公开(公告)号：US20100123230A1

公开(公告)日：2010-05-20

申请号：US12275214

申请日：2008-11-20

申请人： Frederick Rodriguez Dahilig ,  Zigmund Ramirez Camacho ,  Henry Descalzo Bathan ,  Lionel Chien Hui Tay

发明人： Frederick Rodriguez Dahilig ,  Zigmund Ramirez Camacho ,  Henry Descalzo Bathan ,  Lionel Chien Hui Tay

IPC分类号： H01L23/495 ,  H01L21/56 ,  H01L21/00

CPC分类号： H01L21/4832 ,  H01L21/565 ,  H01L23/3107 ,  H01L23/49517 ,  H01L23/49575 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/04042 ,  H01L2224/05001 ,  H01L2224/05009 ,  H01L2224/0554 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/1403 ,  H01L2224/16 ,  H01L2224/16145 ,  H01L2224/16245 ,  H01L2224/32145 ,  H01L2224/45014 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49109 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2924/19104 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/05099 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/0555 ,  H01L2224/0556 ,  H01L2924/206

摘要： A method of manufacture of an integrated circuit packaging system includes: forming a first terminal having a cavity; mounting a first integrated circuit over the first terminal and connected in the cavity; forming a second terminal adjacent to the first terminal; connecting a second integrated circuit, over the first integrated circuit, and the second terminal; and forming a first encapsulation over the first integrated circuit with the first terminal exposed.

摘要翻译： 一种集成电路封装系统的制造方法，包括：形成具有空腔的第一端子; 将第一集成电路安装在第一端子上并连接在空腔中; 形成与所述第一端子相邻的第二端子; 连接第一集成电路，第一集成电路和第二终端; 以及在所述第一集成电路上形成第一封装，所述第一端子被暴露。

公开(公告)号：US20100123229A1

公开(公告)日：2010-05-20

申请号：US12272751

申请日：2008-11-17

申请人： Henry Descalzo Bathan ,  Zigmund Ramirez Camacho ,  Jairus Legaspi Pisigan ,  Lionel Chien Hui Tay

发明人： Henry Descalzo Bathan ,  Zigmund Ramirez Camacho ,  Jairus Legaspi Pisigan ,  Lionel Chien Hui Tay

IPC分类号： H01L23/495 ,  H01L21/56

CPC分类号： H01L23/49575 ,  H01L21/4832 ,  H01L21/565 ,  H01L23/3107 ,  H01L23/49517 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L25/105 ,  H01L2224/04042 ,  H01L2224/16 ,  H01L2224/32145 ,  H01L2224/32245 ,  H01L2224/45014 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/49109 ,  H01L2224/73265 ,  H01L2225/1029 ,  H01L2225/1058 ,  H01L2225/1088 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19107 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/0401 ,  H01L2224/45015 ,  H01L2924/207

摘要： A method of manufacture of an integrated circuit packaging system includes: forming an external interconnect; forming a first planar terminal adjacent to the external interconnect and non-planar to a portion the external interconnect; mounting a first integrated circuit over the first planar terminal; connecting the first integrated circuit with the external interconnect; and forming an encapsulation over the first planar terminal covering the first integrated circuit and with the external interconnect extending from a non-horizontal side of the encapsulation and with the first planar terminal coplanar with the adjacent portion of the encapsulation exposing the first planar terminal.

摘要翻译： 一种集成电路封装系统的制造方法，包括：形成外部互连; 形成与所述外部互连相邻并且与所述外部互连的一部分非平面的第一平面端子; 在所述第一平面端子上安装第一集成电路; 将第一集成电路与外部互连连接; 以及在覆盖所述第一集成电路的所述第一平面端子上以及从所述封装的非水平侧延伸的所述外部互连以及与所述第一平面端子的所述封装的相邻部分共面的第一平面端子形成封装。

公开(公告)号：US20090243069A1

公开(公告)日：2009-10-01

申请号：US12055612

申请日：2008-03-26

申请人： Zigmund Ramirez Camacho ,  Lionel Chien Hui Tay ,  Henry Descalzo Bathan ,  Abelardo Jr. Advincula

发明人： Zigmund Ramirez Camacho ,  Lionel Chien Hui Tay ,  Henry Descalzo Bathan ,  Abelardo Jr. Advincula

IPC分类号： H01L23/12 ,  H01L21/58

CPC分类号： H01L25/03 ,  H01L23/3128 ,  H01L23/49531 ,  H01L23/49551 ,  H01L23/552 ,  H01L24/48 ,  H01L24/73 ,  H01L25/105 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2225/1029 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/05599 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： An integrated circuit package system comprising: forming a base package having a molded top; providing a surface contact on the base package; and patterning a redistribution layer on the molded top for coupling the surface contact.

