公开(公告)号：US12046812B2

公开(公告)日：2024-07-23

申请号：US17607331

申请日：2020-04-22

Applicant: Honor Device Co., Ltd.

Inventor： Yuanpeng Li ,  Lanchao Zhang ,  Jian Luo

IPC: H01Q1/52 ,  H01Q1/24 ,  H01Q5/307 ,  H01Q9/04 ,  H01Q21/28

CPC classification number: H01Q1/521 ,  H01Q1/243 ,  H01Q5/307 ,  H01Q9/045 ,  H01Q21/28

Abstract: This application provides an antenna assembly. The antenna assembly includes at least a first antenna and a second antenna. The first antenna includes a first feed point and a first radiator connected thereto. The second antenna includes a second feed point and a second radiator connected thereto. There is a gap between the first radiator and the second radiator. An end of the second radiator close to the gap is provided with a first ground wire shared by the first antenna and the second antenna. An end of the second radiator away from the gap is provided with a second ground wire. Because currents excited by the first antenna and the second antenna are orthogonally complementary, crosstalk does not occur between the ground currents of the first antenna and the second antenna.

公开(公告)号：US20240243474A1

公开(公告)日：2024-07-18

申请号：US18153925

申请日：2023-01-12

Applicant: NETGEAR, Inc.

Inventor： Ting Chih Tseng ,  Che Yen Huang

IPC: H01Q5/10 ,  H01Q1/22 ,  H01Q1/52 ,  H01Q5/307

CPC classification number: H01Q5/10 ,  H01Q1/2291 ,  H01Q1/526 ,  H01Q5/307

Abstract: An antenna for reducing Electromagnetic Interference (EMI) using a dielectric insert with a feedline tunnel is disclosed. The antenna comprises a first metallic portion, a second metallic portion, a plastic insert, and a cable. The first and second metallic portions held together by the plastic insert, which bridges a gap separating both portions. Both portions include trough-shaped shells and conduits, the conduits configured to be disposed inside the shells and connected to the shells. The cable is configured to pass through a tunnel belonging to the plastic insert and configured to communicate signals to the antenna, the cable comprising an electrically insulative shielding configured to be grounded to one of the metallic portions, and an electrically conductive core encapsulated by the shielding and configured to be connected to the other metallic portion.

公开(公告)号：US12040543B2

公开(公告)日：2024-07-16

申请号：US17648730

申请日：2022-01-24

Applicant: Infineon Technologies AG

Inventor： Walter Hartner ,  Tuncay Erdoel ,  Klaus Elian ,  Christian Geissler ,  Bernhard Rieder ,  Rainer Markus Schaller ,  Horst Theuss ,  Maciej Wojnowski

IPC: H01Q13/06 ,  H01Q1/22 ,  H01Q1/52 ,  H01Q23/00

CPC classification number: H01Q13/06 ,  H01Q1/2283 ,  H01Q1/526 ,  H01Q23/00

Abstract: A radio-frequency device comprises a printed circuit board and a radio-frequency package having a radio-frequency chip and a radio-frequency radiation element, the radio-frequency package being mounted on the printed circuit board. The radio-frequency device furthermore comprises a waveguide component having a waveguide, wherein the radio-frequency radiation element is configured to radiate transmission signals into the waveguide and/or to receive reception signals via the waveguide. The radio-frequency device furthermore comprises a gap arranged between a first side of the radio-frequency package and a second side of the waveguide component, and a shielding structure, which is configured: to permit a relative movement between the radio-frequency package and the waveguide component in a first direction perpendicular to the first side of the radio-frequency package, and to shield the transmission signals and/or the reception signals in such a way that a propagation of the signals via the gap is attenuated or prevented.

公开(公告)号：US20240235017A9

公开(公告)日：2024-07-11

申请号：US18496452

申请日：2023-10-27

Applicant: RFS Technologies, Inc.

