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公开(公告)号：US11100673B2
公开(公告)日：2021-08-24
申请号：US15762378
申请日：2016-09-21
Applicant: Apple Inc.
Inventor： Matthew E. Last , Ricardo da Silveira Cabral , Daniel E. Potter , Paul Furgale
Abstract: Implementations described and claimed herein provide localization systems and methods using surface imaging. In one implementation, a raw image of a target surface is captured using at least one imager. The raw image is encoded into a template using at least one transform. The template specifies a course direction and an intensity gradient at one or more spatial frequencies of a pattern of the target surface. The template is compared to a subset of reference templates selected from a gallery stored in one or more storage media. A location of the target surface is identified when the template matches a reference template in the subset.
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公开(公告)号：US11048789B2
公开(公告)日：2021-06-29
申请号：US15972068
申请日：2018-05-04
Applicant: Apple Inc.
Inventor： Matthew E. Last
Abstract: A method of unlocking a locked device includes receiving a device identifier over a wireless communication protocol, determining if the device identifier is associated with a list of trusted devices, transmitting a request to generate an acoustic signal over the wireless communication protocol based on the determination, receiving the acoustic signal as an audio sound generated external to the locked device, estimating a distance between a source of the audio sound and the locked device, and unlocking the locked device based on the estimation.
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公开(公告)号：US20210165141A1
公开(公告)日：2021-06-03
申请号：US17153770
申请日：2021-01-20
Applicant: Apple Inc.
Inventor： Randol W. Aikin , Malcolm J. Northcott , Daniel E. Potter , Matthew E. Last
IPC: G02B5/124 , G01S17/74 , G01S7/481 , H01Q1/32 , G01S13/75 , H01Q15/18 , G02B5/128 , G08G1/095 , G08G1/0962 , G02B5/13 , B60R13/10 , G08G1/017 , G08G1/16 , H01Q15/14 , G01S17/931 , G01S17/06 , G05D1/02
Abstract: A retroreflector system including an outer body panel coupled to a vehicle, wherein the outer body panel is configured to allow a radar signal originating from an external radar device to pass through the outer body panel. The retroreflector system also includes a plurality of retroreflectors embedded in the vehicle, where the plurality of retroreflectors is configured to reflect the signal to the external signal source as a reflected signal, and where the plurality of retroreflectors is configured to have a peak reflectivity for a radar wavelength range or a light detection and ranging (lidar) wavelength range.
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公开(公告)号：US10222529B1
公开(公告)日：2019-03-05
申请号：US15703568
申请日：2017-09-13
Applicant: Apple Inc.
Inventor： Gregory A. Cohoon , Clarisse Mazuir , Matthew E. Last
IPC: F21V17/06 , F21V8/00 , B60Q3/208 , B60Q3/64 , F21S41/24 , F21S43/237 , F21S43/245 , B60Q1/30 , B60Q1/04 , B60Q1/44
Abstract: A lighting system may include one or more light sources and one or more light guides. A lighting system may be integrated into a window, a skylight, an exterior light such as a headlight, a tail light, or a high center-mounted stop light, or other exterior or interior portions of a system such as a vehicle. The light guide may be embedded in an adhesive layer in a vehicle structure. The light guide may be index-matched to the adhesive layer so that unilluminated portions of the light guide are indistinguishable from the vehicle structure. The light guide may be formed from optical fibers. The optical fibers may include a light-scattering optical fiber that scatters light out of the vehicle structure. The light-scattering optical fiber may be fused to a non-scattering optical fiber that guides light from a light source to the light-scattering optical fiber.
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公开(公告)号：US10012550B2
公开(公告)日：2018-07-03
申请号：US14943974
申请日：2015-11-17
Applicant: Apple Inc.
Inventor： Henry H. Yang , Matthew E. Last
CPC classification number: G01K7/02 , G01K1/16 , G01K7/00 , G01K13/00 , G06F1/16 , G06F3/002 , G06F3/02 , G06F3/0412
Abstract: An electronic device may be provided with electronic components such as buttons and environmental sensors. An environmental sensor may be temperature sensor for gathering temperature data associated with the environment surrounding the device. The temperature sensor may be mounted to a button member for the button. The button member may be an actuating member that moves within an opening in a device housing and that extends beyond an outer surface of the housing into the surrounding environment. The button member may be arranged so that an internal electronic switch is activated when the button member is moved within the opening. The button member may be thermally isolated from other device structures using insulating material on the button member. The button member may be formed from a thermally conductive material that transmits the temperature of environmental materials that contact the button member to the temperature sensor.
