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61.发明授权
公开(公告)号：US4278557A
公开(公告)日：1981-07-14
申请号：US140640
申请日：1980-04-15
申请人： John L. Elwell, Jr.
发明人： John L. Elwell, Jr.
CPC分类号： C11D7/261 , C11D7/5018 , H05K3/288 , C11D7/268 , C11D7/28
摘要： A solvent solution for dissolving and removing epoxy resinous formulations. The solution is composed of a mixture of methanol, dichloromethane and distilled water as essential components.
摘要翻译： 用于溶解和除去环氧树脂制剂的溶剂溶液。 该溶液由甲醇，二氯甲烷和蒸馏水的混合物组成。
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公开(公告)号：US3995969A
公开(公告)日：1976-12-07
申请号：US516646
申请日：1974-10-21
申请人： Lawrence T. Fleming
发明人： Lawrence T. Fleming
CPC分类号： H02G1/1295 , B23Q15/013 , B44B3/007 , B44B3/061 , H02G1/1265 , H05K3/0047 , H05K3/288 , B23B2228/28 , B23B2251/14 , H05K1/118 , H05K2203/0207 , H05K2203/0228 , H05K3/281 , Y10T408/173 , Y10T409/30728
摘要： A mechanical apparatus and tool for clearing small areas of the plastic film insulation in flat flexible circuits and cables to permit making electrical connections to the metal foil conductors. An end-mill-like rotating cutter is fed into the laminated workpiece. Novel cutter geometry provides differential requirements of feed force and torque, cutting two to three times more easily into plastic than into copper. Means are provided to limit the feed force to prevent penetration into the copper foil. Means responsive to torque may be employed to retract the cutting tool automatically. A novel spring-loaded telescoping chuck is applicable to limit the feed force in single-spindle or multiple-spindle machines. The sides of the tool are slightly hollow-ground to reduce the feed-force required. The lips may be ground slightly convex to compensate for the elastic indentation of the workpiece.
摘要翻译： 一种机械设备和工具，用于清除扁平柔性电路和电缆中塑料薄膜绝缘的小区域，以允许与金属箔导体电连接。 端铣刀状旋转刀具被送入层压工件。 新型刀具几何形状提供进给力和扭矩的差异要求，比铜更容易切割成塑料的两到三倍。 提供了限制进料力以防止渗透到铜箔中的装置。 可以采用响应扭矩的装置来自动地缩回切割工具。 一种新型弹簧式伸缩卡盘适用于限制单轴或多轴机床的进给力。 工具的侧面略微是空心的，以减少所需的进给力。 可以将唇缘略微磨成凸起以补偿工件的弹性压痕。
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公开(公告)号：US20240196544A1
公开(公告)日：2024-06-13
申请号：US18076914
申请日：2022-12-07
发明人： Pei-Chung PANG
CPC分类号： H05K3/288 , G06T7/001 , H05K3/282 , G06T2207/30141 , H05K2203/108 , H05K2203/163 , H05K2203/166
摘要： A process method for laser removal of substrate solder mask by: providing a substrate with solder pads; covering the substrate and the solder pads with a solder mask, where the part of the solder mask facing the substrate is the shielding part and the part of the solder mask facing the solder pads is the clearing part; using a camera module to read the QR-code for plate production part number on the substrate; automatically importing the CAD/CAM data to the laser device, where the CAD/CAM data corresponds to the plate production part number; sequentially stripping the cleaning part through the laser beam according to the CAD/CAM data to make the solder mask form a hollow portion; taking a picture of the substrate and taking out the processed substrate picture; completing the substrate processing job if the processed substrate picture and the CAD/CAM data are the same.
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公开(公告)号：US20240040708A1
公开(公告)日：2024-02-01
申请号：US18257579
申请日：2022-01-19
发明人： Daisuke Arai , Shigeki Otsuka
CPC分类号： H05K3/288 , H05K3/305 , H05K3/4632 , H05K2203/0228
摘要： A method of manufacturing a wiring board includes covering a part of a wiring disposed on a base material for the wiring board by disposing a separation layer on the base material; covering the wiring and the separation layer by disposing a cover lay including a removal portion on the base material; and removing the removal portion of the cover lay laminated on the separation layer and exposing a part of the wiring from the cover lay by peeling the separation layer from the base material.
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公开(公告)号：US11744020B2
公开(公告)日：2023-08-29
申请号：US17537721
申请日：2021-11-30
CPC分类号： H05K1/181 , H05K1/111 , H05K3/222 , H05K3/284 , H05K3/288 , H05K3/3421 , H05K2201/1003 , H05K2201/10015 , H05K2201/1031 , H05K2201/10174 , H05K2201/10628 , H05K2203/1316
摘要： An electronic device includes a package substrate, at least one integrated circuit (IC) die including a substrate having a semiconductor surface including circuitry electrically coupled to bond pads positioned onto contact pads on a top surface of a package substrate. At least one surface mount device (SMD) component including at least a first terminal and a second terminal is on the package substrate positioned lateral to the IC die. There is at least one SMD interconnect electrically connecting to at least one of the first terminal and the second terminal to the bond pads. The SMD interconnect includes a portion of a tie bar that extends to an outer edge of the electronic device.
