THERMALLY CONDUCTIVE TYPE POLYIMIDE SUBSTRATE

    公开(公告)号:US20190002641A1

    公开(公告)日:2019-01-03

    申请号:US15928994

    申请日:2018-03-22

    摘要: A thermally conductive type polyimide substrate is provided. The substrate comprises at least one insulating layer having a metal layer on a single side or both sides thereof. The material of the insulating layer is a thermally conductive type photosensitive resin having a thermal conductivity of 0.4 to 2, and the thermally conductive type photosensitive resin includes the following components: (a) a photosensitive polyimide, (b) an inorganic filler, and (c) a silica solution. The photosensitive polyimide accounts for 50 to 70% of a total weight of a solid composition of the thermally conductive type photosensitive resin. The inorganic filler accounts for 20-30% of the total weight of the solid composition of the thermally conductive type photosensitive resin, and has a particle size between 40 nm and 5 μm. The silica solution comprises silica particles polymerized by a sol-gel process, and the silica particles have a particle size between 10 nm and 15 nm and account for 5 to 30% of the total weight of the solid composition of the thermally conductive type photosensitive resin.

    Thermally conductive silicone composition and electrical/electronic apparatus

    公开(公告)号:US10150902B2

    公开(公告)日:2018-12-11

    申请号:US15302555

    申请日:2015-03-26

    摘要: Provided are a thermally conductive silicone composition excelling in heat resistance and thermal conductivity, in which thickening in an uncured state is suppressed, and which has excellent handling ease; and an electrical/electronic apparatus in which the thermally conductive silicone composition is used as a member.The thermally conductive silicone composition comprises (A) 100 parts by mass of either i) (a1) an organopolysiloxane having, in each molecule thereof, at least one alkoxysilyl-containing group bonded to a silicon atom and expressed by the general formula: and as generally described herein, or ii) a mixture of component (a1) and (a2) an organopolysiloxane having in each molecule thereof, at least two alkenyl groups but not the alkoxysilyl-containing group. In the mixture, the content of component (a1) is 10 to less than 100 mass %. The thermally conductive silicone composition further comprises (B) 400 to 3,500 parts by mass of a thermally conductive filler.

    Modification of layered double hydroxides

    公开(公告)号:US10131548B2

    公开(公告)日:2018-11-20

    申请号:US15168783

    申请日:2016-05-31

    摘要: The present invention relates to a process for modifying a layered double hydroxide (LDH), the process comprising, a. providing a material comprising a layered double hydroxide of formula: [Mz+1-xM′y+x(OH)2]q+(Xn−)q/n.bH2O wherein M and M′ are metal cations, z is 1 or 2, x is 0.1 to 1, b is 0 to 5, y is 3 or 4, X is an anion, n is 1 to 3 and q is determined by x, y and z, b. optionally washing the material at least once with a mixture of water and a mixing solvent miscible with water, and c. washing the material obtained in step a or b at least once with at least one first solvent, the first solvent being miscible with water and having a solvent polarity P′.