HIGH-POWER THERMOELECTRIC CHILLER FOR COMPUTING MACHINES

    公开(公告)号:US20230403815A1

    公开(公告)日:2023-12-14

    申请号:US18333277

    申请日:2023-06-12

    Abstract: A thermoelectric chiller for cooling an electronic device comprising a chassis and a heatsink, the heatsink having a flat side and an opposing side equipped with cooling fins, the chassis and heatsink adapted for cooperative engagement to create an air-sealed chamber with the heatsink cooling fins inside the chamber; a cold air inlet on an inlet side of the chamber, the cold air inlet equipped with one or more fans adapted to force ambient air into the chamber; a hot air exhaust on an exhaust side of the chamber, the hot air exhaust providing an outlet for air to leave the chamber; one or more Peltier effect elements, each having a hot side and a cold side, the one or more Peltier effect elements disposed so that their hot side is in thermal contact with the flat side of the heat sink; a cold plate disposed over the one or more Peltier effect elements and in thermal contact with the cold side of the one or more Peltier effect elements; a controller to control the operation of the one or more fans and the one or more Peltier effect elements.

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