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公开(公告)号：US09351364B2
公开(公告)日：2016-05-24
申请号：US13347658
申请日：2012-01-10
CPC分类号： H04N5/57 , H05B33/083 , H05B33/0842 , H05B37/0254
摘要： An LED driver IC for driving external strings of LEDs comprises a prefix register and a data register connected in series with each other and with the prefix and data registers in other driver ICs. The prefix and data registers of the driver ICs are connected in a daisy chain arrangement with an interface IC. The interface IC loads data identifying a functional latch into the prefix register and data defining a functional condition into the data register of each driver IC. The data in the data register is then transferred to the functional latch to control the functional condition within the LED driver IC.
摘要翻译： 用于驱动外部LED串的LED驱动器IC包括彼此串联连接的前缀寄存器和数据寄存器，以及其他驱动器IC中的前缀和数据寄存器。 驱动器IC的前缀和数据寄存器以菊花链方式连接到接口IC。 接口IC将识别功能锁存器的数据加载到前缀寄存器中，并将定义功能条件的数据加载到每个驱动器IC的数据寄存器中。 然后将数据寄存器中的数据传送到功能锁存器，以控制LED驱动器IC内的功能状态。
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公开(公告)号：US09305859B2
公开(公告)日：2016-04-05
申请号：US13210764
申请日：2011-08-16
申请人： Richard K. Williams , Keng Hung Lin
发明人： Richard K. Williams , Keng Hung Lin
IPC分类号： H01L23/367 , H01L23/433 , H01L23/495 , H01L21/48 , H01L23/00
CPC分类号： H01L23/4334 , H01L21/4828 , H01L23/3677 , H01L23/49548 , H01L23/49568 , H01L24/05 , H01L24/16 , H01L2224/0401 , H01L2224/04042 , H01L2224/05096 , H01L2224/05572 , H01L2224/131 , H01L2224/16245 , H01L2224/48091 , H01L2224/48247 , H01L2224/48464 , H01L2224/81191 , H01L2224/81815 , H01L2924/00014 , H01L2924/13091 , H01L2924/3011 , H01L2924/3025 , H01L2924/014 , H01L2924/00 , H01L2224/05552
摘要： In a bump-on-leadframe semiconductor package a metal bump formed on a integrated circuit die is used to facilitate the transfer of heat generated in a semiconductor substrate to a metal heat slug and then to an external mounting surface. A structure including arrays of thermal vias may be used to transfer the heat from the semiconductor substrate to the metal bump.
摘要翻译： 在凸起引导框半导体封装中，形成在集成电路管芯上的金属凸块用于促进将在半导体衬底中产生的热量传递到金属加热块，然后转移到外部安装表面。 包括热通孔阵列的结构可用于将热量从半导体衬底转移到金属凸块。
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公开(公告)号：US09210753B2
公开(公告)日：2015-12-08
申请号：US13347661
申请日：2012-01-10
CPC分类号： H05B33/083 , H05B33/0815 , H05B33/0827 , H05B33/086 , H05B37/0254 , Y02B20/32
摘要： A system for controlling multiple strings of LEDs includes a group of LED driver ICs, each of which includes a current sense feedback (CSFB) sample latch for storing a digital representation of the forward-voltage drop across a controlled LED string. Each CSFB latch is coupled to a register within a serial lighting interface (SLI) bus that both originates and terminates at an interface IC. As the data on the SLI bus is shifted into the interface IC, the interface IC selects the CSFB word that represents the highest forward-voltage drop of any of the controlled LED strings, which is then used by the interface IC to generate a CSFB signal for setting the appropriate supply voltage for the controlled LED strings.
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公开(公告)号：US20140306330A1
公开(公告)日：2014-10-16
申请号：US14056287
申请日：2013-10-17
申请人： Richard K. Williams
发明人： Richard K. Williams
IPC分类号： H01L23/495 , H01L23/367 , H01L23/31 , H01L21/48
CPC分类号： H01L23/49805 , H01L21/4828 , H01L21/4842 , H01L21/565 , H01L23/3107 , H01L23/4952 , H01L23/49541 , H01L23/49551 , H01L23/49555 , H01L23/49568 , H01L23/49861 , H01L24/48 , H01L24/49 , H01L24/97 , H01L2224/05624 , H01L2224/16245 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48108 , H01L2224/48245 , H01L2224/48247 , H01L2224/48464 , H01L2224/49171 , H01L2224/73257 , H01L2924/00014 , H01L2924/1305 , H01L2924/13091 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2224/05599
摘要： In a semiconductor package a lead having a bottom surface coplanar with the flat bottom surface of the plastic body extends outward at the bottom of the vertical side surface of the plastic body. The result is a package with a minimal footprint that is suitable for the technique known as “wave soldering” that is used in relatively low-cost printed circuit board assembly factories. Methods of fabricating the package are disclosed.
