公开(公告)号：US20110170317A1

公开(公告)日：2011-07-14

申请号：US13069080

申请日：2011-03-22

申请人： BILY WANG ,  JONNIE CHUANG

发明人： BILY WANG ,  JONNIE CHUANG

IPC分类号： F21V7/22

CPC分类号： G02B6/0023

摘要： A light-guiding structure with phosphor material layers includes a light-guiding unit, a light-emitting unit and a phosphor unit. The light-emitting unit is disposed beside an outer lateral side of the light-guiding unit. The phosphor unit is connected with the light-guiding unit and is disposed between the light-guiding unit and the light-emitting unit. In addition, the phosphor unit is formed or pasted on the lateral side of the light-guiding unit, and the light-emitting unit has a PCB substrate and a plurality of light-emitting elements electrically disposed on the PCB substrate and facing the light-guiding unit. Hence, light beams generated by the light-emitting elements of the light-emitting unit pass through the phosphor unit to form another light beams, and the light beams are guided into the light-guiding unit. Finally, the light beams are projected out from a light-exiting face of the light-guiding unit.

摘要翻译： 具有荧光体材料层的导光结构包括导光单元，发光单元和荧光体单元。 发光单元设置在导光单元的外侧的旁边。 荧光体单元与导光单元连接并设置在导光单元和发光单元之间。 此外，荧光体单元形成或粘贴在导光单元的侧面上，并且发光单元具有PCB基板和多个发光元件，电气设置在PCB基板上并面对发光元件， 指导单位 因此，由发光单元的发光元件产生的光束通过荧光体单元以形成另一个光束，并且光束被引导到导光单元中。 最后，光束从导光单元的光出射面突出。

公开(公告)号：US07828464B2

公开(公告)日：2010-11-09

申请号：US11984447

申请日：2007-11-19

申请人： Bily Wang ,  Jonnie Chuang ,  Shih-Yu Wu

发明人： Bily Wang ,  Jonnie Chuang ,  Shih-Yu Wu

IPC分类号： F21V29/00

CPC分类号： F21V29/83 ,  F21K9/00 ,  F21V29/70 ,  F21V29/71 ,  F21V29/773

摘要： An LED lamp structure with high-efficiency heat-dissipating function includes a heat-dissipating module, a light-emitting module, a power-transmitting module, and a casing module. The heat-dissipating module has a plurality of heat-dissipating fins, and the heat-dissipating fins are combined together to form a radial shape and a receiving space. The light-emitting module is received in the receiving space of the heat-dissipating module. The power-transmitting module is electrically connected with the light-emitting module. The casing module has a top board body, a bottom board body mated with the top board body, and a joint board body disposed between the top board body and the heat-dissipating fins. Both the top board body and the joint board body have an opening for exposing the light-emitting module. Each heat-dissipating fin has a top side contacted with the joint board body and a bottom side separated from the bottom board body by a predetermined distance.

摘要翻译： 具有高效散热功能的LED灯具结构包括散热模块，发光模块，电力传输模块和壳体模块。 散热模块具有多个散热翅片，并且散热翅片组合在一起形成径向形状和容纳空间。 发光模块被接收在散热模块的接收空间中。 电力传输模块与发光模块电连接。 套管模块具有顶板主体，与顶板主体配合的底板体，以及设置在顶板主体和散热翅片之间的接合板体。 顶板主体和联合板体均具有用于使发光模块曝光的开口。 每个散热翅片具有与接合板体接触的顶面和与底板主体分离预定距离的底侧。

公开(公告)号：US07741648B2

公开(公告)日：2010-06-22

申请号：US11976340

申请日：2007-10-24

申请人： Bily Wang ,  Jonnie Chuang ,  Chia-Hung Chen

发明人： Bily Wang ,  Jonnie Chuang ,  Chia-Hung Chen

IPC分类号： H01L29/18

CPC分类号： H01L33/483 ,  H01L33/62 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/09701 ,  H01L2924/00014

摘要： An LED chip package structure includes a ceramic substrate, a conductive unit, a hollow ceramic casing, many LED chips, and a package colloid. The ceramic substrate has a main body, many protrusions extended from the main body, many penetrating holes respectively penetrating through the protrusions, and many half through holes formed on a lateral side of the main body and respectively formed between each two protrusions. The conductive unit has many first conductive layers respectively formed on the protrusions, many second conductive layers respectively formed on inner surfaces of the half through holes and a bottom face of the main body, and many third conductive layers respectively filled in the penetrating holes. The hollow ceramic casing is fixed on the main body to form a receiving space. The LED chips is received in the receiving space. The package colloid is filled in the receiving space for covering the LED chips.

