摘要:
Biocompatible macromer compositions are provided including an isocyanate-functional polyalkylene oxide combined with at least one multi-functional isocyanate as a first component, and a multi-amino functional compound possessing multiple primary amines as a second component. The isocyanate-functional polyalkylene oxide has pendant polyalkylene oxide groups. The resulting biocompatible macromer composition can be employed as an adhesive or sealant for medical/surgical uses.
摘要:
An acrylic pressure-sensitive adhesive composition contains 100 parts by mass of an acrylic polymer (A), 1 to 70 parts by mass of a (meth)acrylic polymer (B) having a weight average molecular weight (Mw) of 1000≦Mw
摘要:
The present invention relates to a hybrid adhesive, in particular for use in the production of engineered wood such as particle boards, fiber boards, plywood or glued-laminated timber, comprising at least one polycondensation adhesive, at least one polyaddition adhesive, and at least one particular, in particular a nanoparticle smaller than 500 nm, wherein the at least one particle is modified with at least one compound of the general Formula (I) RaSiX(4-a), or the general Formula (II) ObXc(OH)dReSiO(4-b-c-d-e)/2. The present invention also relates to the use of the adhesive in engineered wood boards and to methods for the production thereof.
摘要:
In one aspect, adhesives for use with a 3D printer are described herein. In some embodiments, an adhesive for use with a 3D printer comprises a first polymeric component comprising a poly(vinyl alcohol) and a second polymeric component. The poly(vinyl alcohol), in some embodiments, comprises amorphous poly(vinyl alcohol). In some embodiments, the second polymeric component comprises a water-soluble polymer. Further, in some embodiments, an adhesive described herein further comprises a solvent, a surfactant, and/or a preservative.
摘要:
Compositions are described that are blends of a grafted copolymer and a polyamide. Methods of making the blended compositions are also described. The grafted copolymers are the reaction product of (1) a first compound having both an aziridinyl group and a polymeric group with (2) a second polymeric material having an acidic group. Blending the grafted copolymer with the polyamide can be used, for example, to increase the cohesive strength of the grafted copolymer.
摘要:
A water-soluble pressure sensitive adhesive comprises a homogeneous blend comprising (a) a polymer selected from the group consisting of N-vinyl caprolactam homopolymers, N-vinyl pyrrolidone copolymers, and mixtures thereof and (b) a non-volatile plasticizer comprising a monohydric or polyhydric alcohol having hydrophilic-lipophilic balance of about 2 to about 10. The N-vinyl pyrrolidone copolymers comprise about 60% or less by weight N-vinyl pyrrolidone.
摘要:
The invention relates to a hotmelt adhesive including a hotmelt adhesive mixture, the mixture having a 15-85% by weight of a first polyester-based hotmelt adhesive and a 15-85% by weight of a second, polyamide-based hotmelt adhesive.
摘要:
The present invention relates to hot-melt adhesive compositions comprising in addition to 2-(1,1-dimethylethyl)-6-[[3-(1,1-dimethylethyl)-2-hydroxy-5-methylphenyl]methyl-4-methylphenyl]acrylate as an antioxidant at least one carbodiimide compound.
摘要:
Disclosed herein is a new use for water-stable, oil-modified, nonreactive alkyd resins. It has now been found that such resins can be used as the predominant component of a construction adhesive employed in the manufacture of disposable absorbent articles, for example. As such, the construction adhesive need not employ plasticizers, tackifiers, and conventional polymers required by hot-melt adhesives typically used as construction adhesives. Furthermore, in the manufacture of disposable absorbent articles, the construction adhesive containing a water-stable, oil-modified, nonreactive, alkyd resin does not need to be processed or applied at the high temperatures required of construction adhesives containing reactive alkyds.
摘要:
Heat-activable adhesive tape particularly for producing and further processing electronic components and conductor tracks, with an adhesive composed at least of a) a polyamide having terminal amino and/or acid groups, b) an epoxy resin, c) a compound having a long apolar chain with at least 6 carbon atoms and at least one reactive end capable of reacting with the epoxy resins, d) if desired, a plasticizer, the polyamide reacting with the epoxy resin at temperatures of at least 150° C., and the ratio in weight fractions of a) to b) lying between 50:50 to 99:1.