摘要翻译： 在半导体封装中，具有与塑料体的平坦底面共面的底面的引线在塑料体的垂直侧表面的底部向外延伸。 结果是具有最小占地面积的封装，适用于在相对低成本的印刷电路板组装工厂中使用的称为“波峰焊”的技术。 公开了制造封装的方法。
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65.发明申请公开(公告)号：US20130162336A1
公开(公告)日：2013-06-27
申请号：US13674053
申请日：2012-11-11
申请人： Richard K. Williams
发明人： Richard K. Williams
IPC分类号： G05F3/16
CPC分类号： H02M3/07 , G05F3/16 , H02M3/337 , H02M2001/009
摘要： A multiple output DC-to-DC voltage converter using a new time-multiplexed-capacitor converter algorithm and related circuit topologies is herein disclosed. One embodiment of this invention includes a flying capacitor, a first output node, a second output node, and a switching network. The switching network configured to provide the following modes of circuit operation: 1) a first mode where the positive electrode of the flying capacitor is connected to an input voltage and the negative electrode of the flying capacitor is connected to ground; 2) a second mode where the negative electrode of the flying capacitor is connected to the input voltage and the positive electrode of the flying capacitor is connected to the first output node; and 3) a third mode where the positive electrode of the flying capacitor is connected to ground and the negative electrode of the flying capacitor is connected to the second output node.
摘要翻译： 本文公开了使用新的时间复用电容转换器算法和相关电路拓扑的多输出DC-DC电压转换器。 本发明的一个实施例包括飞行电容器，第一输出节点，第二输出节点和交换网络。 配置为提供以下电路操作模式的开关网络：1）将飞跨电容器的正电极连接到输入电压并且飞跨电容器的负电极连接到地的第一模式; 2）第二模式，其中飞跨电容器的负电极连接到输入电压，并且飞跨电容器的正电极连接到第一输出节点; 以及3）第三模式，其中飞跨电容器的正电极连接到地，并且飞跨电容器的负电极连接到第二输出节点。
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公开(公告)号：US20130119955A1
公开(公告)日：2013-05-16
申请号：US13735940
申请日：2013-01-07
CPC分类号： H02H3/20 , G05F1/46 , H02M1/32 , H02M3/005 , H02M2003/1557
摘要： A SEPIC converter with over-voltage protection includes a high-side inductor that connects a node Vw to a node Vx. The node Vx is connected, in turn to ground by a power MOSFET. The node Vx is also connected to a node Vy by a first capacitor. The node Vy is connected to ground by a low-side inductor. A rectifier diode further connects the node Vy and a node Vout and an output capacitor is connected between the node Vout and ground. A PWM control circuit is connected to drive the power MOSFET. An over-voltage protection MOSFET connects an input supply to the PWM control circuit and the node Vw. A comparator monitors the voltage of the input supply. If that voltage exceeds a predetermined value Vref the comparator output causes the over-voltage protection MOSFET to disconnect the node Vw and the PWM control circuit from the input supply.
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公开(公告)号：US20130082614A1
公开(公告)日：2013-04-04
申请号：US13346625
申请日：2012-01-09
IPC分类号： H05B37/00
CPC分类号： H05B33/0827 , H05B33/0884
摘要： A distributed system for driving strings of series-connected LEDs for backlighting, display and lighting applications includes multiple intelligent satellite LED driver ICs connected to a an interface IC via serial bus. The interface IC translates information obtained from a host microcontroller into instructions for the satellite LED driver ICs pertaining to such parameters as duty factor, current levels, phase delay and fault settings. Fault conditions in the LED driver ICs can be transmitted back to the interface IC. An analog current sense feedback system which also links the LED driver ICs determines the supply voltage for the LED strings.
