公开(公告)号：US08295027B2

公开(公告)日：2012-10-23

申请号：US13368275

申请日：2012-02-07

申请人： Michael Bennett Cohn ,  Ji-Hai Xu

发明人： Michael Bennett Cohn ,  Ji-Hai Xu

IPC分类号： H01G5/00 ,  H01G5/16

CPC分类号： H01H59/0009 ,  B81B7/0077 ,  B81B2201/018 ,  B81B2203/0118 ,  B81B2207/093 ,  B81C1/00301 ,  B81C1/00357 ,  B81C3/001 ,  B81C2201/019 ,  B81C2203/0109 ,  B81C2203/0118 ,  B81C2203/019 ,  H01H2059/0018 ,  H01H2059/0072

摘要： A MEMS device and method of making same is disclosed. In one embodiment, a micro-switch includes a base assembly comprising a movable structure bearing a contact pad. The base assembly is wafer-scale bonded to a lid assembly comprising an activator and a signal path. The movable structure moves within a sealed cavity formed during the bonding process. The signal path includes an input line and an output line separated by a gap, which prevents signals from propagating through the micro-switch when the switch is deactivated. In operation, a signal is launched into the signal path. When the micro-switch is activated, a force is established by the actuator, which pulls a portion of the movable structure upwards towards the gap in the signal path, until the contact pad bridges the gap between the input line and output line, allowing the signal to propagate through the micro-switch.

摘要翻译： 公开了MEMS器件及其制造方法。 在一个实施例中，微型开关包括基座组件，其包括承载接触垫的可移动结构。 基座组件被晶片刻度结合到包括激活器和信号路径的盖组件。 可移动结构在接合过程中形成的密封空腔内移动。 信号路径包括输入线和由间隙分开的输出线，当开关被去激活时，该线路防止信号通过微型开关传播。 在操作中，信号被发送到信号路径中。 当微动开关被激活时，致动器建立一个力，致动器将可移动结构的一部分朝向信号路径中的间隙向上拉，直到接触垫桥接输入线和输出线之间的间隙，从而允许 信号通过微型开关传播。

公开(公告)号：US20120228726A1

公开(公告)日：2012-09-13

申请号：US13413889

申请日：2012-03-07

申请人： Tomohiro SAITO

发明人： Tomohiro SAITO

IPC分类号： H01L29/84 ,  H01L21/02

CPC分类号： H01G5/18 ,  B81B2201/018 ,  B81B2201/0221 ,  B81B2203/0109 ,  B81C1/00611 ,  B81C2201/0126

摘要： According to one embodiment, a MEMS includes a first electrode, a first auxiliary structure and a second electrode. The first electrode is provided on a substrate. The first auxiliary structure is provided on the substrate and adjacent to the first electrode. The first auxiliary structure is in an electrically floating state. The second electrode is provided above the first electrode and the first auxiliary structure,

摘要翻译： 根据一个实施例，MEMS包括第一电极，第一辅助结构和第二电极。 第一电极设置在基板上。 第一辅助结构设置在基板上并与第一电极相邻。 第一辅助结构处于电浮动状态。 第二电极设置在第一电极和第一辅助结构之上，

公开(公告)号：US08264054B2

公开(公告)日：2012-09-11

申请号：US10291125

申请日：2002-11-08

申请人： Shawn Jay Cunningham ,  Dana Richard DeReus ,  Subham Sett ,  John Richard Gilbert

发明人： Shawn Jay Cunningham ,  Dana Richard DeReus ,  Subham Sett ,  John Richard Gilbert

IPC分类号： H01L31/058

CPC分类号： B81B3/0024 ,  B81B3/0051 ,  B81B2201/014 ,  B81B2201/018 ,  B81B2203/0118 ,  B81B2203/04 ,  B81B2207/07 ,  B81C1/0015 ,  B81C2201/0107 ,  B81C2201/0108 ,  B81C2201/0109 ,  H01H1/04 ,  H01H1/504 ,  H01H59/0009 ,  H01H61/04 ,  H01H2001/0042 ,  H01H2001/0063 ,  H01H2001/0089 ,  H01H2059/0072 ,  H01H2061/006 ,  H01L23/3735 ,  H01L23/522 ,  H01L27/1203 ,  H01L2924/0002 ,  H01L2924/09701 ,  H02N1/006 ,  H02N10/00 ,  Y10T29/49222 ,  H01L2924/00

摘要： MEMS Device having Electrothermal Actuation and Release and Method for Fabricating. According to one embodiment, a microscale switch is provided and can include a substrate and a stationary electrode and stationary contact formed on the substrate. The switch can further include a movable microcomponent suspended above the substrate. The microcomponent can include a structural layer including at least one end fixed with respect to the substrate. The microcomponent can further include a movable electrode spaced from the stationary electrode and a movable contact spaced from the stationary electrode. The microcomponent can include an electrothermal component attached to the structural layer and operable to produce heating for generating force for moving the structural layer.

