公开(公告)号：US20240158667A1

公开(公告)日：2024-05-16

申请号：US18281558

申请日：2022-03-07

Applicant: KCTECH CO., LTD.

Inventor： Jung Hun KIM ,  Jun Ha HWANG ,  O Seong KWON

IPC: C09G1/02

CPC classification number: C09G1/02

Abstract: The present disclosure relates to a polishing slurry composition and to a polishing slurry composition including nanoceria abrasive particles and a water-soluble compound including an intramolecular hydrophilic group, and further selectively including at least one from among an amphoteric compound including an intramolecular carboxyl group and amine group, a surface modifier including an organic acid, and a pH adjuster.

公开(公告)号：US11845912B2

公开(公告)日：2023-12-19

申请号：US17416420

申请日：2019-08-07

Applicant: KCTECH CO., LTD.

Inventor： Ga Young Jung ,  Yong Ho Jeong ,  Kun Hee Park ,  Young Gon Kim ,  Young Ho Yoon ,  Young Lok Yoon

IPC: C11D1/37 ,  C11D3/20 ,  C11D1/14 ,  C11D1/34 ,  C11D3/34 ,  C11D3/36 ,  C11D11/00

CPC classification number: C11D3/2075 ,  C11D1/146 ,  C11D1/345 ,  C11D3/2093 ,  C11D3/3409 ,  C11D3/36 ,  C11D11/0047

Abstract: The present disclosure relates to a cleaning liquid composition and a cleaning method using the same. A polishing slurry composition according to an embodiment of the present disclosure includes: a chelating agent containing an organic salt; and an anionic surfactant.

公开(公告)号：US20230398580A1

公开(公告)日：2023-12-14

申请号：US18144718

申请日：2023-05-08

Applicant: KCTECH CO., LTD.

Inventor： Ji Hoon SON

IPC: B08B1/00 ,  B08B1/02 ,  A46B13/00 ,  A46B13/02 ,  A46B15/00 ,  B08B13/00

CPC classification number: B08B1/002 ,  B08B1/02 ,  A46B13/001 ,  A46B13/02 ,  A46B15/0038 ,  A46B15/0004 ,  B08B13/00 ,  A46B2200/3073 ,  G08B21/187

Abstract: Provided is a substrate cleaning apparatus, comprising: a substrate support unit for rotating and holding a substrate; a brush unit for cleaning the substrate with a cleaning brush formed in the form of a roll and rotating in contact with a surface of the substrate; and a vibration sensor installed on the brush unit to detect vibrations generated by the contact of the cleaning brush with the substrate, thereby improving process efficiency by predicting cleaning results before cleaning is completed.

公开(公告)号：US11749549B2

公开(公告)日：2023-09-05

申请号：US16748834

申请日：2020-01-22

Applicant: KCTECH CO., LTD.

Inventor： Dong Min Kim

IPC: H01L21/677 ,  C23C16/44 ,  H01L21/67 ,  B24B57/02 ,  B05C11/06 ,  B05D3/04

CPC classification number: H01L21/67739 ,  B05C11/06 ,  B24B57/02 ,  C23C16/4412 ,  H01L21/6719 ,  B05D3/04 ,  H01L21/67051 ,  Y10S55/29 ,  Y10S414/139

Abstract: The present disclosure relates to a substrate processing apparatus, and more specifically, to a substrate processing apparatus capable of blocking the introduction of external air and external particles into a chamber by forming an air curtain at a loading/unloading part when the chamber is open. The substrate processing apparatus of the present disclosure includes a chamber in which a space is formed, and a fluid injection part configured to inject a fluid from an outer side of a substrate loading/unloading part of the chamber through which a substrate is loaded and unloaded.

公开(公告)号：US11732217B2

公开(公告)日：2023-08-22

申请号：US17381211

申请日：2021-07-21

Applicant: KCTECH CO., LTD.

Inventor： Kun Hee Park ,  Yong Ho Jeong ,  Kyong Jin Jung ,  Young Ho Yun

IPC: C11D7/32 ,  C11D3/24 ,  C11D3/00 ,  C11D1/40 ,  H01L21/304 ,  C11D11/00 ,  H01L21/306 ,  H01L21/321 ,  C11D3/37

CPC classification number: C11D3/245 ,  C11D1/40 ,  C11D3/0047 ,  C11D3/3773 ,  C11D11/0047 ,  H01L21/304 ,  H01L21/306 ,  H01L21/3212

Abstract: A cleaning solution composition and a cleaning method using the cleaning solution composition are provided. The cleaning solution composition includes a chelating agent including a first organic acid and a second organic acid, and an etching agent including a fluoride compound.