摘要翻译： 一种集成电路封装系统，包括：形成具有模制顶部的基底封装; 在基底包装上提供表面接触; 并且在模制顶部上构图再分布层以联接表面接触。

公开(公告)号：US20090243067A1

公开(公告)日：2009-10-01

申请号：US12054701

申请日：2008-03-25

申请人： Zigmund Ramirez Camacho ,  Abelardo Jr. Advincula ,  Henry Descalzo Bathan ,  Lionel Chien Hui Tay

发明人： Zigmund Ramirez Camacho ,  Abelardo Jr. Advincula ,  Henry Descalzo Bathan ,  Lionel Chien Hui Tay

IPC分类号： H01L23/12 ,  H01L21/58

CPC分类号： H01L23/49575 ,  H01L23/13 ,  H01L23/3128 ,  H01L23/49551 ,  H01L23/49555 ,  H01L23/49816 ,  H01L24/31 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L25/03 ,  H01L25/105 ,  H01L2224/05554 ,  H01L2224/32014 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/49113 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2225/1029 ,  H01L2225/1035 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2225/107 ,  H01L2924/00014 ,  H01L2924/01075 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/05599

摘要： A mountable integrated circuit package system includes: providing a substrate having an opening provided therein; providing an encapsulated integrated circuit package having an external leadfinger; mounting the encapsulated integrated circuit package by the external leadfinger proximate to the opening in the substrate; and connecting the external leadfinger and the substrate.

摘要翻译： 一种可安装的集成电路封装系统，包括：提供其中设置有开口的基板; 提供具有外部引线指针的封装集成电路封装; 通过所述外部引线圈将所封装的集成电路封装安装在靠近所述衬底中的所述开口处; 并连接外部引线圈和基板。

公开(公告)号：US20090001563A1

公开(公告)日：2009-01-01

申请号：US11769691

申请日：2007-06-27

申请人： Henry Descalzo Bathan ,  Zigmund Ramirez Camacho ,  Lionel Chien Hui Tay ,  Jeffrey D. Punzalan

发明人： Henry Descalzo Bathan ,  Zigmund Ramirez Camacho ,  Lionel Chien Hui Tay ,  Jeffrey D. Punzalan

IPC分类号： H01L23/48 ,  H01L21/58

CPC分类号： H01L23/49575 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/3135 ,  H01L23/49537 ,  H01L23/49548 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L25/03 ,  H01L2224/32145 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/83 ,  H01L2924/00014 ,  H01L2924/0781 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/18165 ,  H01L2924/19107 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： An integrated circuit package in package system includes a package in package lead with a package in package lead surface substantially planar, attaching a first integrated circuit package having a first encapsulant surface substantially coplanar with the package in package lead surface, attaching a second integrated circuit near the first integrated circuit package, and forming a package in package encapsulant over the first integrated circuit package and the second integrated circuit.

摘要翻译： 封装系统中的集成电路封装包括封装在封装引线中，封装在封装引线表面上基本上是平面的，将第一集成电路封装与第一封装表面大致共面与封装引线表面基本共面，将第二集成电路附近 第一集成电路封装，以及在第一集成电路封装和第二集成电路上形成封装封装的封装。

公开(公告)号：US20080185702A1

公开(公告)日：2008-08-07

申请号：US11672164

申请日：2007-02-07

申请人： Zigmund Ramirez Camacho ,  Henry Descalzo Bathan ,  Lionel Chien Hui Tay ,  Arnel Trasporto

发明人： Zigmund Ramirez Camacho ,  Henry Descalzo Bathan ,  Lionel Chien Hui Tay ,  Arnel Trasporto

IPC分类号： H01L23/02

CPC分类号： H01L21/561 ,  H01L21/568 ,  H01L25/03 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A multi-chip package system is provided including providing a first carrier having a first integrated circuit die thereover, providing a second carrier, placing the first carrier coplanar with the second carrier, and molding a package encapsulation around and exposing the first carrier.