摘要翻译： 具有电热驱动和释放的MEMS器件和制造方法。 根据一个实施例，提供微型开关，并且可以包括形成在基板上的基板和固定电极和固定触点。 开关还可以包括悬浮在基板上方的可移动的微型部件。 微组件可以包括包括相对于基底固定的至少一个端部的结构层。 微型部件还可以包括与固定电极间隔开的可动电极和与固定电极间隔开的可动触头。 微组件可以包括附接到结构层的电热组件，并且可操作以产生用于产生用于移动结构层的力的加热。

公开(公告)号：US08179215B2

公开(公告)日：2012-05-15

申请号：US11929245

申请日：2007-10-30

申请人： Michael Bennett Cohn ,  Ji-Hai Xu

发明人： Michael Bennett Cohn ,  Ji-Hai Xu

IPC分类号： H01H51/22

CPC分类号： H01H59/0009 ,  B81B7/0077 ,  B81B2201/018 ,  B81B2203/0118 ,  B81B2207/093 ,  B81C1/00301 ,  B81C1/00357 ,  B81C3/001 ,  B81C2201/019 ,  B81C2203/0109 ,  B81C2203/0118 ,  B81C2203/019 ,  H01H2059/0018 ,  H01H2059/0072

摘要： A MEMS device and method of making same is disclosed. In one embodiment, a micro-switch includes a base assembly comprising a movable structure bearing a contact pad. The base assembly is wafer-scale bonded to a lid assembly comprising an activator and a signal path. The movable structure moves within a sealed cavity formed during the bonding process. The signal path includes an input line and an output line separated by a gap, which prevents signals from propagating through the micro-switch when the switch is deactivated. In operation, a signal is launched into the signal path. When the micro-switch is activated, a force is established by the actuator, which pulls a portion of the movable structure upwards towards the gap in the signal path, until the contact pad bridges the gap between the input line and output line, allowing the signal to propagate through the micro-switch. Prior to bonding, the MEMS structures are annealed on a first wafer and the conductive traces and other metals are annealed on a second wafer to allow each wafer to be processed separately using different processes, e.g., different annealing temperatures.

摘要翻译： 公开了MEMS器件及其制造方法。 在一个实施例中，微型开关包括基座组件，其包括承载接触垫的可移动结构。 基座组件被晶片刻度结合到包括激活器和信号路径的盖组件。 可移动结构在接合过程中形成的密封空腔内移动。 信号路径包括输入线和由间隙分开的输出线，当开关被去激活时，该线路防止信号通过微型开关传播。 在操作中，信号被发送到信号路径中。 当微动开关被激活时，致动器建立一个力，致动器将可移动结构的一部分朝向信号路径中的间隙向上拉，直到接触垫桥接输入线和输出线之间的间隙，从而允许 信号通过微型开关传播。 在结合之前，MEMS结构在第一晶片上退火，并且导电迹线和其它金属在第二晶片上进行退火，以允许使用不同工艺（例如不同的退火温度）分别对每个晶片进行加工。

公开(公告)号：US20120021550A1

公开(公告)日：2012-01-26

申请号：US13176371

申请日：2011-07-05

申请人： CHRISTEL DIEPPEDALE ,  STEPHAN BOREL ,  BRUNO REIG ,  HENRI SIBUET

发明人： CHRISTEL DIEPPEDALE ,  STEPHAN BOREL ,  BRUNO REIG ,  HENRI SIBUET

IPC分类号： H01L21/02

CPC分类号： B81C1/00158 ,  B81B2201/018 ,  B81B2201/0264 ,  B81B2203/0118 ,  B81B2203/0361 ,  B81C1/00492 ,  B81C2201/0178 ,  H01H1/0036

摘要： The fabrication of a semiconductor fixed structure defining a volume, for example of a MEMS micro electro-mechanical system includes, determining thicknesses beforehand depending on the functional distances associated with elements. At least one element is formed on a substrate by thermal oxidation of the substrate so as to form an oxide layer followed by selective etching of the oxide layer so as to define the volume in an etched portion by baring the underlying substrate so as to define the element in an unetched portion, and later oxidation of the substrate so as to form an oxide layer, in order to obtain the elements at the functional distances.

