公开(公告)号：US06592802B1

公开(公告)日：2003-07-15

申请号：US10089216

申请日：2002-03-26

申请人： Hideki Goto ,  Junji Tanaka ,  Toshimasa Eguchi ,  Tsuyoshi Takenaka ,  Shinji Ohno

发明人： Hideki Goto ,  Junji Tanaka ,  Toshimasa Eguchi ,  Tsuyoshi Takenaka ,  Shinji Ohno

IPC分类号： B29C3508

CPC分类号： B29C39/148 ,  B05D1/40 ,  B05D3/067 ,  G02F1/133305

摘要： The present invention provides a process for continuously producing a polymer sheet having an excellent surface smoothness, an apparatus for producing such a polymer sheet, and an optical polymer sheet produced by such a process. The process for producing a polymer sheet comprises coating or laminating, on a polymer base sheet, an ultraviolet-curing resin composition, adhering the coated or laminated polymer base sheet to a member having a smooth surface whose maximum surface roughness (Rmax) satisfies Rmax≦0.1 &mgr;m, in a state that the ultraviolet-curing resin composition is soft, and applying an ultraviolet light to transfer smoothness of the smooth surface of the member onto the polymer base sheet.

摘要翻译： 本发明提供了一种连续制备具有优异表面平滑度的聚合物片材的方法，用于制备这种聚合物片材的装置以及通过这种方法生产的光学聚合物片材。 制造聚合物片的方法包括在聚合物基片上涂布或层压紫外线固化树脂组合物，将涂覆或层压的聚合物基片粘附到具有最大表面粗糙度（Rmax）满足Rmax < 在紫外线固化树脂组合物柔软的状态下，施加紫外光以使构件的光滑表面的平滑度转移到聚合物基片上。

公开(公告)号：US06188790B1

公开(公告)日：2001-02-13

申请号：US08807804

申请日：1997-02-26

申请人： Takatoshi Yoshikawa ,  Hiromitsu Kawajiri ,  Hiroshi Horii ,  Junji Tanaka

发明人： Takatoshi Yoshikawa ,  Hiromitsu Kawajiri ,  Hiroshi Horii ,  Junji Tanaka

IPC分类号： G06K946

CPC分类号： G06K9/42 ,  G06K2209/01

摘要： An apparatus for recognizing characters read by a reading unit. A circumscribing rectangle of a read character is formed, and the degree of narrowness of that circumscribing rectangle is acquired. Characters having a degree of narrowness that is equal to or greater than a predetermined value are selected and blank areas are added to the circumscribing rectangle to yield a character area with a corrected degree of narrowness. The character is normalized by converting the character area to a specified size, and is recognized based on the normalized character. It is therefore possible to normalize even characters significantly elongated vertically or horizontally for easier recognition and to group their character patterns.

摘要翻译： 一种用于识别读取单元读取的字符的装置。 形成读取字符的外接矩形，并且获取该外接矩形的狭缝程度。 选择具有等于或大于预定值的狭缝程度的字符，并且将空白区域添加到外接矩形以产生具有校正的无缝度的字符区域。 字符通过将字符区域转换为指定的大小而被归一化，并且基于标准化字符被识别。 因此，可以将均匀的垂直或水平伸长的字符归一化，以便于识别和分组他们的字符图案。

公开(公告)号：US5534120A

公开(公告)日：1996-07-09

申请号：US497742

申请日：1995-07-03

申请人： Shigeru Ando ,  Hisato Haraga ,  Hidetaka Miyahara ,  Junji Tanaka ,  Hiroshi Takamatsu

发明人： Shigeru Ando ,  Hisato Haraga ,  Hidetaka Miyahara ,  Junji Tanaka ,  Hiroshi Takamatsu

