剂，衬底的安装区域从密封剂暴露出来。 沿着衬底的边缘进行切割处理，从而制造芯片载体结构。 半导体芯片以倒装芯片的方式安装在基板的安装区域上，使得半导体封装完成。 形成在基板的覆盖区域上的密封剂为基板提供支撑强度，并防止由基板翘曲导致的半导体封装的不良电接触。

公开(公告)号：US07164210B2

公开(公告)日：2007-01-16

申请号：US11026880

申请日：2004-12-29

申请人： Ho-Yi Tsai ,  Chien-Ping Huang

发明人： Ho-Yi Tsai ,  Chien-Ping Huang

IPC分类号： H01L23/28 ,  H01L21/50

CPC分类号： H01L23/4334 ,  H01L23/3128 ,  H01L23/4951 ,  H01L23/49816 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/97 ,  H01L2224/16225 ,  H01L2224/16245 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/4824 ,  H01L2224/48247 ,  H01L2224/73204 ,  H01L2224/73215 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/05599 ,  H01L2224/0401

摘要： A semiconductor package with a heat sink and a method for fabricating the same are proposed. The heat sink is provided with a rigid and thermally resistant detach member on a top surface thereof, and is attached via its bottom surface to a chip mounted on a chip carrier. The detach member is sized larger than the heat sink and can be easily removed from the top surface of the heat sink. Subsequently, a molding process is performed to form an encapsulant for completely encapsulating the chip, the heat sink and the detach member. Then, a singulation process is performed to cut along predetermined cutting lines located between sides of the heat sink and corresponding sides of the detach member. Finally, the detach member and a portion of the encapsulant formed on the detach member are removed from the heat sink. The above fabrication method reduces the packaging cost.

摘要翻译： 提出了具有散热器的半导体封装及其制造方法。 散热器在其顶表面上设置有刚性和耐热的分离构件，并且经由其底表面附接到安装在芯片载体上的芯片。 分离构件的尺寸大于散热器，并且可以容易地从散热器的顶表面去除。 随后，进行模制处理以形成用于完全封装芯片，散热器和分离构件的密封剂。 然后，进行切割处理，以沿着位于散热片的侧面和分离构件的相应侧面之间的预定切割线切割。 最后，分离构件和形成在分离构件上的密封剂的一部分从散热器移除。 上述制造方法降低了包装成本。

公开(公告)号：US07129119B2

公开(公告)日：2006-10-31

申请号：US11049054

申请日：2005-02-01

申请人： Ying-Ren Lin ,  Ho-Yi Tsai ,  Chien-Ping Huang

发明人： Ying-Ren Lin ,  Ho-Yi Tsai ,  Chien-Ping Huang

IPC分类号： H01L21/50

CPC分类号： H01L21/4846 ,  H01L21/50 ,  H01L21/565 ,  H01L23/3128 ,  H01L23/4334 ,  H01L24/81 ,  H01L24/97 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2224/81801 ,  H01L2224/83102 ,  H01L2224/92125 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2924/00012

摘要： A method for fabricating semiconductor packages is proposed. A plurality of substrates are prepared each having a chip thereon. Length and width of each substrate are equal to predetermined length and width of the semiconductor package. A carrier having a plurality of openings is prepared. A protruded portion is formed at each corner of each opening, wherein a distance between two diagonal protruded portions is slightly larger than that between two diagonal corners of the substrate. The substrates are fixed in the openings of the carrier by means of the protruded portions, and gaps between the substrates and the carrier are sealed. An encapsulant is formed over each opening to encapsulate the corresponding chip by a molding process. An area on the carrier covered by the encapsulant is larger in length and width than the opening. A plurality of the semiconductor packages are formed after performing mold-releasing and singulation processes.

