摘要:
A method of mounting an electronic component on a substrate includes forming at least one trench in a surface of the substrate. The trenches formed in the substrate reduce a stiffness of the substrate, which provides less resistance to shear. Accordingly, the trenches reduce the amount of strain on the joints, which mount the electronic component to the substrate, which enhances the life of the joints.
摘要:
Line cards receive control packets and perform a hierarchical rate limiting on those control packets. A set of identifier keys are extracted from the control packets and the protocol of those control packets are determined. At a first level, the control packets are rate limited per unique set of identifier keys per protocol. Those packets which fail the first rate limiting level are dropped. Those packets which pass the first rate limiting level are rate limited at a second level per protocol type. Those packets which fail the second level rate limiting are dropped while those packets which pass the second level rate limiting are sent to the control card for further processing.
摘要:
An electronic module including a substrate having at least one structure that reduces stress flow through the substrate, wherein the structure comprises at least one trench in a surface of the substrate.
摘要:
A method of characterizing an organic substrate including a plurality of circuit layers is provided includes the steps of: receiving an image of the organic substrate, the image including a geometric description of the circuit layers of the substrate; segmenting the substrate into multiple processing regions based, at least in part, on geometric coordinates of circuit structures defined in the image of the substrate; generating a circuit layer image corresponding to a selected one of the processing regions of the substrate; identifying one or more geometric features in the circuit layer image; estimating at least one thermomechanical property of the circuit layer image as a function of the identified geometric features; repeating the steps of receiving an image, generating a circuit layer image, identifying one or more geometric features in the circuit layer image, and estimating at least one thermomechanical property of the circuit layer image until all circuit layers in the substrate have been processed; and generating a 3-D representation of the selected one of the processing regions of the substrate including the plurality of circuit layer images as a function of the at least one thermomechanical property of each of the plurality of circuit layer images.
摘要:
A method for characterizing thermomechanical properties of an organic substrate includes the steps of: receiving an image of the substrate, the image including a geometric description of the circuit layers of the substrate; selecting a given one of the circuit layers for processing; converting the image to a 2-D FEM image of the given circuit layer; repeating the steps of selecting a given one of the circuit layers and converting the image to a 2-D FEM image of the selected layer until all of the layers have been processed; combining all of the 2-D FEM images corresponding to the layers to form a 3-D FEM image representing at least a portion of the substrate; determining a coefficient of thermal expansion (CTE), modulus and/or Poisson's ratio of the 3-D FEM image; and constructing a 3-D representation of the substrate as a function of the CTE, modulus and/or Poisson's ratio of the 3-D FEM image.
摘要:
A machine-accessible medium may contain program instructions that, when executed by a processor, may cause the processor to perform at least one operation including searching a virtual hash page table (VHPT) using a region identifier and a virtual page number of a virtual address, and a default page size corresponding to the region identifier to locate a virtual address translation in the VHPT. The operation performed may further include searching the VHPT using the region identifier, the virtual page number, and at least one utilized page size to locate a virtual address translation in the VHPT if a virtual address translation is not located during the search of the VHPT using the region identifier, virtual page number, and default page size. The operation performed may also include inserting the located virtual address translation into a translation cache once a virtual address translation is located.
摘要:
The invention provides isolated mMafA polypeptides, nucleic acids, vectors and host cells containing them, which encode a novel insulin related transcription factor. Diagnostic methods, methods of selecting and differentiating insulin-producing cells, and methods of treatment utilizing compositions of the invention are also provided.
摘要:
The present invention generally comprises an apparatus that allows an RFID antenna to obtain information from an RFID tag mounted on a container. The apparatus reproduces the RF field generated by the antenna to a location proximate to the RFID tag. In one embodiment, the apparatus comprises a pickup device and a reproduction device electrically coupled with the pickup device. In another embodiment, the apparatus comprises at least one magnetic rod, which creates a magnetic path for the RF field to travel between the antenna and the RFID tag. In another embodiment, the apparatus comprises a pickup antenna and a reproduction antenna for transmitting the RF signal from the antenna proximate to the RFID tag.
摘要:
A method of mounting an electronic component on a substrate includes forming at least one trench in a surface of the substrate. The trenches formed in the substrate reduce a stiffness of the substrate, which provides less resistance to shear. Accordingly, the trenches reduce the amount of strain on the joints, which mount the electronic component to the substrate, which enhances the life of the joints.
摘要:
A method of mounting an electronic component on a substrate includes forming at least one trench in a surface of the substrate. The trenches formed in the substrate reduce a stiffness of the substrate, which provides less resistance to shear. Accordingly, the trenches reduce the amount of strain on the joints, which mount the electronic component to the substrate, which enhances the life of the joints.