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公开(公告)号：US20230171894A1
公开(公告)日：2023-06-01
申请号：US17537721
申请日：2021-11-30
CPC分类号： H05K1/181 , H05K1/111 , H05K3/222 , H05K3/284 , H05K3/288 , H05K3/3421 , H05K2201/1003 , H05K2201/10015 , H05K2201/10174 , H05K2201/1031 , H05K2201/10628 , H05K2203/1316
摘要： An electronic device includes a package substrate, at least one integrated circuit (IC) die including a substrate having a semiconductor surface including circuitry electrically coupled to bond pads positioned onto contact pads on a top surface of a package substrate. At least one surface mount device (SMD) component including at least a first terminal and a second terminal is on the package substrate positioned lateral to the IC die. There is at least one SMD interconnect electrically connecting to at least one of the first terminal and the second terminal to the bond pads. The SMD interconnect includes a portion of a tie bar that extends to an outer edge of the electronic device.
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公开(公告)号：US20170359865A1
公开(公告)日：2017-12-14
申请号：US15477389
申请日：2017-04-03
发明人： Jung-min KIM , Ho-seong SHIN , Kyoung-hwan JANG
CPC分类号： H05B33/04 , H05B33/10 , H05B33/12 , H05K1/0274 , H05K1/181 , H05K3/007 , H05K3/284 , H05K3/288 , H05K2201/09018 , H05K2201/09145 , H05K2201/10106 , H05K2201/10522 , H05K2203/1316 , H05K2203/1327
摘要： The present disclosure provides a display module and a method for coating the same, which can prevent and/or reduce the occurrence of black seam between display modules that are arranged adjacent to each other. According to an example aspect of the present disclosure, a display module includes a printed circuit board; a plurality of luminous elements arranged at predetermined intervals on the printed circuit board; and a coating layer comprising a coating disposed between the respective luminous elements, disposed around side surfaces of the respective luminous elements positioned at an outermost, and formed to have a height that is substantially equal to a height of the side surfaces of the luminous elements, the coating being configured to block side light of the respective luminous elements.
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公开(公告)号：US09844146B2
公开(公告)日：2017-12-12
申请号：US15152218
申请日：2016-05-11
发明人： Peter Lutz , Kevin Buermann
CPC分类号： H05K1/189 , H05K3/288 , H05K3/305 , H05K3/328 , H05K2201/05 , H05K2201/0929 , H05K2201/10037 , H05K2201/10227 , H05K2201/1031 , H05K2201/10931 , H05K2203/0278 , H05K2203/04 , H05K2203/16
摘要： The invention is related to an electrical circuitry assembly as well as a method for manufacturing such an electrical circuitry assembly, wherein the assembly basically but not exclusively comprising of an electrically conductive metal plate and a circuit including a conductive layer and wherein both the metal plate and the circuit shall be electrically connected to each other.
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公开(公告)号：US20170150613A1
公开(公告)日：2017-05-25
申请号：US15426696
申请日：2017-02-07
CPC分类号： H05K3/28 , C09D163/00 , H05K1/02 , H05K1/11 , H05K3/0058 , H05K3/0079 , H05K3/282 , H05K3/284 , H05K3/288 , H05K3/4644 , H05K2201/0183 , H05K2201/09872 , H05K2203/1322
摘要： In an example, a process for reversibly bonding a conformal coating to a dry film solder mask (DFSM) material is disclosed. The process includes applying a first conformal coating material to a DFSM material. The first conformal coating material includes a first functional group, and the DFSM material includes a second functional group that is different from the first functional group. The process also includes reversibly bonding the first conformal coating material to the DFSM material via a chemical reaction of the first functional group and the second functional group.
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公开(公告)号：US09565773B2
公开(公告)日：2017-02-07
申请号：US14231454
申请日：2014-03-31
申请人： Apple Inc.
发明人： John J. Baker
CPC分类号： H05K3/284 , B05D3/0254 , B05D3/067 , B05D3/108 , C09J5/00 , C09J2203/326 , C09J2205/302 , C09J2205/31 , H01L21/563 , H01L2224/16225 , H01L2924/181 , H05K1/0284 , H05K3/288 , H05K2201/0251 , H05K2201/0254 , H05K2203/0126 , H05K2203/0285 , H05K2203/0292 , H05K2203/0783 , H05K2203/092 , H05K2203/102 , H05K2203/107 , H05K2203/1163 , H05K2203/1194 , H01L2924/00012
摘要： An electronic device may have housing structures, electrical components, and other electronic device structures. Adhesive may be used to join electronic device structures. Adhesive may be dispensed as liquid adhesive and cured to form adhesive joints. Adhesive joints may be debonded. Chain reactions may be initiated by applying a localized initiator such as a chemical or localized energy to the adhesive. Once initiated, the chain reaction may spread throughout the adhesive to cure the adhesive, to globally change adhesive viscosity, or to weaken the adhesive to facilitate debonding. Local changes to adhesive may also be made such as local increases and decreases to adhesive viscosity. Chain reaction curing may be used to cure adhesive or debond adhesive that is hidden from view within gaps in the electronic device structures. Viscosity changes may be used to control where adhesive flows.
摘要翻译： 电子设备可以具有壳体结构，电气部件和其他电子设备结构。 粘合剂可用于连接电子器件结构。 粘合剂可以作为液体粘合剂分配并固化以形成粘合剂接合部。 粘合接头可能脱粘。 可以通过将局部引发剂例如化学或局部化的能量施加到粘合剂来引发连锁反应。 一旦开始，连锁反应可能会蔓延到整个粘合剂中以固化粘合剂，从而全局地改变粘合剂粘度，或者削弱粘合剂以促进剥离。 还可以对粘合剂进行局部变化，例如局部增加和降低粘合剂粘度。 链反应固化可用于固化在电子设备结构的间隙内隐藏的粘合剂或脱粘合剂。 粘度变化可用于控制粘合剂流动的位置。
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