摘要翻译： 提出了制造半导体封装的方法。 准备了各自具有芯片的多个基板。 每个基片的长度和宽度等于半导体封装的预定长度和宽度。 制备具有多个开口的载体。 在每个开口的每个角部处形成突出部分，其中两个对角线突出部分之间的距离略大于基板的两个对角线之间的距离。 基板通过突出部固定在载体的开口中，基板和载体之间的间隙被密封。 在每个开口上形成密封剂，以通过模制工艺封装相应的芯片。 由密封剂覆盖的载体上的区域的长度和宽度大于开口的宽度。 在进行脱模和切割处理之后形成多个半导体封装。

公开(公告)号：US20070054484A1

公开(公告)日：2007-03-08

申请号：US11553098

申请日：2006-10-26

申请人： Ying-Ren Lin ,  Ho-Yi Tsai ,  Chien-Ping Huang

发明人： Ying-Ren Lin ,  Ho-Yi Tsai ,  Chien-Ping Huang

IPC分类号： H01L21/44

CPC分类号： H01L21/4846 ,  H01L21/50 ,  H01L21/565 ,  H01L23/3128 ,  H01L23/4334 ,  H01L24/81 ,  H01L24/97 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2224/81801 ,  H01L2224/83102 ,  H01L2224/92125 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2924/00012

摘要： A method for positioning a semiconductor component is disclosed. The method includes providing the semiconductor component and a carrier, the carrier having a plurality of openings, a protruded portion being provided at each corner position of each of the openings and extended toward a center of the opening, a distance between two diagonal protruded portions of the opening being slightly larger than that between two diagonal corners of the semiconductor component; and positioning the semiconductor component in the openings of the carrier via the protruded portions provided at each corner position of each of the openings.

摘要翻译： 公开了一种用于定位半导体部件的方法。 该方法包括提供半导体部件和载体，载体具有多个开口，突出部分设置在每个开口的每个拐角位置并朝向开口的中心延伸，两个对角线突出部分之间的距离 所述开口略大于所述半导体部件的两个对角线之间的开口; 并且经由设置在每个开口的每个拐角位置处的突出部分将半导体部件定位在载体的开口中。

公开(公告)号：US20070029683A1

公开(公告)日：2007-02-08

申请号：US11580736

申请日：2006-10-12

申请人： Ho-Yi Tsai ,  Chien-Ping Huang

发明人： Ho-Yi Tsai ,  Chien-Ping Huang

IPC分类号： H01L23/28

CPC分类号： H01L23/4334 ,  H01L23/3128 ,  H01L23/4951 ,  H01L23/49816 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/97 ,  H01L2224/16225 ,  H01L2224/16245 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/4824 ,  H01L2224/48247 ,  H01L2224/73204 ,  H01L2224/73215 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/05599 ,  H01L2224/0401

摘要： A semiconductor package with a heat sink and a method for fabricating the same are proposed. The heat sink is provided with a rigid and thermally resistant detach member on a top surface thereof, and is attached via its bottom surface to a chip mounted on a chip carrier. The detach member is sized larger than the heat sink and can be easily removed from the top surface of the heat sink. Subsequently, a molding process is performed to form an encapsulant for completely encapsulating the chip, the heat sink and the detach member. Then, a singulation process is performed to cut along predetermined cutting lines located between sides of the heat sink and corresponding sides of the detach member. Finally, the detach member and a portion of the encapsulant formed on the detach member are removed from the heat sink. The above fabrication method reduces the packaging cost.

摘要翻译： 提出了具有散热器的半导体封装及其制造方法。 散热器在其顶表面上设置有刚性和耐热的分离构件，并且经由其底表面附接到安装在芯片载体上的芯片。 分离构件的尺寸大于散热器，并且可以容易地从散热器的顶表面去除。 随后，进行模制处理以形成用于完全封装芯片，散热器和分离构件的密封剂。 然后，进行切割处理，以沿着位于散热片的侧面和分离构件的相应侧面之间的预定切割线切割。 最后，分离构件和形成在分离构件上的密封剂的一部分从散热器移除。 上述制造方法降低了包装成本。