摘要翻译： 提供了一种多芯片封装系统，包括提供第一载体，其上具有第一集成电路管芯，提供第二载体，将第一载体与第二载体共面，并将封装封装模制在第一载体周围并暴露第一载体。

公开(公告)号：US08810017B2

公开(公告)日：2014-08-19

申请号：US13536321

申请日：2012-06-28

申请人： Zigmund Ramirez Camacho ,  Dioscoro A. Merilo ,  Henry Descalzo Bathan ,  Lionel Chien Hui Tay

发明人： Zigmund Ramirez Camacho ,  Dioscoro A. Merilo ,  Henry Descalzo Bathan ,  Lionel Chien Hui Tay

IPC分类号： H01L23/495

CPC分类号： H01L24/11 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/28 ,  H01L23/3107 ,  H01L23/3128 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/17 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/81 ,  H01L24/85 ,  H01L24/92 ,  H01L24/97 ,  H01L25/0657 ,  H01L25/105 ,  H01L2221/68372 ,  H01L2224/16145 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48227 ,  H01L2224/48229 ,  H01L2224/48247 ,  H01L2224/4899 ,  H01L2224/49 ,  H01L2224/731 ,  H01L2224/732 ,  H01L2224/73207 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/8101 ,  H01L2224/81011 ,  H01L2224/81194 ,  H01L2224/81801 ,  H01L2224/81986 ,  H01L2224/85203 ,  H01L2224/85205 ,  H01L2224/8592 ,  H01L2224/85951 ,  H01L2224/92 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06582 ,  H01L2225/1023 ,  H01L2225/1029 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/37 ,  H01L2924/37001 ,  H01L2224/83 ,  H01L2224/85 ,  H01L2224/81 ,  H01L2924/00 ,  H01L2924/0105 ,  H01L2924/3512 ,  H01L2924/0665 ,  H01L2924/00014 ,  H01L2224/13 ,  H01L2224/45 ,  H01L2924/00012

摘要： A method of manufacture of an integrated circuit package system includes: attaching a first die to a first die pad; connecting electrically a second die to the first die through a die interconnect positioned between the first die and the second die; connecting a first lead adjacent the first die pad to the first die; connecting a second lead to the second die, the second lead opposing the first lead and adjacent the second die; and providing a molding material around the first die, the second die, the die interconnect, the first lead and the second lead, with a portion of the first lead exposed.

摘要翻译： 集成电路封装系统的制造方法包括：将第一管芯附接到第一管芯焊盘; 通过位于所述第一管芯和所述第二管芯之间的管芯互连件将第二管芯电连接到所述第一管芯; 将与所述第一管芯焊盘相邻的第一引线连接到所述第一管芯; 将第二引线连接到所述第二管芯，所述第二引线与所述第一引线相对并且邻近所述第二管芯; 以及在所述第一裸片，所述第二裸片，芯片互连，所述第一引线和所述第二引线周围提供模制材料，所述第一引线的一部分被暴露。

公开(公告)号：US08502371B2

公开(公告)日：2013-08-06

申请号：US11965550

申请日：2007-12-27

申请人： Zigmund Ramirez Camacho ,  Lionel Chien Hui Tay ,  Jairus Legaspi Pisigan ,  Henry Descalzo Bathan

发明人： Zigmund Ramirez Camacho ,  Lionel Chien Hui Tay ,  Jairus Legaspi Pisigan ,  Henry Descalzo Bathan

IPC分类号： H01L23/48 ,  H01L21/00

CPC分类号： H01L23/495 ,  H01L23/552 ,  H01L2924/0002 ,  H01L2924/00

摘要： An integrated circuit package system including: forming a die pad, wherein the die pad has a tiebar at a corner; forming a lead wherein the lead is connected to the tiebar; connecting an integrated circuit die to the die pad; and forming an encapsulation, having an edge, over the integrated circuit die with the lead extending from and beyond the edge.

