公开(公告)号：US20130286535A1

公开(公告)日：2013-10-31

申请号：US13729911

申请日：2012-12-28

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Hae Sock CHUNG ,  Byoung Hwa LEE ,  Min Cheol PARK ,  Eun Hyuk CHAE

IPC: H01G4/005

CPC classification number: H01G4/005 ,  H01G4/012 ,  H01G4/12 ,  H01G4/232 ,  H01G4/248 ,  H01G4/30

Abstract: There is provided a multilayer ceramic electronic component, including: a ceramic body formed by laminating dielectric layers having an average thickness of 0.7p or less; external electrodes formed on external surfaces of the ceramic body; and internal electrodes respectively disposed on the dielectric layer so as to have a gap formed therebetween, wherein, when a narrowest gap between the internal electrode edges adjacent to one another is denoted by Gmin, 10 μm≦Gmin≦60 μm is satisfied.

Abstract translation: 提供了一种多层陶瓷电子部件，其包括：通过层叠平均厚度为0.7p以下的电介质层而形成的陶瓷体; 形成在陶瓷体的外表面上的外部电极; 以及内部电极分别设置在电介质层上，以便在它们之间形成间隙，其中当彼此相邻的内部电极边缘之间的最窄间隙用Gmin表示时，满足10mam @ Gmin @60μm。

公开(公告)号：US20190122810A1

公开(公告)日：2019-04-25

申请号：US16031216

申请日：2018-07-10

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Seon Woo OH ,  Hyung Jin JEON ,  Jung Wook SEO ,  Young Seuck YOO ,  Byoung Hwa LEE ,  Kwang Sun CHOI ,  Kun Ho KOO

IPC: H01F27/29 ,  H01F27/32 ,  H01F27/06

Abstract: An inductor includes a body including an internal coil having first and second end portions and an encapsulant encapsulating the internal coil and containing magnetic particles. First and second external electrodes are on external surfaces of the body and electrically connected to the internal coil. A first metal expansion portion encloses the first end portion while coming into direct contact with the first end portion of the internal coil, and may be between the body and the first external electrode. A second metal expansion portion encloses the second end portion while coming into direct contact with the second end portion of the internal coil, and may be between the body and the second external electrode.

公开(公告)号：US20180211776A1

公开(公告)日：2018-07-26

申请号：US15937008

申请日：2018-03-27

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Byoung Hwa LEE ,  Doo Young KIM ,  Hai Joon LEE ,  Jin Man JUNG

IPC: H01G2/06 ,  H05K1/18 ,  H01G4/012 ,  H01G4/232 ,  H05K3/00 ,  H01G4/30

CPC classification number: H01G2/06 ,  H01G4/012 ,  H01G4/232 ,  H01G4/30 ,  H05K1/185 ,  H05K3/0035 ,  H05K2201/10015 ,  H05K2201/10636 ,  Y02P70/611

Abstract: There is provided a multilayer ceramic electronic component to be embedded in a board, including a ceramic body including dielectric layers and having first and second main surfaces facing each other, first and second side surfaces facing each other, and first and second end surfaces facing each other, an active layer including a plurality of first and second internal electrodes alternately exposed through both end surfaces of the ceramic body with the dielectric layers interposed therebetween, to form capacitance therein, upper and lower cover layers formed on upper and lower portions of the active layer, and first and second external electrodes formed on both end surfaces of the ceramic body, wherein when a thickness of the upper or lower cover layer is defined as tc, 4 μm≤tc≤20 μm may be satisfied.

公开(公告)号：US20180033552A1

公开(公告)日：2018-02-01

申请号：US15728183

申请日：2017-10-09

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Byoung Hwa LEE ,  Doo Young KIM ,  Hai Joon LEE ,  Jin Man JUNG

IPC: H01G2/06 ,  H01G4/30 ,  H01G4/232 ,  H05K3/00 ,  H05K1/18 ,  H01G4/012

CPC classification number: H01G2/06 ,  H01G4/012 ,  H01G4/232 ,  H01G4/30 ,  H05K1/185 ,  H05K3/0035 ,  H05K2201/10015 ,  H05K2201/10636 ,  Y02P70/611

Abstract: There is provided a multilayer ceramic electronic component to be embedded in a board, including a ceramic body including dielectric layers and having first and second main surfaces facing each other, first and second side surfaces facing each other, and first and second end surfaces facing each other, an active layer including a plurality of first and second internal electrodes alternately exposed through both end surfaces of the ceramic body with the dielectric layers interposed therebetween, to form capacitance therein, upper and lower cover layers formed on upper and lower portions of the active layer, and first and second external electrodes formed on both end surfaces of the ceramic body, wherein when a thickness of the upper or lower cover layer is defined as tc, 4 μm≦tc≦20 μm may be satisfied.

