Abstract:
A showerhead is provided. The showerhead includes a body and a plurality of first dispersion pins. The body has one side having a plurality of injection holes penetrated therethrough and the other side facing the one side. The plurality of first dispersion pins protruding from the plurality of spray holes of the one side to the other side such that end portions thereof support the other side. The first dispersion holes have first gas inlet holes on one side and first passages connected to the first gas inlet holes therein. Gas introduced between the one side and the other side is immediately discharged to the outside of the body through the plurality of spray holes by passing the first gas inlet holes and the first passages.
Abstract:
Disclosed are a silicon substrate for a solar cell and a method of manufacturing the same, wherein the reflectance of solar light can be decreased by gap-filling with AZO, and electrical properties, especially resistivity, can be reduced through e-beam irradiation, thus maximizing the cell efficiency and improving the electrical properties of AZO applied to a silicon solar cell.
Abstract:
A wiping device is provided. The wiping device includes a cartridge. In addition, wiping yarns are disposed on an outer circumference of the cartridge. The wiping yarn includes core yarns substantially perpendicular to the cartridge and sub-yarns disposed extraneous to the core yarns and configured to gather contaminants from a vehicle body.
Abstract:
Disclosed is a medical mask apparatus using optical fibers which can selectively project a laser beam to an entire treated portion or a local portion of skin. A medical mask apparatus using optical fibers for projecting a fine laser beam to the skin to activate skin cells and expedite circulation of blood in the skin is provided.
Abstract:
The present invention relates to an electrospinning solution composition for fabricating a silver nanofiber, and more particularly to an electrospinning solution composition for fabricating a silver nanofiber through a spinning process, the electrospinning solution including a silver precursor, a reducing agent, a viscosity modifier, and a solvent wherein the viscosity modifier includes one selected from the group consisting of dextran, alginate, chitosan, guar gum, starch, carboxymethyl cellulose, hydroxyethyl cellulose, hydroxypropyl methylcellulose, xanthan gum, a carboxyvinyl polymer, pectin, sodium alginate, and a combination thereof.According to the present invention, a viscosity suitable for spinning is maintained by using a viscosity modifier to be able to improve quality of a silver nanofiber.
Abstract:
The present invention provides a zinc alloy with improved alloy characteristics such as fluidity, castability, mechanical properties, corrosion resistance and elongation, and a preparation method therefor. The method for preparing the zinc alloy, according to one aspect of the present invention, comprising the steps of: providing zinc and a magnesium master alloy including a calcium-based compound; and forming a molten metal in which the magnesium master alloy and the zinc are melted; and casting the molten metal. The zinc alloy, according to another aspect of the present invention, includes a zinc base and the calcium-based compound present in the zinc base, wherein magnesium is applied to the zinc base.
Abstract:
An optimal behavior combination of a robot in consideration of the robot's previous feeling is generated. In other words, the robot may express its feelings by combinations of its behavioral express elements which reflect its previous feelings. In particular, it has a continuity determination unit for determining whether a behavior to be expressed should be same as or different from a currently expressed behavior.
Abstract:
Provided are a lead-free solder, a solder paste, and a semiconductor device, and more particularly, a lead-free solder that includes Cu in a range from about 0.1 wt % to about 0.8 wt %, Pd in a range from about 0.001 wt % to about 0.1 wt %, Al in a range from about 0.001 wt % to about 0.1 wt %, Si in a range from about 0.001 wt % to about 0.1 wt %, and Sn and inevitable impurities as remainder, a solder paste and a semiconductor device including the lead-free solder. The lead-free solder and the solder paste are environment-friendly and have a high high-temperature stability and high reliability.
Abstract:
Provided are a lead-free solder, a solder paste, and a semiconductor device, and more particularly, a lead-free solder that includes Cu in a range from about 0.1 wt % to about 0.8 wt %, Pd in a range from about 0.001 wt % to about 0.1 wt %, Al in a range from about 0.001 wt % to about 0.1 wt %, Si in a range from about 0.001 wt % to about 0.1 wt %, and Sn and inevitable impurities as remainder, a solder paste and a semiconductor device including the lead-free solder. The lead-free solder and the solder paste are environment-friendly and have a high high-temperature stability and high reliability.