IPC分类号： C02F1/00 ,  C02F1/461 ,  C02F1/467 ,  C02F1/46 ,  C25B1/26 ,  C25B15/08

CPC分类号： C02F1/4674 ,  C02F1/4618 ,  C02F1/46104 ,  C02F2001/46138 ,  C02F2201/4611 ,  C02F2201/46145 ,  C02F2301/022

摘要： A water electrolyzer for electrolyzing water to produce and recover acidic and/or alkaline water. The electrolyzer is of the membraneless laminar-flow type which is designed to electrolyze water without placing a membrane between the electrodes. To this end, the anode and cathode are arranged closely with one another with a very small spacing (generally less than 1 mm) to establish a laminar flow in a narrow flow path. The anode is provided with a slit-shaped aperture for separating a thin layer of acidic water flowing along the anode surface. This aperture is situated sufficiently upstream of the downstream end of the flow path to ensure that the layer of acidic water is separated away from the remainder of the laminar flow while the laminar flow is sustained in the flow path. Accordingly, formation of turbulence at a point of acidic water separation is minimized so that highly acidic water can be recovered.

摘要翻译： 用于电解水以产生和回收酸性和/或碱性水的水电解器。 电解器是无膜层流型，其设计用于在不在电极之间放置膜的情况下电解水。 为此，阳极和阴极以非常小的间隔（通常小于1mm）彼此紧密地布置以在窄流动路径中建立层流。 阳极设置有用于分离沿阳极表面流动的酸性水薄层的狭缝形孔。 该孔足够位于流动路径的下游端的上游，以确保酸性水层与层流的其余部分分离，同时层流维持在流动路径中。 因此，在酸性水分离点形成湍流最小化，从而能够回收高酸性水。

公开(公告)号：US5297245A

公开(公告)日：1994-03-22

申请号：US860298

申请日：1992-03-27

申请人： Kozo Kitamura ,  Junji Tanaka ,  Masaaki Kurata ,  Kiyoshi Kakuda ,  Kenji Hirano ,  Hirofumi Yanaru

发明人： Kozo Kitamura ,  Junji Tanaka ,  Masaaki Kurata ,  Kiyoshi Kakuda ,  Kenji Hirano ,  Hirofumi Yanaru

IPC分类号： H03M11/04 ,  G06F3/02 ,  G06F3/023 ,  G06F3/048 ,  G06F17/27 ,  G06F3/00 ,  G06F15/403

CPC分类号： G06F3/0489 ,  G06F17/276 ,  Y10S707/99932

摘要： A data input system useful in a data base such as an address data management system. This data input system can reduce the number of key operation and the possibility of erroneously inputting data. This system comprises: a display for displaying input data; a first memory for storing data displayed on the display, a second memory for temporarily storing the displayed data; and a control unit for displaying the data stored in the second memory.

摘要翻译： 数据输入系统在诸如地址数据管理系统的数据库中有用。 该数据输入系统可以减少键操作次数和错误输入数据的可能性。 该系统包括：用于显示输入数据的显示器; 用于存储显示在显示器上的数据的第一存储器，用于临时存储所显示的数据的第二存储器; 以及用于显示存储在第二存储器中的数据的控制单元。

公开(公告)号：US5040880A

公开(公告)日：1991-08-20

申请号：US409590

申请日：1989-09-15

申请人： Yoshifumi Morimoto ,  Junji Tanaka ,  Eiji Tanaka

发明人： Yoshifumi Morimoto ,  Junji Tanaka ,  Eiji Tanaka

IPC分类号： C03C27/06 ,  G02B1/02 ,  G02B5/20

CPC分类号： C03C27/06 ,  G02B1/02 ,  G02B5/20

摘要： By forming corner parts of transparent quartz plates and the glass plate in rounded arc shape, in a mirror-surface finishing to accurate plane, polishing powder grain can flow out smoothly and evenly from all the periphery of the plates, and thus the surfaces of those component plates are finished to accurate plate of mirror-surfaces, without making a recessed part at their central parts which has been observed in the conventional plates of rectangular form, and hence, a quartz optical filter made by laminating the improved plates having accurate planes attains an excellent performance characteristic which does not give any degradation in light propagation.

