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    Power semiconductor module
    73.
    发明授权
    Power semiconductor module 有权
    功率半导体模块

    公开(公告)号：US08796730B2

    公开(公告)日：2014-08-05

    申请号：US13313713

    申请日：2011-12-07

    申请人： Young Ki Lee ,  Dong Soo Seo ,  Kwang Soo Kim ,  Young Hoon Kwak

    发明人： Young Ki Lee ,  Dong Soo Seo ,  Kwang Soo Kim ,  Young Hoon Kwak

    IPC分类号： H01L29/739

    CPC分类号： H01L23/4824 ,  H01L29/7393 ,  H01L2924/0002 ,  H01L2924/00

    摘要： Disclosed herein is a power semiconductor module including: a circuit board having gate, emitter, and collector patterns formed thereon; a first semiconductor chip mounted on the circuit board, having gate and emitter terminals each formed on one surface thereof, and having a collector terminal formed on the other surface thereof; a second semiconductor chip mounted on the first semiconductor chip, having a cathode terminal formed on one surface thereof, and having an anode terminal formed on the other surface thereof; a first conductive connection member having one end disposed between the collector terminal of the first semiconductor chip and the cathode terminal of the second semiconductor chip and the other end contacting the collector pattern of the circuit board; and a second conductive connection member having one end contacting the anode terminal of the second semiconductor chip and the other end contacting the emitter pattern of the circuit board.

    摘要翻译： 本文公开了一种功率半导体模块，包括：电路板，其上形成有栅极，发射极和集电极图案; 安装在所述电路板上的第一半导体芯片，在其一个表面上形成有栅极和发射极端子，并且在其另一个表面上形成集电极端子; 安装在所述第一半导体芯片上的第二半导体芯片，具有在其一个表面上形成的阴极端子，并且在其另一个表面上形成阳极端子; 第一导电连接构件，其一端设置在第一半导体芯片的集电极端子和第二半导体芯片的阴极端子之间，另一端接触电路板的集电体图案; 以及第二导电连接构件，其一端接触第二半导体芯片的阳极端子，另一端接触电路板的发射极图案。

    SEMICONDUCTOR PACKAGE MODULE
    75.
    发明申请
    SEMICONDUCTOR PACKAGE MODULE 审中-公开
    半导体封装模块

    公开(公告)号：US20130341782A1

    公开(公告)日：2013-12-26

    申请号：US13614112

    申请日：2012-09-13

    申请人： Kwang Soo Kim ,  Young Ki Lee ,  Bum Seok Suh

    发明人： Kwang Soo Kim ,  Young Ki Lee ,  Bum Seok Suh

    IPC分类号： H01L23/367

    CPC分类号： H01L23/49575 ,  H01L23/467 ,  H01L23/473 ,  H01L23/49562 ,  H01L25/115 ,  H01L25/18 ,  H01L2224/16 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/00

    摘要： There is provided a semiconductor package module, and more particularly, a semiconductor package module constituted by modularizing power semiconductor devices incapable of being able to be easily integrated due to heat generated therefrom. To this end, the semiconductor package module includes a plurality of semiconductor packages; and a plurality of semiconductor packages; and a heat dissipation member having a pipe shape including a flow channel formed therein and including at least one or more through holes into which the semiconductor packages are inserted.

    摘要翻译： 提供了一种半导体封装模块，更具体地说，一种半导体封装模块，其通过模块化功率半导体器件而构成，该半导体封装模块不能由于其产生的热而容易地集成。 为此，半导体封装模块包括多个半导体封装; 和多个半导体封装; 以及散热构件，其具有包括形成在其中的流动通道的管状，并且包括至少一个或多个通孔，半导体封装被插入其中。

    Method of manufacturing package substrate for optical element
    76.
    发明授权
    Method of manufacturing package substrate for optical element 有权
    制造光学元件封装基板的方法

    公开(公告)号：US08603842B2

    公开(公告)日：2013-12-10

    申请号：US13418241

    申请日：2012-03-12

    申请人： Chang Hyun Lim ,  Seog Moon Choi ,  Sang Hyun Shin ,  Sung Keun Park ,  Young Ki Lee

    发明人： Chang Hyun Lim ,  Seog Moon Choi ,  Sang Hyun Shin ,  Sung Keun Park ,  Young Ki Lee

    IPC分类号： H01L33/62

    CPC分类号： H01L33/54 ,  H01L33/505 ,  H01L33/62 ,  H01L2224/32225 ,  H01L2224/73265 ,  H01L2224/48091 ,  H01L2924/00014

    摘要： Disclosed is a package substrate for an optical element, which includes a base substrate, a first circuit layer formed on the base substrate and including a mounting portion, an optical element mounted on the mounting portion, one or more trenches formed into a predetermined pattern around the mounting portion by removing portions of the first circuit layer so that the first circuit layer and the optical element are electrically connected to each other, and a fluorescent resin material applied on an area defined by the trenches so as to cover the optical element, and in which such trenches are formed on the first circuit layer so that the optical element and the first circuit layer are electrically connected to each other, thus maintaining the shape of the fluorescent resin material and obviating the need to form a via under the optical element. A method of manufacturing the package substrate for an optical element is also provided.

