-
公开(公告)号：US20240329163A1
公开(公告)日：2024-10-03
申请号：US18609270
申请日：2024-03-19
发明人： Gernot SCHULZ , Thomas KRIVEC , Johannes STAHR
IPC分类号： G01R33/04
CPC分类号： G01R33/04
摘要： A monitoring unit includes an integrated magnetic field sensor which includes at least one excitation coil and at least one sensor coil. Both coils are provided on one side of a first magnetic structure. The monitoring unit further includes a sensed element, which is associated with the integrated magnetic field sensor. The sensed element is suitable to alter the magnetic field of the integrated magnetic field sensor.
-
公开(公告)号：US12096555B2
公开(公告)日：2024-09-17
申请号：US17655162
申请日：2022-03-16
发明人： Markus Leitgeb , Gernot Grober
CPC分类号： H05K1/113 , H05K1/181 , H05K1/186 , H05K3/341 , H05K3/429 , H01L23/49822 , H01L23/49838 , H05K1/0271 , H05K1/183 , H05K1/185 , H05K2201/094
摘要： A component carrier includes a first stack with an electrically insulating layer structure and an electrically conductive layer structure with a first density of trace structures and a second density of first connection structures, a second stack with a second electrically insulating layer structure and a second electrically conductive layer structure with a third density of second trace structures and a fourth density of second connection structures. A first component is applied to the first stack and a second component is embedded in the second stack. The first connection structures are respectively connected to the second connection structures. The first density of first trace structures is lower than the third density of second trace structures. The first stack and the second stack are connected with each other by the first connection structures and by the second connection structures. The first component is connected to the second component.
-
73.发明授权公开(公告)号：US12058810B2
公开(公告)日：2024-08-06
申请号：US17649996
申请日：2022-02-04
发明人： Mikael Tuominen , Nick Xin , Seok Kim Tay
CPC分类号： H05K1/0278 , H05K1/183 , H05K1/185 , H05K1/189 , H05K3/4655
摘要： A semi-flex component carrier includes a stack having at least one electrically insulating layer structure, at least one electrically conductive layer structure and a stress propagation inhibiting barrier. The stack defines at least one rigid portion and at least one semi-flexible portion. The stress propagation inhibiting barrier includes a plurality of stacked vias filled at least partially with electrically conductive material in an interface region between the at least one rigid portion and the at least one semi-flexible portion and configured to inhibit stress propagation between the at least one rigid portion and the at least one semi-flexible portion during bending.
-
74.发明授权公开(公告)号：US12002614B2
公开(公告)日：2024-06-04
申请号：US16949573
申请日：2020-11-04
发明人： Johannes Stahr , Gerald Weidinger , Heinz Moitzi
CPC分类号： H01F27/2804 , H01F17/0013 , H01F27/24 , H01F27/2847 , H01F41/041 , H01F41/042 , H01F41/046 , H01F17/0033 , H05K1/181 , H05K1/185 , H05K2201/1003
摘要： An inductor component includes a plurality of stacked layer structures made of component carrier material with electrically conductive plate structures, and a plurality of electrically conductive interconnect structures connecting the electrically conductive plate structures to thereby form an inductance with multiple windings.
-
75.发明公开公开(公告)号：US20240090118A1
公开(公告)日：2024-03-14
申请号：US18518724
申请日：2023-11-24
发明人： Erich Schlaffer , Sebastian Sattler
CPC分类号： H05K1/0204 , H05K1/182 , H05K3/30 , H05K2201/10416
摘要： A component carrier includes: i) a first layer stack (comprising at least one first electrically conductive layer structure and/or at least one first electrically insulating layer structure, ii) a component embedded in the first layer stack, where a main surface of the component is essentially flush with an outer main surface of the first layer stack iii) a second layer stack comprising at least one second electrically conductive layer structure and/or at least one second electrically insulating layer structure, and iv) a thermally conductive block embedded in the second layer stack. The layer stacks are connected with each other so that a thermal path from the embedded component via the thermally conductive block up to an exterior surface of the component carrier has a minimum thermal conductivity of at least 7 W/mK, in particular at least 40 W/mK. Further, a method of manufacturing the component carrier is described.