摘要翻译： 通过将透明石英板和玻璃板的角部形成为圆弧形，在镜面精加工到精确的平面上，抛光粉粒可以从板的所有周边平滑均匀地流出，因此，这些表面 组件板被精加工成精确的镜面平板，而在常规的矩形形状的板中未观察到它们的中心部分处形成凹陷部分，因此通过层压具有精确平面的改进板制成的石英滤光器达到 优异的性能特性，不会导致光传播中的任何劣化。

公开(公告)号：US20130306426A1

公开(公告)日：2013-11-21

申请号：US13983499

申请日：2012-02-29

申请人： Junji Tanaka ,  Yuito Abe ,  Kazuyoshi Ito ,  Koji Maeda ,  Naohisa Momiyama

发明人： Junji Tanaka ,  Yuito Abe ,  Kazuyoshi Ito ,  Koji Maeda ,  Naohisa Momiyama

IPC分类号： F16D25/0635

CPC分类号： F16D25/0635 ,  F16H45/02 ,  F16H2045/0205 ,  F16H2045/0226 ,  F16H2045/0284

摘要： In a hydraulic transmission apparatus, a lockup piston of a lockup clutch mechanism is placed on the opposite side of first and second friction plates from a sidewall portion of a front cover. A damper device is placed on the opposite side of the lockup piston from the first and second friction plates. An outer peripheral portion of the lockup piston is located closer to the outer periphery than an outer peripheral portion of a flange member. A part of the lockup piston is placed in a region located between first and second springs and a third spring of the damper device in a radial direction and in the range of an axial width of the third spring located closer to the lockup piston.

摘要翻译： 在液压传动装置中，锁止离合器机构的锁止活塞从前盖的侧壁部分放置在第一和第二摩擦板的相对侧上。 阻尼器装置设置在与第一和第二摩擦板相对的锁止活塞的相对侧上。 锁止活塞的外周部比凸缘部件的外周部更靠近外周。 锁止活塞的一部分被放置在位于第一和第二弹簧之间的区域中，并且减震装置的第三弹簧在径向方向上并且位于更靠近锁止活塞的第三弹簧的轴向宽度的范围内。

公开(公告)号：US08530282B2

公开(公告)日：2013-09-10

申请号：US12900370

申请日：2010-10-07

申请人： Koji Taya ,  Masanori Onodera ,  Junji Tanaka ,  Kouichi Meguro

发明人： Koji Taya ,  Masanori Onodera ,  Junji Tanaka ,  Kouichi Meguro

IPC分类号： H01L21/44

CPC分类号： H01L21/56 ,  B29C45/02 ,  B29C45/14655 ,  B29C45/1671 ,  H01L21/565 ,  H01L23/28 ,  H01L23/3128 ,  H01L23/3135 ,  H01L23/552 ,  H01L24/48 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/05599 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/85399 ,  H01L2225/0651 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/3025 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2924/00012

摘要： The present invention include a semiconductor device and a method therefor, the method includes disposing a sheet-shaped resin at a side opposite to the chip mounting portion mounting semiconductor chips to be mounted on the chip mounting portion, and forming a resin sealing portion between the sheet-shaped resin and the chip mounting portion, to seal the semiconductor chips. According to an aspect of the present invention, it is possible to provide a semiconductor device and a fabrication method therefor, by which it is possible to reduce the size of the package and to prevent the generation of an unfilled portion in a resin sealing portion or a filler-removed portion or to prevent the exposure of wire from the resin sealing portion.

公开(公告)号：US08097961B2

公开(公告)日：2012-01-17

申请号：US12341863

申请日：2008-12-22

申请人： Junji Tanaka ,  Koji Taya ,  Masahiko Harayama

发明人： Junji Tanaka ,  Koji Taya ,  Masahiko Harayama

IPC分类号： H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC分类号： H01L25/0657 ,  H01L23/481 ,  H01L2224/24145 ,  H01L2224/48091 ,  H01L2225/06513 ,  H01L2225/06527 ,  H01L2225/06551 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15311 ,  H01L2924/00014

摘要： Embodiments of the present invention are directed to provide a semiconductor device including a semiconductor chip formed of a conductive material, a connector terminal around the semiconductor chip, which is formed of a same material for forming the semiconductor chip, an insulating member for electrically insulating the semiconductor chip from the connector terminal, and a first connection member for electrically coupling the semiconductor chip with the connector terminal. Simplified step of manufacturing the connector terminal may further simplify the steps of manufacturing the semiconductor device.