摘要翻译： 限定体积的半导体固定结构（例如MEMS微机电系统）的制造包括：根据与元件相关联的功能距离预先确定厚度。 通过衬底的热氧化在衬底上形成至少一个元件，以便形成氧化物层，然后选择性地蚀刻氧化物层，以便通过掩埋下面的衬底限定蚀刻部分中的体积，从而限定 元素在未蚀刻部分中，并且随后氧化基底以形成氧化物层，以便在功能距离处获得元件。

公开(公告)号：US20110130721A1

公开(公告)日：2011-06-02

申请号：US12929257

申请日：2011-01-11

申请人： John S. Foster ,  Christopher S. Gudeman

发明人： John S. Foster ,  Christopher S. Gudeman

IPC分类号： A61M5/142 ,  H02J1/00 ,  H01H11/00 ,  A61N1/362

CPC分类号： H01H59/0009 ,  B81B2201/018 ,  B81B2207/015 ,  B81B2207/053 ,  B81C1/0023 ,  B81C2203/075 ,  H02J7/0024 ,  Y10T29/49105 ,  Y10T307/696

摘要： Systems and methods for forming a configurable power supply uses a plurality of dual substrate MEMS switches to couple a plurality of power cells to provide a selectable, or variable, output voltage. The same circuit may output two different voltages to power two different circuits of the device, or may distribute the load evenly amongst the cells. Thus, the configurable power supply may extend the lifetime and improve the reliability of the device, or decrease its weight, size and cost.

摘要翻译： 用于形成可配置电源的系统和方法使用多个双衬底MEMS开关来耦合多个功率单元以提供可选择的或可变的输出电压。 相同的电路可以输出两个不同的电压来为装置的两个不同电路供电，或者可以在电池之间均匀地分配负载。 因此，可配置电源可延长使用寿命并提高设备的可靠性，或降低其重量，尺寸和成本。

公开(公告)号：US07944113B2

公开(公告)日：2011-05-17

申请号：US12318634

申请日：2009-01-05

申请人： Paul J. Rubel

发明人： Paul J. Rubel

IPC分类号： H01L41/08

CPC分类号： F03G7/06 ,  B81B3/0059 ,  B81B2201/018 ,  B81B2201/032 ,  B81B2201/054 ,  H01H61/02 ,  H01H61/04 ,  H01H2001/0047 ,  H01H2001/0068 ,  H01H2061/006 ,  H01H2061/008 ,  H02N10/00 ,  Y10T29/49105

摘要： A MEMS hysteretic thermal actuator may have a plurality of beams disposed over a heating element formed on the surface of the substrate. The plurality of beams may be coupled to a passive beam which is not disposed over the heating element. One of the plurality of beams may be formed in a first plane parallel to the substrate, whereas another of the plurality of beams may be formed in a second plane closer to the surface of the substrate. When the heating element is activated, it heats the plurality of beams such that they move the passive beam in a trajectory that is neither parallel to nor perpendicular to the surface of the substrate. When the beams are cooled, they may move in a different trajectory, approaching the substrate before moving laterally across it to their initial positions. By providing one electrical contact on the distal end of the passive beam and another stationary electrical contact on the substrate surface, the MEMS hysteretic actuator may form a reliable electrical switch that is relatively simple to manufacture and operate.

摘要翻译： MEMS迟滞热致动器可以具有设置在形成在基板的表面上的加热元件上的多个光束。 多个光束可以耦合到未设置在加热元件上方的无源光束。 多个光束中的一个可以形成在平行于衬底的第一平面中，而多个光束中的另一个可以形成在靠近衬底表面的第二平面中。 当加热元件被激活时，它加热多个光束，使得它们以不平行于或垂直于衬底表面的轨迹移动被动束。 当梁被冷却时，它们可以以不同的轨迹移动，在横向移动到其初始位置之前接近基板。 通过在被动束的远端上提供一个电接触，并在衬底表面上提供另一个固定的电触点，MEMS滞后致动器可形成可靠的电开关，其制造和操作相对简单。