公开(公告)号：US20230256559A1

公开(公告)日：2023-08-17

申请号：US18012042

申请日：2021-06-11

Applicant: KCTECH CO., LTD.

Inventor： Ji Hoon SON

IPC: B24B37/04 ,  B24B37/013

CPC classification number: B24B37/042 ,  B24B37/013

Abstract: The substrate polishing system, according to an example embodiment, includes a plurality of polishing apparatuses configured to sequentially polish a substrate, and each of the polishing apparatuses includes a polishing platen polishing a substrate, a data collector collecting a signal generated in a polishing process of the substrate, a data analyzer detecting a thickness of a substrate by analyzing the collected signal, and a polishing endpoint detector determining a polishing endpoint of a substrate based on the detected thickness of a substrate, and the plurality of polishing apparatuses is configured to share data with each other, and based on a polishing order of a substrate, the data obtained from one polishing apparatus of the plurality of polishing apparatuses is configured to be reflected in a detection process of a substrate thickness detection of another polishing apparatus of the plurality of polishing apparatuses in next sequence.

公开(公告)号：US20230225807A1

公开(公告)日：2023-07-20

申请号：US18074806

申请日：2022-12-05

Applicant: Samsung Display Co., Ltd. ,  KCTECH CO.,LTD.

Inventor： YUNKU KANG ,  JUN HO KANG ,  EUN HO PARK ,  SUNGMIN PARK

IPC: A61B34/30

CPC classification number: A61B34/30 ,  A61B2034/306

Abstract: A robot arm includes a first hand, a second hand, and a distance adjusting part for adjusting a distance between the first hand and the second hand. The first hand includes a first body portion and a plurality of first protruding portions protruded from the first body portion to a second direction and arranged in a first direction crossing the second direction. The second hand includes a second body portion and a plurality of second protruding portions protruded from the second body portion to the second direction and arranged in the first direction. The first protruding portions and the second protruding portions are disposed between the first body portion and the second body portion.

公开(公告)号：US11701693B2

公开(公告)日：2023-07-18

申请号：US17781700

申请日：2020-11-05

Applicant: KCTECH CO., LTD.

Inventor： Hyung Chul Kim ,  Dong Hwa Lee ,  You Sun Jung

IPC: H01L21/67 ,  B08B13/00 ,  B08B7/00

CPC classification number: B08B13/00 ,  B08B7/0021

Abstract: The substrate processing device according to one embodiment may comprise: a chamber unit provided with a processing space therein and comprising an inclined chamber surface having an opening; a door unit comprising an inclined door surface, which corresponds to the inclined chamber surface, and capable of being coupled to the chamber unit; and a door driving unit for driving the door unit so as to open/close the processing space.

公开(公告)号：US20230072716A1

公开(公告)日：2023-03-09

申请号：US17897222

申请日：2022-08-29

Applicant: KCTECH CO., LTD.

Inventor： Jung Hun KIM ,  Jeong Gyu LEE ,  Hyo Jun JANG

IPC: C09K3/14 ,  C09G1/02

Abstract: The present disclosure relates to cerium oxide abrasive particles and a polishing slurry composition, and more particularly, to cerium oxide abrasive particles comprising: an element cerium; and a modifier and satisfying the agglomeration ratios calculated from the relational expressions of the primary particle sizes and the secondary particle sizes, and a polishing slurry composition comprising the same.

公开(公告)号：US20220305611A1

公开(公告)日：2022-09-29

申请号：US17697891

申请日：2022-03-17

Applicant: KCTECH CO., LTD.

Inventor： Hee Cheul JUNG ,  Geun Sik YUN ,  Hyung Seob SHIM ,  Sung Ho SHIN

IPC: B24B37/015 ,  B24B37/20 ,  B24B57/02 ,  B24B55/03

Abstract: A substrate polishing method for polishing a substrate through a polishing pad according to an embodiment may comprise: a preheating step of increasing the temperature of the polishing pad by supplying heated pure water to the polishing pad before polishing the substrate; and a temperature control step of controlling the temperature of the polishing pad by adjusting the temperature of the slurry supplied to the polishing pad in a polishing process of the substrate.