Inventor： Kostyantyn Semonov ,  Chengyu Xu ,  Yaohuan Li

IPC: H01Q1/52 ,  H01Q1/24 ,  H01Q1/36 ,  H01Q5/48 ,  H01Q9/28 ,  H01Q9/44 ,  H01Q15/14 ,  H01Q19/10 ,  H01Q21/08 ,  H01Q21/24 ,  H01Q21/26 ,  H01Q21/28

CPC classification number: H01Q1/521 ,  H01Q1/246 ,  H01Q1/36 ,  H01Q5/48 ,  H01Q9/28 ,  H01Q9/44 ,  H01Q15/14 ,  H01Q19/108 ,  H01Q21/08 ,  H01Q21/24 ,  H01Q21/26 ,  H01Q21/28

Abstract: The present disclosure provides a low band dipole and a multi-band multi-port antenna arrangement, wherein the low band dipole has four dipole arms, and the four dipole arms are horizontally and mutually perpendicularly placed in a “+” shape and adjacent two mutually perpendicular dipole arms are fed therebetween. The antenna arrangement includes a main reflector, at least one column of low band dipole array disposed on the main reflector, and at least one column of high band dipole array adjacent to the at least one column of the low band dipole array, wherein at least one low band dipole in each column of the at least one column of low band dipole array satisfies the following condition: the low band dipole has four dipole arms, and the four dipole arms are horizontally and mutually perpendicularly placed in a “+” shape, and adjacent two mutually perpendicular dipole arms are fed therebetween to form a +/−45 degree polarization. The multi-band multi-port antenna arrangement solves the problem that the high and low band dipole arms shield each other and reduces the mutual coupling between the high and low band dipoles by adopting the above-mentioned structure of the low band dipole.

公开(公告)号：US12034232B2

公开(公告)日：2024-07-09

申请号：US17234988

申请日：2021-04-20

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Ryo Komura ,  Yoshiki Yamada

IPC: H01Q9/04 ,  H01Q1/24 ,  H01Q1/52

CPC classification number: H01Q9/0421 ,  H01Q1/243 ,  H01Q1/52

Abstract: An antenna module includes a dielectric substrate, a radiation electrode, a ground electrode, and a current-interrupting element. The radiation electrode is disposed in a layer of the dielectric substrate, and the ground electrode is disposed in another layer of the dielectric substrate. The current-interrupting element is electrically connected to the ground electrode. The current-interrupting element is configured to interrupt a current flowing through the ground electrode. The current-interrupting element has a first edge portion electrically connected to the ground electrode and a second edge portion left open and includes a planar electrode parallel to the ground electrode. The dimension of the current-interrupting element in the direction from the first edge portion to the second edge portion is about λ/4, where λ is the wavelength of a radio-frequency signal radiated from the radiation electrode.

公开(公告)号：US12034202B2

公开(公告)日：2024-07-09

申请号：US17531452

申请日：2021-11-19

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sinhyung Jeon ,  Soohyun Seo ,  Jongwan Shim ,  Minwoo Yoo ,  Byounguk Yoon ,  Jongchul Choi

IPC: H01Q1/24 ,  H01Q1/52 ,  H01Q5/307 ,  H04M1/02 ,  H05K9/00

CPC classification number: H01Q1/243 ,  H01Q1/52 ,  H01Q5/307 ,  H04M1/0268 ,  H05K9/005

Abstract: According to various embodiments of the disclosure, an electronic device may include: a housing, a rollable display, a shielding case disposed inside the housing and surrounding at least a part of the rollable display, and including a first opening accommodating the rollable display, and a first antenna structure including at least one antenna disposed in an area outside the shielding case.

公开(公告)号：US12027478B2

公开(公告)日：2024-07-02

申请号：US17846596

申请日：2022-06-22

Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.

Inventor： Feng-Wei Kuo ,  Wen-Shiang Liao

IPC: H01L23/66 ,  H01L21/48 ,  H01L21/56 ,  H01L21/683 ,  H01L23/00 ,  H01L23/31 ,  H01L23/538 ,  H01Q1/52 ,  H01Q9/04

CPC classification number: H01L23/66 ,  H01L21/4853 ,  H01L21/4857 ,  H01L21/565 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/3128 ,  H01L23/5383 ,  H01L23/5386 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/20 ,  H01Q1/52 ,  H01Q9/0407 ,  H01L2221/68372 ,  H01L2223/6677 ,  H01L2224/214

Abstract: A method of forming a semiconductor structure includes forming a first redistribution structure including a first conductive pattern. The method further includes placing a die over the first redistribution structure. The method further includes disposing a molding material over the first redistribution structure to surround the die. The method further includes removing a portion of the molding material to form an opening. The method further includes disposing a dielectric material into the opening to form a dielectric member. The method further includes forming a second redistribution structure over the molding material and the dielectric member, wherein the second redistribution structure includes an antenna structure over the dielectric member and electrically connected to the die.