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Patent Agency Ranking
公开(公告)号：US09984271B1
公开(公告)日：2018-05-29
申请号：US14514308
申请日：2014-10-14
Applicant: Apple Inc.
Inventor： Brian Michael King , Giovanni Gozzini , Henry H. Yang , Marduke Yousefpor , Matthew E. Last
CPC classification number: G06K9/0002 , G06F3/0436
Abstract: An electronic device that includes an enclosure having an external surface and a first array of ultrasonic transducers arranged along a first direction and a second array of ultrasonic transducers arranged along a second direction. The first array of ultrasonic transducers may be configured to produce a surface wave along the external surface. A set of scattered waves may be created by the touch on the external surface. The second array of ultrasonic transducers may be configured to receive a portion of the set of scattered waves and produce an output. The device may also include a processing unit that is configured to identify the touch using the output. The processing unit may be further configured to create a reconstruction of at least a portion of a fingerprint associated with the touch on the cover, and to identify the fingerprint using the reconstruction.
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公开(公告)号：US09402316B2
公开(公告)日：2016-07-26
申请号：US14696327
申请日：2015-04-24
Applicant: Apple Inc.
Inventor： Shawn X. Arnold , Terry L. Gilton , Matthew E. Last
IPC: H01L23/48 , H05K1/18 , H01L29/06 , G06K9/00 , H01L23/00 , G06F1/16 , G06F3/041 , H05K1/11 , H01L23/24
CPC classification number: H05K1/183 , G06F1/16 , G06F3/041 , G06K9/00053 , H01L23/24 , H01L24/11 , H01L24/43 , H01L24/45 , H01L24/48 , H01L24/81 , H01L24/85 , H01L29/0657 , H01L2224/43 , H01L2224/45015 , H01L2224/451 , H01L2224/48091 , H01L2224/48137 , H01L2224/48479 , H01L2224/85 , H01L2224/85051 , H01L2224/85186 , H01L2924/00 , H01L2924/00014 , H01L2924/10155 , H01L2924/10253 , H05K1/111 , H05K2201/09036 , H05K2201/10151 , H01L2924/20752 , H01L2224/48471 , H01L2224/4554
Abstract: Various methods for forming a low profile assembly are described. The low profile assembly may include an integrated circuit. The integrated circuit as well as components associated with the integrated circuit may be positioned below a surface plane of a printed circuit board in which the integrated circuit is located. The integrated circuit may include bond wires configured to electrically connect the integrated circuits to other components. The low profile assembly may include forming various layers over a substrate and later removing some of the layers.
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公开(公告)号：US20160069751A1
公开(公告)日：2016-03-10
申请号：US14943974
申请日：2015-11-17
Applicant: Apple Inc.
Inventor： Henry H. Yang , Matthew E. Last
CPC classification number: G01K7/02 , G01K1/16 , G01K7/00 , G01K13/00 , G06F1/16 , G06F3/002 , G06F3/02 , G06F3/0412
Abstract: An electronic device may be provided with electronic components such as buttons and environmental sensors. An environmental sensor may be temperature sensor for gathering temperature data associated with the environment surrounding the device. The temperature sensor may be mounted to a button member for the button. The button member may be an actuating member that moves within an opening in a device housing and that extends beyond an outer surface of the housing into the surrounding environment. The button member may be arranged so that an internal electronic switch is activated when the button member is moved within the opening. The button member may be thermally isolated from other device structures using insulating material on the button member. The button member may be formed from a thermally conductive material that transmits the temperature of environmental materials that contact the button member to the temperature sensor.