公开(公告)号：US20170179913A1

公开(公告)日：2017-06-22

申请号：US15248535

申请日：2016-08-26

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Ha Yoon SONG ,  Jong Yun LEE ,  Sung Ryong MA ,  Won Chul SIM ,  Young Seuck YOO ,  Byoung Hwa LEE ,  Young Jae KIM ,  Tae Chul HA ,  Hye Won BANG

IPC: H03H1/00 ,  H01F27/245 ,  H01F27/29 ,  H01F27/28

CPC classification number: H03H1/0007 ,  H01F17/0013 ,  H01F17/04 ,  H01F27/245 ,  H01F27/2804 ,  H01F27/292 ,  H01F2017/0093 ,  H01F2027/2809 ,  H03H7/427 ,  H03H2001/0057 ,  H03H2001/0085 ,  H03H2001/0092

Abstract: A common mode filter includes: a coil part including a plurality of coil layers, each coil layer having at least one coil and a lead terminal connected to a first end of the coil, and a conductive via connecting the lead terminals to each other; a first magnetic layer disposed on the coil part; a second magnetic layer disposed below the coil part; and external electrodes connected to the lead terminals and exposed to the surface of the common mode filter.

公开(公告)号：US20160314889A1

公开(公告)日：2016-10-27

申请号：US14995103

申请日：2016-01-13

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Han Wool RYU ,  Byoung Hwa LEE

IPC: H01F27/255 ,  H01F41/12 ,  H01F41/04 ,  H01F41/10 ,  H01F27/29 ,  H01F27/28

Abstract: A coil component includes a body having a coil part disposed therein and an external electrode connected to the coil part. The body includes magnetic particles, and the magnetic particles include first magnetic particles, second magnetic particles, and third magnetic particles. A diameter of each of the first, second, and third magnetic particles is different from each other.

Abstract translation: 线圈部件包括具有设置在其中的线圈部分的主体和连接到线圈部分的外部电极。 主体包括磁性颗粒，磁性颗粒包括第一磁性颗粒，第二磁性颗粒和第三磁性颗粒。 第一，第二和第三磁性颗粒中的每一个的直径彼此不同。

公开(公告)号：US20160225524A1

公开(公告)日：2016-08-04

申请号：US14981650

申请日：2015-12-28

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Jin Kyung JOO ,  Byoung Hwa LEE ,  Tae Ho KIM ,  Doo Young KIM ,  Taek Jung LEE ,  Sin Il GU

IPC: H01G4/012 ,  H01G4/12

CPC classification number: H01G4/12 ,  H01G4/008 ,  H01G4/1209

Abstract: A method of manufacturing a multilayer ceramic electronic component includes preparing a multilayer structure in which dielectric layers containing an alumina base material and internal electrode layers containing nickel are alternately stacked, plasticizing the multilayer structure by heating to a temperature of 500 to 900° C. at a first heating rate under a first reducing atmosphere at a first hydrogen concentration, sintering the multilayer structure by heating to a temperature of 1,250° C. to 1,400° C. at a second heating rate greater than the first heating rate under a second reducing atmosphere at a second hydrogen concentration higher than the first hydrogen concentration, and then maintaining the temperature of 1,250° C. to 1,400° C., and annealing the multilayer structure by cooling the multilayer structure to room temperature at a first cooling rate.

Abstract translation: 一种制造多层陶瓷电子部件的方法包括制备多层结构，其中包含氧化铝基底材料和含有镍的内部电极层的电介质层交替堆叠，通过加热至500至900℃的温度来增塑多层结构 在第一氢气浓度的第一还原气氛下的第一加热速率，通过在第二还原气氛下以大于第一加热速率的第二加热速率加热至1250℃至1400℃的温度来烧结多层结构 在比第一氢浓度高的第二氢浓度下，然后将温度保持在1250℃至1400℃，并通过以多个第一冷却速率将多层结构冷却至室温来退火多层结构。

公开(公告)号：US20160163462A1

公开(公告)日：2016-06-09

申请号：US15042563

申请日：2016-02-12

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Young Ghyu AHN ,  Sang Soo PARK ,  Min Cheol PARK ,  Byoung Hwa LEE

IPC: H01G4/30 ,  H01G4/012 ,  H01G4/005 ,  H01G2/06 ,  H01G4/12 ,  H05K1/18 ,  H05K1/11 ,  H01G4/224 ,  H01G4/248

CPC classification number: H01G4/30 ,  H01G2/065 ,  H01G4/005 ,  H01G4/012 ,  H01G4/12 ,  H01G4/224 ,  H01G4/232 ,  H01G4/248 ,  H05K1/111 ,  H05K1/181 ,  H05K2201/10015

Abstract: There is provided multilayer ceramic capacitor including, a ceramic body including a plurality of dielectric layers laminated therein, an active layer including a plurality of first and second internal electrodes alternately exposed through both end surfaces of the ceramic body, with the dielectric layers interposed therebetween, and having capacitance formed therein, an upper cover layer formed on an upper portion of the active layer, a lower cover layer formed on a lower portion of the active layer and having a thickness greater than that of the upper cover layer, first and second dummy electrode terminals provided in the lower cover layer to be alternately exposed through both end surfaces of the lower cover layer, and first and second external electrodes covering the both end surfaces of the ceramic body.

