METHOD AND APPARATUS FOR MEASURING THE TEMPERATURE OF A SHEET MATERIAL
    51.
    发明申请
    METHOD AND APPARATUS FOR MEASURING THE TEMPERATURE OF A SHEET MATERIAL 有权
    测量材料温度的方法和装置

    公开(公告)号:US20110018721A1

    公开(公告)日:2011-01-27

    申请号:US12848038

    申请日:2010-07-30

    Abstract: A method of measuring the temperature of a sheet material in which the sheet material is arranged such that it forms at least one side of a cavity so as to enhance the effective emissivity of the sheet material in the vicinity of the cavity. The method involves a) generating a thermal image of at least part of the inside of the cavity using a thermal imaging device to detect radiation emitted by the cavity, the thermal image comprising a plurality of pixels each having a pixel value representative of radiation emitted by a respective region of the cavity; b) identifying a first subset of the plurality of pixels whose pixel values meet predetermined criteria; c) using the identified first subset of pixels to determine a line on the thermal image representative of optimal emissivity enhancement in the cavity; and d) selecting a second subset of the plurality of pixels based on the determined line and generating a temperature profile along the determined line derived from the pixel values associated with each of the second subset of pixels.

    Abstract translation: 一种测量片状材料的温度的方法,其中片材被布置成使得其形成空腔的至少一侧,以便提高片材在空腔附近的有效辐射率。 该方法包括:a)使用热成像装置产生腔内部的至少一部分的热图像,以检测腔体发射的辐射,该热图像包括多个像素,每个像素具有代表由 空腔的相应区域; b)识别其像素值满足预定标准的多个像素的第一子集; c)使用所识别的第一子像素来确定表示所述空腔中的最佳发射率增强的热图像上的线; 以及d)基于所确定的线选择所述多个像素的第二子集,并且沿着与所述第二子像素中的每一个相关联的像素值导出的所确定的线产生温度曲线。

    POLISHING METHOD AND POLISHING APPARATUS
    52.
    发明申请

    公开(公告)号:US20190118334A1

    公开(公告)日:2019-04-25

    申请号:US16226497

    申请日:2018-12-19

    Abstract: A polishing method and a polishing apparatus which can increase a polishing rate and can control a polishing profile of a substrate being polished by adjusting a surface temperature of a polishing pad are disclosed. The polishing method for polishing a substrate by pressing the substrate against a polishing pad on a polishing table includes a pad temperature adjustment step of adjusting a surface temperature of the polishing pad, and a polishing step of polishing the substrate by pressing the substrate against the polishing pad having the adjusted surface temperature. In the pad temperature adjustment step, the surface temperature of a part of an area of the polishing pad, the area being to be brought in contact with the substrate, is adjusted during the polishing step so that the rate of temperature change of a temperature profile in a radial direction of the surface of the polishing pad becomes constant in the radial direction of the polishing pad.

    Polishing method and polishing apparatus

    公开(公告)号:US10035238B2

    公开(公告)日:2018-07-31

    申请号:US15696926

    申请日:2017-09-06

    Abstract: A polishing method and a polishing apparatus which can increase a polishing rate and can control a polishing profile of a substrate being polished by adjusting a surface temperature of a polishing pad are disclosed. The polishing method for polishing a substrate by pressing the substrate against a polishing pad on a polishing table includes a pad temperature adjustment step of adjusting a surface temperature of the polishing pad, and a polishing step of polishing the substrate by pressing the substrate against the polishing pad having the adjusted surface temperature. In the pad temperature adjustment step, the surface temperature of a part of an area of the polishing pad, the area being to be brought in contact with the substrate, is adjusted during the polishing step so that the rate of temperature change of a temperature profile in a radial direction of the surface of the polishing pad becomes constant in the radial direction of the polishing pad.

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