公开(公告)号：US20240214032A1

公开(公告)日：2024-06-27

申请号：US18596180

申请日：2024-03-05

Applicant: ISCO International. LLC

Inventor： Amr Abdelmonem ,  Igor Goodman ,  Pablo Tacconi

IPC: H04B5/72 ,  H01Q1/52 ,  H01Q3/36 ,  H01Q21/24 ,  H04B1/04 ,  H04B1/10 ,  H04B1/12 ,  H04B7/00 ,  H04B7/0413 ,  H04B7/08 ,  H04B7/10 ,  H04B7/155 ,  H04B17/10 ,  H04B17/18 ,  H04B17/336 ,  H04B17/345 ,  H04B17/382 ,  H04J11/00 ,  H04L5/14 ,  H04L25/03 ,  H04W24/08 ,  H04W72/541

CPC classification number: H04B5/72 ,  H01Q1/523 ,  H01Q3/36 ,  H01Q21/245 ,  H04B1/0475 ,  H04B1/10 ,  H04B1/12 ,  H04B7/002 ,  H04B7/0413 ,  H04B7/084 ,  H04B7/10 ,  H04B7/15557 ,  H04B7/15571 ,  H04B17/18 ,  H04B17/336 ,  H04B17/345 ,  H04B17/382 ,  H04J11/0023 ,  H04L5/14 ,  H04L25/03821 ,  H04W24/08 ,  H04W72/541 ,  H04B17/102

Abstract: Aspects of the subject disclosure may include, for example, obtaining data regarding interference detected in a received communication signal, and performing phase adjusting for one or more radiating elements of an antenna system such that an impact of the interference on the antenna system is minimized. Other embodiments are disclosed.

公开(公告)号：US20240209632A1

公开(公告)日：2024-06-27

申请号：US18411751

申请日：2024-01-12

Applicant: BMIC LLC

Inventor： Zachary Richard Campau ,  Xavier Riley

IPC: E04D1/30 ,  D04H1/4218 ,  D04H1/4234 ,  D04H1/64 ,  D04H1/732 ,  E04B1/92 ,  E04D1/22 ,  E04D7/00 ,  E04D12/00 ,  H01Q1/52

CPC classification number: E04D1/30 ,  D04H1/4218 ,  D04H1/4234 ,  D04H1/732 ,  E04D1/22 ,  E04D7/00 ,  E04D12/002 ,  H01Q1/526 ,  D04H1/64 ,  D10B2101/20 ,  D10B2505/18 ,  E04B1/92 ,  E04B2001/925 ,  E04D2001/308

Abstract: At least some embodiments of the present disclosure provide a roofing accessory that includes a radiofrequency radiation shielding non-woven fiber composite material. The radiofrequency shielding non-woven fiber composite material includes a first fiber type that includes a conductive material, where the radiofrequency shielding non-woven fiber composite material has a sufficient amount of the first fiber type so as to result, when the radiofrequency shielding non-woven fiber composite material is positioned on a roof structure, in the radiofrequency shielding non-woven fiber composite material allowing for shielding a predetermined percentage of electromagnetic radiation passing through the roof structure. The radiofrequency shielding non-woven fiber composite material includes a second fiber type that includes a non-conductive material. The first fiber type and the second fiber type are randomly dispersed within the radiofrequency shielding non-woven fiber composite.

公开(公告)号：US12021306B2

公开(公告)日：2024-06-25

申请号：US17511153

申请日：2021-10-26

Applicant: Raytheon Company

Inventor： Thomas V. Sikina ,  John P. Haven ,  James E. Benedict ,  Jonathan E. Nufio-Molina ,  Andrew R. Southworth

IPC: H01Q21/00 ,  B33Y10/00 ,  B33Y80/00 ,  H01P1/04 ,  H01P5/02 ,  H01Q1/42 ,  H01Q1/44 ,  H01Q1/52 ,  H01Q13/10 ,  H01Q13/18 ,  H01Q17/00 ,  H05K1/02 ,  H05K3/40

CPC classification number: H01Q21/0087 ,  H01P1/047 ,  H01P5/028 ,  H01Q1/42 ,  H01Q1/44 ,  H01Q1/523 ,  H01Q1/526 ,  H01Q13/10 ,  H01Q13/106 ,  H01Q13/18 ,  H01Q17/001 ,  H01Q17/008 ,  H01Q21/0075 ,  H05K1/0219 ,  H05K3/4038 ,  B33Y10/00 ,  B33Y80/00

Abstract: A low profile array (LPA) includes an antenna element array layer having at least one Faraday wall, and a beamformer circuit layer coupled to the antenna element array layer. The beamformer circuit layer has at least one Faraday wall. The Faraday walls extends between ground planes associated with at least one of the antenna element array layer and the beamformer circuit layer.