公开(公告)号：US07602097B2

公开(公告)日：2009-10-13

申请号：US12237681

申请日：2008-09-25

申请人： Shunji Nakamura

发明人： Shunji Nakamura

IPC分类号： H02N2/00

CPC分类号： B81B3/0059 ,  B81B2201/018 ,  B81B2201/047 ,  B81B2203/0109 ,  B81B2203/0181 ,  B81B2203/053 ,  B81B2203/055 ,  B81B2203/056 ,  B81B2203/058

摘要： A movable device simultaneously enabling reduction of size down to the submicron level, higher speed operation, a streamlined production process, low costs, and greater reliability. A movable device provided with bottom electrodes and a basic conductive layer fixed to a substrate, an elastic shaft of a carbon nanotube with a bottom end fixed on the basic conductive layer and standing up, and a top structure including a top electrode spaced away from the bottom electrode and fixed to a top end of the elastic shaft, wherein when applying voltage between a bottom electrode and the top electrode, the top electrode displaces relatively to the bottom electrodes within an allowable range of elastic deformation of the elastic shaft.

摘要翻译： 可移动装置同时能够将尺寸减小到亚微米级，更高的速度操作，简化的生产过程，低成本和更高的可靠性。 一种可移动装置，其具有底部电极和固定在基板上的基本导电层，碳纳米管的弹性轴，其底端固定在基本导电层上并竖立起来，顶部结构包括顶部电极， 底部电极并固定到弹性轴的顶端，其中当在底部电极和顶部电极之间施加电压时，顶部电极在弹性轴的弹性变形的允许范围内相对于底部电极移位。

公开(公告)号：US07507665B2

公开(公告)日：2009-03-24

申请号：US11200191

申请日：2005-08-10

申请人： Koji Nitta ,  Shinji Inazawa ,  Yoshihiro Hirata ,  Kazunori Okada

发明人： Koji Nitta ,  Shinji Inazawa ,  Yoshihiro Hirata ,  Kazunori Okada

IPC分类号： H01L21/4763 ,  H01L21/44

CPC分类号： C25D5/34 ,  B81B2201/018 ,  B81B2207/07 ,  B81C1/00698 ,  C25D5/022 ,  C25D5/10 ,  H05K3/205 ,  H05K2203/0315 ,  H05K2203/1157

摘要： A method of manufacturing electrical parts is provided, which method comprises the steps of: forming a photoresist on a part of the surface of a substrate; forming a metal layer on the surface of the substrate after the photoresist has been formed; removing a part of the metal layer; removing a metal oxide film formed on the: surface of the metal layer as a result of removing a part of the metal layer; and removing the photoresist. With this method the contact resistance on the surfaces of the electrical parts can be decreased.

摘要翻译： 提供一种制造电气部件的方法，该方法包括以下步骤：在基板表面的一部分上形成光致抗蚀剂; 在形成光致抗蚀剂之后，在基板的表面上形成金属层; 去除所述金属层的一部分; 通过除去金属层的一部分，去除形成在金属层的表面上的金属氧化物膜; 并去除光致抗蚀剂。 通过这种方法，可以减少电气部件表面上的接触电阻。

公开(公告)号：US20080278268A1

公开(公告)日：2008-11-13

申请号：US11797924

申请日：2007-05-09

申请人： John S. Foster ,  Kimberly L. Turner

发明人： John S. Foster ,  Kimberly L. Turner

IPC分类号： H01H59/00 ,  H01H49/00

CPC分类号： H01H59/0009 ,  B81B2201/018 ,  B81C1/00333 ,  Y10T29/49105 ,  Y10T29/5317

摘要： Systems and methods for forming an electrostatic MEMS plate switch include forming a deformable plate on a first substrate, forming the electrical contacts on a second substrate, and coupling the two substrates using a hermetic seal. The deformable plate may have at least one shunt bar located at a nodal line of a vibrational mode of the deformable plate, so that the shunt bar remains relatively stationary when the plate is vibrating in that vibrational mode. The hermetic seal may be a gold/indium alloy, formed by heating a layer of indium plated over a layer of gold. Electrical access to the electrostatic MEMS switch may be made by forming vias through the thickness of the second substrate.

摘要翻译： 用于形成静电MEMS板开关的系统和方法包括在第一衬底上形成可变形板，在第二衬底上形成电触点，并使用气密密封来连接两个衬底。 可变形板可以具有位于可变形板的振动模式的节点线处的至少一个分流杆，使得当板在该振动模式下振动时，分流棒保持相对静止。 气密密封可以是金/铟合金，通过加热镀在一层金上的铟层而形成。 可以通过形成穿过第二基板的厚度的通孔来进行对静电MEMS开关的电接入。