-
公开(公告)号：US20240030095A1
公开(公告)日：2024-01-25
申请号：US18473775
申请日：2023-09-25
发明人： Mikael Andreas Tuominen , Seok Kim Tay , Johannes Stahr , Andreas Zluc , Timo Schwarz , Gerald Weidinger , Mario Schober
IPC分类号： H01L23/373 , H01L23/492 , H01L23/00 , H01L21/56
CPC分类号： H01L23/3737 , H01L23/492 , H01L24/20 , H01L24/19 , H01L21/56 , H01L2224/21 , H01L2224/2201 , H01L2224/19
摘要： An electronic package having a base structure; a layer stack formed over the base structure; and a component embedded at least partially within the base structure and/or within the layer stack. The layer stack has a decoupling layer structure, the decoupling layer structure with a decoupling material having a Young Modulus being smaller than 1 GPa.
-
77.发明公开公开(公告)号：US20240014142A1
公开(公告)日：2024-01-11
申请号：US18251875
申请日：2021-11-05
发明人： Mike Morianz , Johannes Stahr , Simon Pressler , Maria Prutti
IPC分类号： H01L23/538 , H01L23/00 , H01L25/07 , H01L25/00 , H01L23/373
CPC分类号： H01L23/5389 , H01L24/24 , H01L25/072 , H01L23/5384 , H01L25/50 , H01L24/82 , H01L23/3735 , H01L2224/24137 , H01L24/32 , H01L2224/32225 , H01L24/29 , H01L2224/29139 , H01L2224/73267 , H01L24/83 , H01L2224/8384 , H01L2224/82106 , H01L24/92 , H01L2224/92244 , H01L2924/10253 , H01L2924/10272 , H01L2924/1033 , H01L2924/13055 , H01L2924/13091
摘要： A component carrier which includes a stack having at least one electrically conductive layer structure and/or at least one electrically insulating layer structure, a first electronic component and a second electronic component arranged in the stack, a first block and a second block arranged in the stack below the first electronic component and the second electronic component, and a third block and a fourth block arranged in the stack above the first electronic component and the second electronic component, wherein said blocks are thermally conductive.
-
78.发明公开公开(公告)号：US20230411247A1
公开(公告)日：2023-12-21
申请号：US18460632
申请日：2023-09-04
发明人： Roland Wilfing
CPC分类号： H01L23/481 , H01L24/19 , H01L24/20 , H01L2224/2101 , H01L2224/214 , H01L2224/215 , H01L2224/19
摘要： A component carrier includes a stack having at least one electrically conductive layer structure and at least one electrically insulating layer structure. At least one of the at least one electrically insulating layer structure(s) has at least partly tapered through holes filled substantially completely with an electrically conductive filling. The at least one electrically conductive layer structure and the electrically conductive filling are made of the same material. Different ones of the through holes of one electrically insulating layer structure are tapering in opposite directions.
-
公开(公告)号：US11784115B2
公开(公告)日：2023-10-10
申请号：US17444266
申请日：2021-08-02
发明人： Roland Wilfing
IPC分类号： H05K1/02 , H05K1/11 , H01L23/498 , H01L21/48
CPC分类号： H01L23/49822 , H01L21/4857 , H05K1/0271 , H05K1/11 , H05K1/0204 , H05K1/0206 , H05K2201/041 , H05K2201/06 , H05K2201/096 , H05K2201/09827
摘要： A component carrier includes a stack with at least one electrically conductive layer structure and at least one electrically insulating layer structure. At least one electrically insulating layer structure has at least partly tapering through holes filled substantially completely with an electrically conductive filling. The at least one electrically conductive layer structure and the electrically conductive filling are made of the same material. In addition, different ones of the through holes of one electrically insulating layer structure are tapering in opposite directions.
-
80.发明授权公开(公告)号：US11683884B2
公开(公告)日：2023-06-20
申请号：US17304458
申请日：2021-06-21
发明人： Imane Souli , Erich Preiner , Martin Schrei , Vanesa López Blanco
CPC分类号： H05K1/0313 , H05K1/185
摘要： A component carrier having a stack with at least one electrically conductive layer structure and/or at least one electrically insulating layer structure and having a cavity delimited at least partially by a first polymer, and a component embedded in the cavity of the stack and being at least partially covered by a second polymer, wherein an anchoring interface is formed at an interface between the first polymer and the second polymer at which the first polymer and the second polymer are mechanically anchored with each other.
-
-
-
-
-
-
-
-
-
搜索结果
389 条记录 (耗时 0.032 秒)