Abstract translation: 电子设备可以设置有电子部件，例如按钮和环境传感器。 环境传感器可以是用于收集与设备周围的环境相关联的温度数据的温度传感器。 温度传感器可以安装到用于按钮的按钮构件。 按钮构件可以是致动构件，其在装置壳体中的开口内移动并且延伸超过壳体的外表面进入周围环境。 按钮构件可以被布置成使得当按钮构件在开口内移动时内部电子开关被激活。 按钮构件可以使用按钮构件上的绝缘材料与其他装置结构热隔离。 按钮构件可以由导热材料形成，该导热材料将接触按钮构件的环境材料的温度传递到温度传感器。
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公开(公告)号：US09117873B2
公开(公告)日：2015-08-25
申请号：US13629560
申请日：2012-09-27
Applicant: Apple Inc.
Inventor： Shawn X. Arnold , Matthew E. Last
IPC: H01L23/48 , H01L23/52 , H01L29/40 , H01L23/02 , H01L23/12 , H01L21/762 , H01L23/498 , H01L25/065 , H01L23/00 , H01L29/06
CPC classification number: H01L21/762 , H01L23/498 , H01L24/05 , H01L24/06 , H01L24/13 , H01L24/14 , H01L24/16 , H01L24/26 , H01L25/0655 , H01L25/0657 , H01L29/0657 , H01L2224/0401 , H01L2224/04026 , H01L2224/06183 , H01L2224/131 , H01L2224/13144 , H01L2224/14183 , H01L2224/16145 , H01L2224/16225 , H01L2224/16227 , H01L2224/2929 , H01L2224/293 , H01L2224/32145 , H01L2224/32225 , H01L2224/81141 , H01L2224/83141 , H01L2225/06513 , H01L2225/06527 , H01L2225/06551 , H01L2225/06593 , H01L2924/0002 , H01L2924/10156 , H01L2924/00 , H01L2924/00014 , H01L2924/014
Abstract: A direct multiple substrate die assembly can include a first and a second substrate, wherein each substrate can include at least one interlocking edge feature. An electrical interconnection area can be formed adjacent to or within the interlocking edge feature on each substrate and can be configured to couple one or more electrical signals between the substrates. In one embodiment, the interlocking edge feature can include one or more keying features that can enable accurate alignment between the substrates. In yet another embodiment, the direct multiple substrate die assembly can be mounted out of plane with respect to a supporting substrate.
Abstract translation: 直接多基板模具组件可以包括第一和第二基板，其中每个基板可以包括至少一个互锁边缘特征。 电互连区域可以形成在每个基板上的互锁边缘特征附近或内部，并且可以被配置为在基板之间耦合一个或多个电信号。 在一个实施例中，互锁边缘特征可以包括能够实现基板之间的精确对准的一个或多个键控特征。 在另一个实施例中，直接多基板模具组件可以相对于支撑基板安装在平面外。
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公开(公告)号：US20140227833A1
公开(公告)日：2014-08-14
申请号：US14252596
申请日：2014-04-14
Applicant: Apple Inc.
Inventor： Shawn X. Arnold , Terry L. Gilton , Matthew E. Last
IPC: H01L23/00
CPC classification number: H05K1/183 , G06F1/16 , G06F3/041 , G06K9/00053 , H01L23/24 , H01L24/11 , H01L24/43 , H01L24/45 , H01L24/48 , H01L24/81 , H01L24/85 , H01L29/0657 , H01L2224/43 , H01L2224/45015 , H01L2224/451 , H01L2224/48091 , H01L2224/48137 , H01L2224/48479 , H01L2224/85 , H01L2224/85051 , H01L2224/85186 , H01L2924/00 , H01L2924/00014 , H01L2924/10155 , H01L2924/10253 , H05K1/111 , H05K2201/09036 , H05K2201/10151 , H01L2924/20752 , H01L2224/48471 , H01L2224/4554
Abstract: Various methods for forming a low profile assembly are described. The low profile assembly may include an integrated circuit. The integrated circuit as well as components associated with the integrated circuit may be positioned below a surface plane of a printed circuit board in which the integrated circuit is located. The integrated circuit may include bond wires configured to electrically connect the integrated circuits to other components. The low profile assembly may include forming various layers over a substrate and later removing some of the layers.
Abstract translation: 描述了用于形成低轮廓组件的各种方法。 薄型组件可以包括集成电路。 集成电路以及与集成电路相关的部件可以位于集成电路所在的印刷电路板的表面的下方。 集成电路可以包括配置成将集成电路电连接到其他部件的接合线。 薄型组件可以包括在衬底上形成各种层并且随后去除一些层。
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