Method of forming a polysilicon film and method of manufacturing a thin film transistor including a polysilicon film
    61.
    发明授权
    Method of forming a polysilicon film and method of manufacturing a thin film transistor including a polysilicon film 有权
    形成多晶硅膜的方法和制造包括多晶硅膜的薄膜晶体管的方法

    公开(公告)号:US07923316B2

    公开(公告)日:2011-04-12

    申请号:US11808521

    申请日:2007-06-11

    IPC分类号: H01L21/00

    摘要: In a method of forming a polysilicon film, a thin film transistor including a polysilicon film, and a method of manufacturing a thin film transistor including a polysilicon film, the thin film transistor includes a substrate, a first heat conduction film on the substrate, a second heat conduction film adjacent to the first heat conduction film, the second heat conduction film having a lower thermal conductivity than the first heat conduction film, a polysilicon film on the second heat conduction film and the first heat conduction film adjacent to the second heat conduction film, and a gate stack on the polysilicon film. The second heat conduction film may either be on the first heat conduction film or, alternatively, the first heat conduction film may be non-contiguous and the second heat conduction film may be interposed between portions of the non-contiguous first heat conduction film.

    摘要翻译: 在形成多晶硅膜的方法中,包括多晶硅膜的薄膜晶体管和包括多晶硅膜的薄膜晶体管的制造方法,薄膜晶体管包括基板,基板上的第一导热膜, 与所述第一导热膜相邻的所述第二导热膜,所述第二导热膜的热导率低于所述第一导热膜,所述第二导热膜上的多晶硅膜和与所述第二导热膜相邻的所述第一导热膜 膜和多晶硅膜上的栅极堆叠。 第二导热膜可以在第一导热膜上,或者第一导热膜可以不连续,并且第二导热膜可以介于不连续的第一导热膜的部分之间。

    Thin film transistor including a polysilicon film
    63.
    发明授权
    Thin film transistor including a polysilicon film 有权
    薄膜晶体管包括多晶硅膜

    公开(公告)号:US07233022B2

    公开(公告)日:2007-06-19

    申请号:US10980838

    申请日:2004-11-04

    IPC分类号: H01L29/10

    摘要: In a method of forming a polysilicon film, a thin film transistor including a polysilicon film, and a method of manufacturing a thin film transistor including a polysilicon film, the thin film transistor includes a substrate, a first heat conduction film on the substrate, a second heat conduction film adjacent to the first heat conduction film, the second heat conduction film having a lower thermal conductivity than the first heat conduction film, a polysilicon film on the second heat conduction film and the first heat conduction film adjacent to the second heat conduction film, and a gate stack on the polysilicon film. The second heat conduction film may either be on the first heat conduction film or, alternatively, the first heat conduction film may be non-contiguous and the second heat conduction film may be interposed between portions of the non-contiguous first heat conduction film.

    摘要翻译: 在形成多晶硅膜的方法中,包括多晶硅膜的薄膜晶体管和包括多晶硅膜的薄膜晶体管的制造方法,薄膜晶体管包括基板,基板上的第一导热膜, 与所述第一导热膜相邻的所述第二导热膜,所述第二导热膜的热导率低于所述第一导热膜,所述第二导热膜上的多晶硅膜和与所述第二导热膜相邻的所述第一导热膜 膜和多晶硅膜上的栅极堆叠。 第二导热膜可以在第一导热膜上,或者第一导热膜可以不连续,并且第二导热膜可以介于不连续的第一导热膜的部分之间。

    Method of forming a polysilicon film and method of manufacturing a thin film transistor including a polysilicon film
    64.
    发明申请
    Method of forming a polysilicon film and method of manufacturing a thin film transistor including a polysilicon film 有权
    形成多晶硅膜的方法和制造包括多晶硅膜的薄膜晶体管的方法

    公开(公告)号:US20070259487A1

    公开(公告)日:2007-11-08

    申请号:US11808521

    申请日:2007-06-11

    IPC分类号: H01L21/336

    摘要: In a method of forming a polysilicon film, a thin film transistor including a polysilicon film, and a method of manufacturing a thin film transistor including a polysilicon film, the thin film transistor includes a substrate, a first heat conduction film on the substrate, a second heat conduction film adjacent to the first heat conduction film, the second heat conduction film having a lower thermal conductivity than the first heat conduction film, a polysilicon film on the second heat conduction film and the first heat conduction film adjacent to the second heat conduction film, and a gate stack on the polysilicon film. The second heat conduction film may either be on the first heat conduction film or, alternatively, the first heat conduction film may be non-contiguous and the second heat conduction film may be interposed between portions of the non-contiguous first heat conduction film.

    摘要翻译: 在形成多晶硅膜的方法中,包括多晶硅膜的薄膜晶体管和包括多晶硅膜的薄膜晶体管的制造方法,薄膜晶体管包括基板,基板上的第一导热膜, 与所述第一导热膜相邻的所述第二导热膜,所述第二导热膜的热导率低于所述第一导热膜,所述第二导热膜上的多晶硅膜和与所述第二导热膜相邻的所述第一导热膜 膜和多晶硅膜上的栅极堆叠。 第二导热膜可以在第一导热膜上,或者第一导热膜可以不连续,并且第二导热膜可以介于不连续的第一导热膜的部分之间。

    METHOD OF FABRICATING POLYCRYSTALLINE SILICON FILM AND METHOD OF FABRICATING THIN FILM TRANSISTOR USING THE SAME
    65.
    发明申请
    METHOD OF FABRICATING POLYCRYSTALLINE SILICON FILM AND METHOD OF FABRICATING THIN FILM TRANSISTOR USING THE SAME 审中-公开
    制造多晶硅薄膜的方法及使用其制造薄膜晶体管的方法

    公开(公告)号:US20070155067A1

    公开(公告)日:2007-07-05

    申请号:US11553693

    申请日:2006-10-27

    摘要: Disclosed herein are methods of fabricating a polycrystalline silicon film and methods of fabricating a thin film transistor (TFT) using the same. The method of fabricating a polycrystalline silicon film includes forming an electrically insulating thermally conductive layer using a material selected from the group consisting of aluminum-containing ceramics, cobalt-containing ceramics, and iron-containing ceramics, on a substrate; forming an amorphous silicon layer on the thermally conductive layer; forming an amorphous silicon island by patterning the amorphous silicon layer; and crystallizing amorphous silicon by annealing the amorphous silicon island. A polycrystalline silicon film having a very large grain size and a TFT using the same can be formed in desired positions.

    摘要翻译: 本文公开了制造多晶硅膜的方法和使用其制造薄膜晶体管(TFT)的方法。 制造多晶硅膜的方法包括在基板上使用选自含铝陶瓷,含钴陶瓷和含铁陶瓷的材料形成电绝缘导热层; 在所述导热层上形成非晶硅层; 通过图案化非晶硅层形成非晶硅岛; 并通过退火非晶硅岛结晶非晶硅。 可以在期望的位置形成具有非常大的晶粒尺寸的多晶硅膜和使用其的TFT。