摘要翻译： 用于驱动用于背光，显示和照明应用的串联LED串的分布式系统包括通过串行总线连接到接口IC的多个智能卫星LED驱动器IC。 接口IC将从主机微控制器获得的信息转换成与占空比，当前电平，相位延迟和故障设置等参数有关的卫星LED驱动器IC的指令。 LED驱动器IC中的故障条件可以传回回接口IC。 也连接LED驱动器IC的模拟电流感测反馈系统确定LED串的电源电压。
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68.发明申请公开(公告)号：US20130043572A1
公开(公告)日：2013-02-21
申请号：US13210764
申请日：2011-08-16
申请人： Richard K. Williams , Keng Hung Lin
发明人： Richard K. Williams , Keng Hung Lin
IPC分类号： H01L23/495 , H01L23/498
CPC分类号： H01L23/4334 , H01L21/4828 , H01L23/3677 , H01L23/49548 , H01L23/49568 , H01L24/05 , H01L24/16 , H01L2224/0401 , H01L2224/04042 , H01L2224/05096 , H01L2224/05572 , H01L2224/131 , H01L2224/16245 , H01L2224/48091 , H01L2224/48247 , H01L2224/48464 , H01L2224/81191 , H01L2224/81815 , H01L2924/00014 , H01L2924/13091 , H01L2924/3011 , H01L2924/3025 , H01L2924/014 , H01L2924/00 , H01L2224/05552
摘要： In a bump-on-leadframe semiconductor package a metal bump formed on a integrated circuit die is used to facilitate the transfer of heat generated in a semiconductor substrate to a metal heat slug and then to an external mounting surface. A structure including arrays of thermal vias may be used to transfer the heat from the semiconductor substrate to the metal bump
摘要翻译： 在凸起引导框半导体封装中，形成在集成电路管芯上的金属凸块用于促进将在半导体衬底中产生的热量传递到金属加热块，然后转移到外部安装表面。 包括热通孔阵列的结构可用于将热量从半导体衬底转移到金属凸块
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公开(公告)号：US08350546B2
公开(公告)日：2013-01-08
申请号：US11933402
申请日：2007-10-31
CPC分类号： H02H3/20 , G05F1/46 , H02M1/32 , H02M3/005 , H02M2003/1557
摘要： A SEPIC converter with over-voltage protection includes a high-side inductor that connects a node Vw to a node Vx. The node Vx is connected, in turn to ground by a power MOSFET. The node Vx is also connected to a node Vy by a first capacitor. The node Vy is connected to ground by a low-side inductor. A rectifier diode further connects the node Vy and a node Vout and an output capacitor is connected between the node Vout and ground. A PWM control circuit is connected to drive the power MOSFET. An over-voltage protection MOSFET connects an input supply to the PWM control circuit and the node Vw. A comparator monitors the voltage of the input supply. If that voltage exceeds a predetermined value Vref the comparator output causes the over-voltage protection MOSFET to disconnect the node Vw and the PWM control circuit from the input supply.
摘要翻译： 具有过电压保护的SEPIC转换器包括将节点Vw连接到节点Vx的高侧电感器。 节点Vx通过功率MOSFET连接到地。 节点Vx也通过第一电容器连接到节点Vy。 节点Vy通过低侧电感器接地。 整流二极管还连接节点Vy和节点Vout，并且输出电容器连接在节点Vout和地之间。 连接PWM控制电路来驱动功率MOSFET。 过压保护MOSFET将输入电源连接到PWM控制电路和节点Vw。 比较器监视输入电源的电压。 如果该电压超过预定值Vref，则比较器输出使过电压保护MOSFET从输入电源断开节点Vw和PWM控制电路。
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公开(公告)号：US08030731B2
公开(公告)日：2011-10-04
申请号：US12002344
申请日：2007-12-17
IPC分类号： H01L21/76
CPC分类号： H01L29/735 , H01L21/761 , H01L21/82285 , H01L21/823807 , H01L21/823814 , H01L21/823878 , H01L21/8249 , H01L27/0623 , H01L27/0826 , H01L27/092 , H01L29/7322 , H01L2924/0002 , H01L2924/00
摘要： An isolated diode comprises a floor isolation region, a dielectric-filled trench and a sidewall region extending from a bottom of the trench at least to the floor isolation region. The floor isolation region, dielectric-filled trench and a sidewall region are comprised in one terminal (anode or cathode) of the diode and together form an isolated pocket in which the other terminal of the diode is formed. In one embodiment the terminals of the diode are separated by a second dielectric-filled trench and sidewall region.
摘要翻译： 隔离二极管包括底部隔离区域，电介质填充的沟槽和从沟槽的底部至少延伸到地板隔离区域的侧壁区域。 底部隔离区域，电介质填充沟槽和侧壁区域包含在二极管的一个端子（阳极或阴极）中，并且一起形成隔离的袋，二极管的另一个端子形成在该隔离腔中。 在一个实施例中，二极管的端子被第二电介质填充的沟槽和侧壁区域分开。
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