Abstract:
An alignment apparatus for aligning a reflective reticle includes a light source for emitting alignment light, an optical alignment mark provided on the reticle, and a reference mark provided on a reticle stage that holds the reticle. A detecting unit detects the alignment light reflected from the alignment mark and the reference mark, and the reticle is aligned on the basis of the result of detection by the detection unit.
Abstract:
A shape measuring method for measuring a shape of a surface of an object. The method includes a first measuring step for measuring the surface of the object by detecting light from the object, and a second measuring step for measuring the surface of the object by relatively scanning a probe and the object. A scanning speed changes on the basis of the result of the first measurement step.
Abstract:
A position detecting system includes a light source device for providing coherent light, an incoherence-transforming device for transforming the coherent light from the light source device, into incoherent light, an optical system for dividing the incoherent light from the incoherence-transforming device into divided light, wherein one of the divided light beams produces an intermediate image, and light from the intermediate image is directed to illuminate a target upon a surface of an object while another of divided light beams is directed to be reflected by a surface which is optically conjugate with the intermediate image, and wherein light from the target and light reflected by the conjugate surface are re-combined, an image pickup device for producing an imagewise signal corresponding to the target on the basis of the light re-combined by the optical system, wherein positional information related to a position of the target with respect to a direction along the surface of the object can be produced on the basis of the imagewise signal, and an image contrast adjusting device for adjusting image contrast of an image of a portion close to the target, as picked up by the image pickup device.
Abstract:
A management apparatus which manages a parameter for an industrial device acquires AGA measurement results obtained by operating the industrial device with an operation job parameter value and non-operation job parameter value. An inspection apparatus acquires an “inspection result” obtained by inspecting the result of operating the industrial device in the operation job. A change in inspection result upon a change in parameter value is estimated on the basis of the AGA measurement result and inspection result. A variable which minimizes (extreme) both or at least one of the sensitivity (slope) of the inspection result upon a change in parameter value and variations (3σ) in inspection result between objects to be processed (e.g., wafers) is set as an optimal parameter.
Abstract:
Disclosed is an X-ray mask for use in an exposure apparatus for transferring a circuit pattern onto an exposure substrate by use of an X-ray beam to produce a semiconductor device, wherein the X-ray mask includes an X-ray transmission film having a layered X-ray absorptive material formed thereon, and a holding frame for holding the X-ray transmission film, and wherein the X-ray transmission film is held by the holding frame with an even step-like structure defined at its peripheral portion. With this arrangement, a dust particle adhered to the X-ray mask surface and having a predetermined height can be detected precisely, such that a large integration device can be produced effectively.
Abstract:
A foreign substance inspecting method includes the steps of detecting a height of a foreign substance attaching to a periphery of a wafer by irradiating a light beam from a light source to the wafer, thereby detecting the presence/absence of a foreign substance with not less than a predetermined height. The predetermined height is set to be substantially equal to a gap between the wafer and a mask at a wafer exposure.
Abstract:
A method of evaluating an imaging performance of an imaging optical system includes providing a member having a measurement mark with a predetermined surface level difference, illuminating the member having the measurement mark through the imaging optical system, and receiving reflection light from the illuminated measurement mark again through the imaging optical system. A detection signal is produced based on the measurement mark, illuminated through the imaging optical system, wherein the detection signal is produced while changing a focus within a depth of focus of the imaging optical system. A positional deviation is measured on the basis of the detection signal, and the imaging performance is evaluated of the imaging optical system on the basis of a change in a measured value of the positional deviation measurement with respect to a change in the focus.
Abstract:
An alignment method includes the steps of (i) in order to expose a pattern of a first object onto a second object, measuring positions of a plurality of marks on the second object with a mark detection device and aligning the first and second objects with each other, and (ii) measuring shapes of the plurality of marks on the second object, thereby obtaining offsets that should be reflected in the measured values of the mark detection device. The shapes of the plurality of the marks are measured with a shape measurement device with no possibility of coming into contact with the mark, through calibration with reference to a shape measurement device with a possibility of coming into contact with the mark.
Abstract:
A position detecting method and a position detecting device which make it possible to detect with high accuracy by an image processing method the relative positions of two objects spaced apart in the optical axis direction of a detection optical system, and a semiconductor device manufacturing method using the position detecting method and the position detecting device. In detecting the relative positions of a first object (e.g., a mask) and a second object (e.g., a wafer), there is provided a third object equipped with separate reference alignment marks, and optical images of the reference alignment marks on the third object and optical images of the position detecting marks on the first and second objects are detected by an image pickup device, thereby detecting positional deviation between the first and second objects.
Abstract:
An exposure apparatus for exposing a pattern on a device material includes a holder for chucking and holding a silicon ball, a spherical reticle on which a hologram of a circuit pattern to be exposed is formed, a light source, a focusing optical system for focusing light emitted by the light source on a first position, and an elliptic mirror having a first focal point at the first position and a second focal point at the central position of the silicon ball (reticle). The center of the reticle coincides with the center of the silicon ball.