摘要翻译： LED芯片封装结构包括陶瓷基板，导电单元，中空陶瓷外壳，许多LED芯片和封装胶体。 陶瓷基板具有主体，从主体延伸的许多突起，分别穿过突起的许多穿透孔和形成在主体的侧面上并分别形成在每个两个突起之间的许多半通孔。 导电单元具有分别形成在突起上的许多第一导电层，分别形成在半通孔的内表面上的许多第二导电层和主体的底面，以及分别填充在穿透孔中的许多第三导电层。 中空陶瓷壳体固定在主体上以形成容纳空间。 LED芯片被接收在接收空间中。 包装胶体填充在用于覆盖LED芯片的接收空间中。

公开(公告)号：US07662661B2

公开(公告)日：2010-02-16

申请号：US11304558

申请日：2005-12-16

申请人： Bily Wang ,  Jonnie Chuang ,  Hui-Yen Huang

发明人： Bily Wang ,  Jonnie Chuang ,  Hui-Yen Huang

IPC分类号： H01L21/66 ,  G01R31/26 ,  H01L21/00 ,  H01L21/50 ,  H01L21/48 ,  H01L21/44

CPC分类号： H05K3/0052 ,  H05K1/056 ,  H05K3/445 ,  H05K2201/09881 ,  H05K2203/0228 ,  H05K2203/0278 ,  H05K2203/1536

摘要： A method of manufacturing a substrate structure includes the steps of: (1) providing a metal substrate having a metal portion; (2) chemically etching a plurality of trenches in the metal substrate; (3) applying a polymer composite material into the trenches to form a substrate having a polymer composite portion abutted to the metal portion; (4) polishing a surface of the substrate to make a height of the polymer composite portion equal to that of the metal portion; (5) forming a covering material on the surface of the substrate; and (6) cutting the substrate via the polymer composite portion for decreasing cutting bur produced on the metal portion. Furthermore, the method is provided for combining the metal substrate and the polymer composite material, thereby to increase cutting precision and strength of the substrate structure.

摘要翻译： 一种制造衬底结构的方法包括以下步骤：（1）提供具有金属部分的金属衬底; （2）化学蚀刻金属基板中的多个沟槽; （3）将聚合物复合材料施加到沟槽中以形成具有与金属部分邻接的聚合物复合部分的基底; （4）研磨基板的表面，使聚合物复合部的高度与金属部的高度相等; （5）在基板的表面上形成覆盖材料; 和（6）通过聚合物复合部分切割基底以减少在金属部分上产生的切割毛刺。 此外，提供了用于组合金属基板和聚合物复合材料的方法，从而提高基板结构的切割精度和强度。

公开(公告)号：US20090152574A1

公开(公告)日：2009-06-18

申请号：US12379258

申请日：2009-02-18

申请人： Bily Wang ,  Jonnie Chuang ,  Chuan-Fa Lin

发明人： Bily Wang ,  Jonnie Chuang ,  Chuan-Fa Lin

IPC分类号： H01L33/00

CPC分类号： C09K11/7787 ,  C09K11/7789 ,  C09K11/7794 ,  F21K9/00 ,  H01L33/505 ,  H01L33/507 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  Y02B20/181 ,  H01L2924/00014

摘要： A multi-wavelength white light-emitting structure uses a UV light emitting diode chip and a blue light emitting diode chip to excite a red phosphor and a green phosphor and generates a white light-emitting structure having good color rendering. The multi-wavelength white light-emitting structure uses a UV light emitting diode chip that emits light having a wavelength of between 350˜430 nm to excite a red phosphor to emit red light having a wavelength of between 600˜700 nm. The present invention then uses a blue light emitting diode chip that emits light having a wavelength between of 400˜500 nm to emit blue light and uses the blue light emitting diode chip to excite a green phosphor to emit green light having a wavelength of between 490˜560 nm. Mixing the red light, the blue light and the green light forms a white light.