摘要翻译： 本发明的实施例是提供一种半导体器件，其包括由导电材料形成的半导体芯片，半导体芯片周围的连接器端子，其由用于形成半导体芯片的相同材料形成;绝缘构件， 半导体芯片，以及用于将半导体芯片与连接器端子电耦合的第一连接构件。 制造连接器端子的简化步骤可以进一步简化制造半导体器件的步骤。

公开(公告)号：US07968990B2

公开(公告)日：2011-06-28

申请号：US11654704

申请日：2007-01-17

申请人： Junji Tanaka ,  Junichi Kasai ,  Kouichi Meguro ,  Masanori Onodera ,  Koji Taya

发明人： Junji Tanaka ,  Junichi Kasai ,  Kouichi Meguro ,  Masanori Onodera ,  Koji Taya

IPC分类号： H01L23/02

CPC分类号： H01L25/105 ,  H01L21/561 ,  H01L21/568 ,  H01L23/3128 ,  H01L24/48 ,  H01L24/73 ,  H01L24/97 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/3511 ,  H01L2224/85 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A method of fabricating a semiconductor device includes: mounting a semiconductor chip on a substrate; forming an upper connection terminal on a side of the substrate on which the semiconductor chip is mounted; forming a resin seal portion that seals the semiconductor chip and the upper connection terminal so that an upper surface of the upper connection terminal is exposed; and shaping the upper connection terminal so that the upper surface of the upper connection terminal becomes lower than an upper surface of the resin seal portion.

摘要翻译： 制造半导体器件的方法包括：将半导体芯片安装在基板上; 在其上安装有半导体芯片的基板的一侧上形成上连接端子; 形成密封半导体芯片和上连接端子以使上连接端子的上表面露出的树脂密封部; 并且使上连接端子成形，使得上连接端子的上表面变得低于树脂密封部分的上表面。

公开(公告)号：US20060245908A1

公开(公告)日：2006-11-02

申请号：US11341984

申请日：2006-01-27

申请人： Koji Taya ,  Kouichi Meguro ,  Junichi Kasai ,  Yasuhiro Shinma ,  Masanori Onodera ,  Junji Tanaka ,  Murugasan Achari

发明人： Koji Taya ,  Kouichi Meguro ,  Junichi Kasai ,  Yasuhiro Shinma ,  Masanori Onodera ,  Junji Tanaka ,  Murugasan Achari

IPC分类号： B65H1/00

CPC分类号： H01L21/6835 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/16 ,  H01L2225/06593 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2224/0401

摘要： A carrier for a stacked-type semiconductor device includes an accommodating section for accommodating stacked semiconductor devices, guide portions guiding the stacked semiconductor devices, and grooves through which a fluid may flow to the accommodating section and to sides of the stacked semiconductor devices. These grooves facilitate the flow of gas or liquid on the sides of the accommodating sections, and it is thus expected that the flow of hot wind during the reflow process and cleaning liquid during the cleaning process can be facilitated. This improves the production yield and the cleaning effects. Holes for connecting the accommodating section to the outside may be provided at corners of the accommodating section. Gas may be guided from the lower side of the accommodating section, so that heat can be efficiently applied to the semiconductor devices and bonding failures therebetween can be reduced. Further, grooves connecting adjacent holes may be provided for accommodating sections adjacent to each other.

摘要翻译： 叠层型半导体器件的载体包括用于容纳堆叠的半导体器件的容纳部分，引导堆叠的半导体器件的引导部分和流体可以通过该沟槽流动到容纳部分和堆叠的半导体器件的侧面的沟槽。 这些凹槽有助于容纳部分侧面上的气体或液体的流动，因此预期在清洗过程中回流过程中的热风和清洗液体的流动可以被方便。 这提高了产量和清洁效果。 用于将容纳部分连接到外部的孔可以设置在容纳部分的角部。 气体可以从容纳部分的下侧引导，使得可以有效地将热量施加到半导体器件，并且可以减少它们之间的接合故障。 此外，可以设置连接相邻孔的槽，用于容纳彼此相邻的部分。