摘要翻译： 一种集成电路封装系统，包括：形成管芯焊盘，其中所述管芯焊盘在拐角处具有连接杆; 形成引线，其中引线连接到连接杆; 将集成电路管芯连接到管芯焊盘; 以及在所述集成电路裸片上形成具有边缘的封装，所述引线从所述边缘延伸出并超过所述边缘。

公开(公告)号：US08389332B2

公开(公告)日：2013-03-05

申请号：US13197122

申请日：2011-08-03

申请人： Zigmund Ramirez Camacho ,  Henry Descalzo Bathan ,  Lionel Chien Hui Tay ,  Jose Alvin Caparas

发明人： Zigmund Ramirez Camacho ,  Henry Descalzo Bathan ,  Lionel Chien Hui Tay ,  Jose Alvin Caparas

IPC分类号： H01L21/00

CPC分类号： H01L23/49551 ,  H01L23/49541 ,  H01L23/49548 ,  H01L24/48 ,  H01L24/49 ,  H01L24/83 ,  H01L24/85 ,  H01L2224/32245 ,  H01L2224/45014 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/49109 ,  H01L2224/73265 ,  H01L2224/83 ,  H01L2224/85 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01074 ,  H01L2924/01076 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/078 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2924/00012

摘要： A method of manufacture of an integrated circuit packaging system includes: providing a lead frame having a die attach paddle, an isolated pad, and a connector; attaching an integrated circuit die to the die attach paddle and the connector; forming an encapsulation over the integrated circuit die, the connector, the die attach paddle, and the isolated pad; and singulating the connector and the die attach paddle whereby the isolated pads are electrically isolated.

摘要翻译： 一种制造集成电路封装系统的方法，包括：提供具有管芯附接焊盘，隔离焊盘和连接器的引线框架; 将集成电路管芯连接到管芯附接焊盘和连接器; 在集成电路管芯，连接器，管芯附接焊盘和隔离焊盘上形成封装; 并且分离连接器和管芯附接板，由此隔离焊盘被电隔离。

公开(公告)号：US20120261808A1

公开(公告)日：2012-10-18

申请号：US13536321

申请日：2012-06-28

申请人： Zigmund Ramirez Camacho ,  Dioscoro A. Merilo ,  Henry Descalzo Bathan ,  Lionel Chien Hui Tay

发明人： Zigmund Ramirez Camacho ,  Dioscoro A. Merilo ,  Henry Descalzo Bathan ,  Lionel Chien Hui Tay

IPC分类号： H01L23/495 ,  H01L21/50

CPC分类号： H01L24/11 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/28 ,  H01L23/3107 ,  H01L23/3128 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/17 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/81 ,  H01L24/85 ,  H01L24/92 ,  H01L24/97 ,  H01L25/0657 ,  H01L25/105 ,  H01L2221/68372 ,  H01L2224/16145 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48227 ,  H01L2224/48229 ,  H01L2224/48247 ,  H01L2224/4899 ,  H01L2224/49 ,  H01L2224/731 ,  H01L2224/732 ,  H01L2224/73207 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/8101 ,  H01L2224/81011 ,  H01L2224/81194 ,  H01L2224/81801 ,  H01L2224/81986 ,  H01L2224/85203 ,  H01L2224/85205 ,  H01L2224/8592 ,  H01L2224/85951 ,  H01L2224/92 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06582 ,  H01L2225/1023 ,  H01L2225/1029 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/37 ,  H01L2924/37001 ,  H01L2224/83 ,  H01L2224/85 ,  H01L2224/81 ,  H01L2924/00 ,  H01L2924/0105 ,  H01L2924/3512 ,  H01L2924/0665 ,  H01L2924/00014 ,  H01L2224/13 ,  H01L2224/45 ,  H01L2924/00012

摘要： A method of manufacture of an integrated circuit package system includes: attaching a first die to a first die pad; connecting electrically a second die to the first die through a die interconnect positioned between the first die and the second die; connecting a first lead adjacent the first die pad to the first die; connecting a second lead to the second die, the second lead opposing the first lead and adjacent the second die; and providing a molding material around the first die, the second die, the die interconnect, the first lead and the second lead, with a portion of the first lead exposed.

摘要翻译： 集成电路封装系统的制造方法包括：将第一管芯附接到第一管芯焊盘; 通过位于所述第一管芯和所述第二管芯之间的管芯互连件将第二管芯电连接到所述第一管芯; 将与所述第一管芯焊盘相邻的第一引线连接到所述第一管芯; 将第二引线连接到所述第二管芯，所述第二引线与所述第一引线相对并且邻近所述第二管芯; 以及在所述第一裸片，所述第二裸片，芯片互连，所述第一引线和所述第二引线周围提供模制材料，所述第一引线的一部分被暴露。