摘要翻译： 多波长白色发光结构使用UV发光二极管芯片和蓝色发光二极管芯片来激发红色荧光体和绿色荧光体，并产生具有良好显色性能的白色发光结构。 多波长白色发光结构使用发射波长在350〜430nm之间的光的UV发光二极管芯片，以激发红色荧光体发射波长在600〜700nm之间的红色光。 然后，本发明使用发射波长在400〜500nm之间的光的蓝色发光二极管芯片发射蓝色光并使用蓝色发光二极管芯片来激发绿色荧光体，发出波长在490nm之间的绿色光 〜560nm。 混合红光，蓝光和绿光形成白光。

公开(公告)号：US20090020770A1

公开(公告)日：2009-01-22

申请号：US11779556

申请日：2007-07-18

申请人： Bily Wang ,  Jonnie Chuang ,  Wen-Kuei Wu

发明人： Bily Wang ,  Jonnie Chuang ,  Wen-Kuei Wu

IPC分类号： H01L33/00 ,  H01L21/00

CPC分类号： B29C45/14655 ,  B29C33/0022 ,  F21K9/00 ,  F21K9/20 ,  F21Y2103/10 ,  F21Y2115/10 ,  G09F9/33 ,  G09F13/22 ,  H01L24/97 ,  H01L33/52 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/12041 ,  H01L2924/15747 ,  H01L2924/15787 ,  H01L2224/81 ,  H01L2924/00014 ,  H01L2224/85 ,  H01L2924/00

摘要： An LED chip package structure with high-efficiency light-emitting effect includes a substrate unit, a light-emitting unit, and a package colloid unit. The substrate unit has a substrate body, and a positive electrode trace and a negative electrode trace respectively formed on the substrate body. The light-emitting unit has a plurality of LED chips arranged on the substrate body, and each LED chip has a positive electrode side and a negative electrode side respectively and electrically connected with the positive electrode trace and the negative electrode trace of the substrate unit. The package colloid unit has a plurality of package colloids respectively covered on the LED chips.

摘要翻译： 具有高效率发光效果的LED芯片封装结构包括基板单元，发光单元和封装胶体单元。 基板单元具有分别形成在基板主体上的基板主体和正极迹线和负极迹线。 发光单元具有布置在基板主体上的多个LED芯片，并且每个LED芯片分别具有正极侧和负极侧，并与基板单元的正极迹线和负极迹线电连接。 封装胶体单元具有分别覆盖在LED芯片上的多个封装胶体。

公开(公告)号：US20090008656A1

公开(公告)日：2009-01-08

申请号：US11976340

申请日：2007-10-24

申请人： Bily Wang ,  Jonnie Chuang ,  Chia-Hung Chen

发明人： Bily Wang ,  Jonnie Chuang ,  Chia-Hung Chen

IPC分类号： H01L33/00

CPC分类号： H01L33/483 ,  H01L33/62 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/09701 ,  H01L2924/00014

摘要： An LED chip package structure includes a ceramic substrate, a conductive unit, a hollow ceramic casing, many LED chips, and a package colloid. The ceramic substrate has a main body, many protrusions extended from the main body, many penetrating holes respectively penetrating through the protrusions, and many half through holes formed on a lateral side of the main body and respectively formed between each two protrusions. The conductive unit has many first conductive layers respectively formed on the protrusions, many second conductive layers respectively formed on inner surfaces of the half through holes and a bottom face of the main body, and many third conductive layers respectively filled in the penetrating holes. The hollow ceramic casing is fixed on the main body to form a receiving space. The LED chips is received in the receiving space. The package colloid is filled in the receiving space for covering the LED chips.

