摘要:
A semiconductor memory device may include a semiconductor substrate, at least one control gate electrode, at least one storage node layer, at least one tunneling insulating layer, at least one blocking insulating layer, and/or first and second channel regions. The at least one control gate electrode may be recessed into the semiconductor substrate. The at least one storage node layer may be between a sidewall of the at least one control gate electrode and the semiconductor substrate. The at least one tunneling insulating layer may be between the at least one storage node layer and the at least one control gate electrode. The at least one blocking insulating layer may be between the storage node layer and the control gate electrode. The first and second channel regions may be between the at least one tunneling insulating layer and the semiconductor substrate to surround at least a portion of the sidewall of the control gate electrode and/or may be separated from each other.
摘要:
Disclosed herein are a valve and a micro fluid pump having the same. The valve is mounted in a micro fluid pump having a capillary tube, to which a gas supply unit and a fluid transfer pipe are connected, for controlling the introduction and the discharge of fluid. The valve includes a discharge pipe filled with liquid such that the discharge pipe has a predetermined resistance pressure and constructed in a structure in which one end of the discharge pipe is connected to the capillary tube such that the discharge pipe communicates with the interior of the capillary tube, and the other end of the discharge pipe is open, thereby allowing gas out of the capillary tube through the discharge pipe when a gas pressure in the capillary tube exceeds the resistance pressure of the discharge pipe.
摘要:
The stacked semiconductor device includes a semiconductor substrate, a multi-layered insulation layer pattern having at least two insulation layer patterns and an opening, an active layer pattern formed on each of the insulation layer patterns, a first plug including single crystalline silicon-germanium, a second plug including single crystalline silicon, and a wiring electrically connected to the first plug and sufficiently filling up the opening. The insulation layer patterns are vertically stacked on the semiconductor substrate and the opening exposes an upper face of the semiconductor substrate. A side portion of the active layer pattern is exposed by the opening. The first plug is formed on the upper face of the semiconductor substrate to partially fill the opening. The second plug is partially formed on the first plug, and has substantially the same interface as that of the first plug.
摘要:
A magnetic random access memory (MRAM), and a method of manufacturing the same, includes a switching device and a magnetic tunneling junction (MTJ) cell connected to the switching device, wherein the MTJ cell includes a pinned film having a metal film and a magnetic film, the magnetic film enclosing the metal film.
摘要:
A memory device includes a gate stack on a substrate. The gate stack is disposed between a source and a drain. The gate stack includes a tunneling film, storage node, and control oxide film. A thickness of the control oxide film is greater than or equal to about 5 nm and less than or equal to about 30 nm. A method of manufacturing a memory device, including a gate stack on a substrate, wherein the gate stack is disposed between a source and a drain, includes: sequentially forming a tunneling film, a first silicon-rich oxide film, and a control oxide film on the substrate, wherein the first silicon-rich oxide film comprises a SiOx film (1.5
摘要:
A memory device and method for operating the same are provided. The example method may be directed to a method of performing a memory operation on a memory device, and may include applying a negative voltage bias to the memory device during a programming operation of the memory device and applying a positive voltage bias to the memory device during an erasing operation of the memory device. The example memory device may include a substrate and a gate structure formed on the substrate, the gate structure exhibiting a faster flat band voltage shift under a negative voltage bias than under a positive voltage bias, the gate structure receiving a negative voltage bias during a programming of the memory device and receiving a positive voltage bias during an erasing operation of the memory device.
摘要:
A semiconductor memory device having an alloy gate electrode layer and method of manufacturing the same are provided. The semiconductor memory device may include a semiconductor substrate having a first impurity region and a second impurity region. The semiconductor memory device may include a gate structure formed on the semiconductor substrate and contacting the first and second impurity regions. The gate structure may include an alloy gate electrode layer formed of a first metal and a second metal. The first metal may be a noble metal. The second metal may include at least one of aluminum (Al) and titanium (Ti), gallium (Ga), indium (In), tin (Sb), thallium (Tl), bismuth (Bi) and lead (Pb).
摘要:
A light sensing panel includes a scan line transmitting a scan signal, a power source line transmitting a bias voltage, a readout line transmitting a light sensing signal and a light sensing device. The light sensing device includes a control electrode that is electrically connected to the scan line to receive the scan signal, a first current electrode that is electrically connected to the power source line to receive the bias voltage, and a second current electrode that is electrically connected to the readout line to apply a light sensing signal to the readout line when the light sensing signal senses an external light. The light sensing panel requires only one thin film transistor in order to detect a position wherein the external light is incident. Therefore, electrical coupling between devices is reduced and aperture ratio is increased, thereby enhancing a display quality.
摘要:
A memory device may include a switching device and a storage node coupled with the switching device. The storage node may include a first electrode, a second electrode, a data storage layer and at least one contact layer. The data storage layer may be disposed between the first electrode and the second electrode and may include a transition metal oxide or aluminum oxide. The at least one contact layer may be disposed at least one of above or below the data storage layer and may include a conductive metal oxide.
摘要:
Nonvolatile memory devices and methods of manufacturing the same are provided. The nonvolatile memory devices may include an oxide layer formed of a resistance conversion material, a lower electrode, a nano-wire layer formed of a transition metal on the lower electrode, and an upper electrode formed on the oxide layer. According to example embodiments, a reset current may be stabilized by unifying a current path on the oxide layer.