    摘要翻译： 公开了一种用于光学元件的封装基板，其包括基底基板，形成在基底基板上并包括安装部分的第一电路层，安装在安装部分上的光学元件，形成为预定图案的一个或多个沟槽 通过去除第一电路层的部分使得第一电路层和光学元件彼此电连接的安装部分和施加在由沟槽限定的区域以覆盖光学元件的荧光树脂材料，以及 其中这种沟槽形成在第一电路层上，使得光学元件和第一电路层彼此电连接，从而保持荧光树脂材料的形状，并且消除了在光学元件下形成通孔的需要。 还提供了一种制造用于光学元件的封装衬底的方法。

    Arrowhead having expanding blades controlled by gear mechanism
    77.
    发明授权
    Arrowhead having expanding blades controlled by gear mechanism 有权
    具有由齿轮机构控制的扩张叶片的箭头

    公开(公告)号：US08529385B1

    公开(公告)日：2013-09-10

    申请号：US13479073

    申请日：2012-05-23

    申请人： Young Ki Lee

    发明人： Young Ki Lee

    IPC分类号： F42B6/08

    CPC分类号： F42B6/08

    摘要： Disclosed is an arrowhead in which a plurality of expandable blades can be quickly and reliably retracted or expanded without using an additional means to bundle the expanding blades, thereby enhancing the penetrating capability or killing capability of an arrow. Particularly, a portion of a shaft forming the arrowhead is provided with a rack gear portion formed thereon and a lower end of each of the expanding blades is provided with a pinion gear portion, such that the rack gear portion and the pinion gear portion engage with each other and such a rack-pinion action controls the operation of retracting or expanding the expanding blades.

    摘要翻译： 公开了一种箭头，其中可以快速且可靠地缩回或扩展多个可扩展叶片，而不需要使用附加装置来捆扎扩张刀片，从而增强箭头的穿透能力或杀伤能力。 特别地，形成箭头的轴的一部分设置有形成在其上的齿条部分，并且每个扩展叶片的下端设置有小齿轮部分，使得齿条部分和小齿轮部分与 彼此并且这种齿条 - 小齿轮动作控制缩回或扩大扩张刀片的操作。

    POWER MODULE PACKAGE
    78.
    发明申请
    POWER MODULE PACKAGE 有权
    电源模块封装

    公开(公告)号：US20130134571A1

    公开(公告)日：2013-05-30

    申请号：US13353128

    申请日：2012-01-18

    申请人： Kwang Soo KIM ,  Young Hoon KWAK ,  Young Ki LEE

    发明人： Kwang Soo KIM ,  Young Hoon KWAK ,  Young Ki LEE

    IPC分类号： H01L23/34

    CPC分类号： H01L23/473 ,  H01L25/072 ,  H01L25/162 ,  H01L2224/48091 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/00014 ,  H01L2924/00

    摘要： Disclosed herein is a power module package including: a first heat dissipation plate including a first flow path, a second flow path, and a third flow path which are sequentially formed, the first flow path and the third flow path being formed to have a step therebetween; and a second heat dissipation plate formed under the first heat dissipation plate, having one face and the other face, having a semiconductor device mounting groove formed in the one face thereof, and including a fourth flow path having one end connected to the second flow path and the other end connected to the third flow path, wherein a cooling material introduced through the first flow path is distributed to the third flow path and the fourth flow path based on the second flow path.

    摘要翻译： 本文公开了一种功率模块封装，包括：第一散热板，包括顺序地形成的第一流路，第二流路和第三流路，第一流路和第三流路形成为具有台阶 之间; 以及形成在所述第一散热板下方的第二散热板，具有一个面和另一个面，在其一个面上形成有半导体器件安装槽，并且包括第四流路，其一端连接到所述第二流路 并且另一端连接到第三流动路径，其中通过第一流动路径引入的冷却材料基于第二流动路径分配到第三流动路径和第四流动路径。