公开(公告)号：US20080012035A1

公开(公告)日：2008-01-17

申请号：US11483619

申请日：2006-07-11

申请人： Bily Wang ,  Jonnie Chuang ,  Wen-Kuei Wu

发明人： Bily Wang ,  Jonnie Chuang ,  Wen-Kuei Wu

IPC分类号： H01L33/00 ,  H01L29/22

CPC分类号： G02B6/0073 ,  F21K9/00 ,  F21Y2103/10 ,  F21Y2115/10 ,  H01L25/0753 ,  H01L2924/0002 ,  H01L2924/00

摘要： An LED chip package structure includes a substrate unit, a light-emitting unit, and a colloid unit. The substrate unit has a substrate body, and a positive electrode trace and a negative electrode trace is respectively formed on the substrate body. The light-emitting unit has a plurality of LED chips arranged on the substrate body for generating light, wherein each of the LED chips has a positive side and a negative side respectively electrically connected with the positive electrode trace and the negative electrode trace. The colloid unit is covered over the substrate unit and the light-emitting unit for guiding the light from the light-emitting unit to form a series of light-generating areas on the colloid unit.

摘要翻译： LED芯片封装结构包括基板单元，发光单元和胶体单元。 基板单元具有基板主体，并且在基板主体上分别形成正极迹线和负极迹线。 发光单元具有布置在基板主体上用于产生光的多个LED芯片，其中每个LED芯片具有分别与正极迹线和负极迹线电连接的正侧和负极。 胶体单元被覆盖在基板单元和用于引导来自发光单元的光的发光单元上，以在胶体单元上形成一系列发光区域。

公开(公告)号：US20070290220A1

公开(公告)日：2007-12-20

申请号：US11455769

申请日：2006-06-20

申请人： Bily Wang ,  Jonnie Chuang ,  Hui-Yen Huang

发明人： Bily Wang ,  Jonnie Chuang ,  Hui-Yen Huang

IPC分类号： H01L33/00 ,  H01L29/22

CPC分类号： H01L33/486 ,  H01L33/56 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/00014

摘要： A package for an LED, comprises a metal substrate, at least one LED chip, and an insulative housing, wherein the metal substrate has a first terminal and a second terminal, and the first terminal is formed with a recess. The at least one LED chip is arranged in the recess of the first terminal of the metal substrate, wherein the chip is electrically connected with the first terminal and the second terminal of the metal substrate. Since the insulative housing caps the chip and the metal substrate, and the LED package can be reduced in size.

摘要翻译： 一种用于LED的封装，包括金属基板，至少一个LED芯片和绝缘壳体，其中所述金属基板具有第一端子和第二端子，并且所述第一端子形成有凹部。 所述至少一个LED芯片布置在所述金属基板的所述第一端子的所述凹部中，其中所述芯片与所述金属基板的所述第一端子和所述第二端子电连接。 由于绝缘壳体覆盖芯片和金属基板，并且LED封装的尺寸可以减小。

公开(公告)号：US20070133209A1

公开(公告)日：2007-06-14

申请号：US11297403

申请日：2005-12-09

申请人： Bily Wang ,  Jonnie Chuang ,  Shih-Yu Wu

发明人： Bily Wang ,  Jonnie Chuang ,  Shih-Yu Wu

IPC分类号： F21V29/00 ,  F21V5/00

CPC分类号： F21V23/007 ,  F21K9/233 ,  F21V29/70 ,  F21V29/89 ,  F21Y2115/10

摘要： An electrical lamp apparatus includes a shade, a light-emitting unit and a light-focusing unit. After a power plug on the shade is connected to a power socket of the electrical lamp apparatus, the power plug supplies electrical power to light the light-emitting unit. The light from the light-emitting unit passes to a convex lens through a second channel of a second end face of the light-focusing unit, and then the light is projected through a first channel of the first end face of the light-focusing unit, whereby the light can be projected to a farther place.

摘要翻译： 电灯装置包括遮光罩，发光单元和光聚焦单元。 在灯罩上的电源插头连接到电灯装置的电源插座之后，电源插头提供电力来点亮发光单元。 来自发光单元的光通过光聚焦单元的第二端面的第二通道传递到凸透镜，然后光通过聚光单元的第一端面的第一通道突出 由此可以将光投射到更远的地方。