公开(公告)号：US06865084B2

公开(公告)日：2005-03-08

申请号：US10434247

申请日：2003-05-06

申请人： Ying-Ren Lin ,  Ho-Yi Tsai

发明人： Ying-Ren Lin ,  Ho-Yi Tsai

IPC分类号： H01L23/31 ,  H01L23/433 ,  H01L23/552 ,  H01L25/065 ,  H05K7/20

CPC分类号： H01L23/4334 ,  H01L23/3128 ,  H01L23/552 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0657 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48225 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/85399 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/07802 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/3025 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207

摘要： A thermally enhanced semiconductor package with EMI (electric and magnetic interference) shielding is provided in which a chip is mounted on and electrically connected to a surface of a substrate, and a thermally conductive member is stacked on the chip and electrically coupled to the surface of the substrate by bonding wires. An encapsulant is formed and encapsulates the chip, thermally conductive member, and bonding wires. A plurality of solder balls are implanted on an opposite surface of the substrate. The thermally conductive member is grounded via the bonding wires, substrate, and solder balls, and provides an EMI shielding effect for the chip to protect the chip against external electric and magnetic interference. The thermally conductive member has a coefficient of thermal expansion similar to that of the chip, and reduces thermal stress exerted on the chip and enhances mechanical strength of the chip to thereby prevent chip cracks.

摘要翻译： 提供了具有EMI（电和磁干扰）屏蔽的热增强半导体封装，其中芯片安装在基板的表面上并电连接到基板的表面，并且导热部件堆叠在芯片上并电耦合到 基板通过接合线。 形成密封剂并封装芯片，导热构件和接合线。 多个焊球被注入到基板的相对表面上。 导热构件通过接合线，衬底和焊球接地，并为芯片提供EMI屏蔽效果，以保护芯片免受外部电磁干扰。 导热构件的热膨胀系数与芯片的热膨胀系数相似，并且降低了施加在芯片上的热应力，并提高了芯片的机械强度，从而防止芯片裂纹。

公开(公告)号：US06781222B2

公开(公告)日：2004-08-24

申请号：US09932053

申请日：2001-08-18

申请人： Chi Chuan Wu ,  Chian Ping Huang ,  Jui-Yu Chuang ,  Ho-Yi Tsai ,  Yude Chu

发明人： Chi Chuan Wu ,  Chian Ping Huang ,  Jui-Yu Chuang ,  Ho-Yi Tsai ,  Yude Chu

IPC分类号： H01L2306

CPC分类号： H01L24/32 ,  H01L23/3128 ,  H01L23/642 ,  H01L24/29 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/83 ,  H01L2224/2919 ,  H01L2224/32057 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/83136 ,  H01L2224/83192 ,  H01L2224/83385 ,  H01L2224/8385 ,  H01L2224/92 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19103 ,  H01L2924/19105 ,  H01L2924/00 ,  H01L2924/00015 ,  H01L2224/05599 ,  H01L2924/00012

摘要： A semiconductor package and its fabricating method are proposed, in which a plurality of passive devices are integrated under a semiconductor chip, so as to increase the layout number of the passive devices in the semiconductor package and enhance the flexibility of substrate routability, as well as reduce an occupied area of a substrate for miniaturize the semiconductor package in profile. Moreover, as the integrated passive devices are further encapsulated by using an insulative material prior to a molding process, the dislocation of the passive devices caused by a high temperature and mold flow of a molding resin can be prevented from occurrence during molding. Furthermore, the encapsulated passive devices are prevented from contacting bonding wires, allowing the occurrence of short circuit to be avoided and quality of the packaged product to be assured.

摘要翻译： 提出了一种半导体封装及其制造方法，其中多个无源器件集成在半导体芯片之下，以便增加半导体封装中的无源器件的布局数量并提高衬底可路由性的灵活性，以及 减少基板的占用面积，以使半导体封装的形状小型化。 此外，由于通过在模制工艺之前使用绝缘材料进一步封装集成的无源器件，因此可以防止在模制期间由模制树脂的高温和模具流引起的无源器件的位错。 此外，防止封装的无源器件接触接合线，从而避免短路的发生，并确保封装产品的质量。