Abstract translation: 提供了多层陶瓷电容器，其包括：层叠有多个电介质层的陶瓷体，具有通过陶瓷体的两个端面交替暴露的多个第一和第二内部电极的有源层，介电层插入其间， 并且其中形成有电容，形成在有源层的上部的上覆盖层，形成在有源层的下部并且具有大于上覆盖层的厚度的下覆盖层，第一和第二伪 设置在下覆盖层中的电极端子通过下盖层的两个端面交替暴露，以及覆盖陶瓷体两端表面的第一和第二外部电极。

公开(公告)号：US20160027594A1

公开(公告)日：2016-01-28

申请号：US14811463

申请日：2015-07-28

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Young Ghyu AHN ,  Sang Soo PARK ,  Byoung Hwa LEE ,  Kyo Kwang LEE

IPC: H01G15/00 ,  H01G4/012 ,  H01G4/12 ,  H01G9/042 ,  H01G4/224 ,  H05K1/18 ,  H01G9/012 ,  H01G9/025 ,  H01G4/30 ,  H01G4/228

CPC classification number: H01G15/00 ,  H01G2/06 ,  H01G4/012 ,  H01G4/12 ,  H01G4/224 ,  H01G4/228 ,  H01G4/30 ,  H01G4/38 ,  H01G9/012 ,  H01G9/08 ,  H01G9/28 ,  H05K1/181 ,  H05K3/3442 ,  H05K2201/10015 ,  H05K2201/2045 ,  Y02P70/613

Abstract: A composite electronic component includes an insulation sheet, a tantalum capacitor including a body part containing a sintered tantalum powder and a tantalum wire, a portion of which is embedded in the body part, and disposed on the insulation sheet, a multilayer ceramic capacitor including a ceramic body including a plurality of dielectric layers, first and second internal electrodes, and first and second external electrodes, and disposed on the insulation sheet, and a molded portion enclosing the tantalum capacitor and the multilayer ceramic capacitor. The first internal electrode includes a first lead portion led out to upper and lower surfaces and a first end surface of the ceramic body in a length direction, and the second internal electrode includes a second lead portion led out to the upper and lower surfaces and a second end surface of the ceramic body in the length direction.

Abstract translation: 复合电子部件包括绝缘片，钽电容器，其包括包含烧结钽粉末的主体部分和钽线，其一部分嵌入在主体部分中，并且设置在绝缘片上，多层陶瓷电容器包括： 包括多个电介质层的陶瓷体，第一和第二内部电极以及第一和第二外部电极，并且设置在绝缘片上，以及封装钽电容器和多层陶瓷电容器的模制部分。 第一内部电极包括从长度方向引出到上表面和下表面的第一引线部分和陶瓷体的第一端面，并且第二内部电极包括引导到上表面和下表面的第二引线部分和 陶瓷体的长度方向的第二端面。

公开(公告)号：US20150373852A1

公开(公告)日：2015-12-24

申请号：US14841126

申请日：2015-08-31

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Young Ghyu AHN ,  Doo Young KIM ,  Min Cheol PARK ,  Byoung Hwa LEE ,  Sang Soo PARK

IPC: H05K1/18 ,  H05K1/11 ,  H01G4/012 ,  H01G4/228 ,  H01G4/30 ,  H01G4/12

CPC classification number: H05K1/181 ,  H01G2/065 ,  H01G4/012 ,  H01G4/12 ,  H01G4/228 ,  H01G4/30 ,  H05K1/111 ,  H05K2201/10015 ,  Y02P70/611

Abstract: A multilayer ceramic capacitor may include three external electrodes disposed on a mounting surface of a ceramic body and spaced apart from each other, and first and second lead-out portions extended from a first internal electrode so as to be exposed through the mounting surface of the ceramic body and spaced apart from each other in a length direction of the ceramic body have one or more space portions, respectively, and a board for mounting thereof is provided.

Abstract translation: 多层陶瓷电容器可以包括设置在陶瓷体的安装表面上并彼此间隔开的三个外部电极，以及从第一内部电极延伸出来的第一和第二引出部分，以便暴露于陶瓷体的安装表面 陶瓷体在陶瓷体的长度方向上彼此间隔开地具有一个或多个空间部分，并且设置有用于安装的基板。