公开(公告)号：US20150160649A1

公开(公告)日：2015-06-11

申请号：US14626147

申请日：2015-02-19

Applicant: Applied Materials, Inc.

Inventor： Jeffrey Drue David ,  Harry Q. Lee ,  Dominic J. Benvegnu ,  Boguslaw A. Swedek

IPC: G05B19/418

CPC classification number: G05B19/418 ,  B24B37/013 ,  B24B37/042 ,  B24B37/205 ,  B24B49/12 ,  G05B2219/45232

Abstract: In one aspect, a method of polishing includes polishing a substrate, and receiving an identification of a selected spectral feature and a characteristic of the selected spectral feature to monitor during polishing. The method includes measuring a sequence of spectra of light reflected from the substrate while the substrate is being polished, where at least some of the spectra of the sequence differ due to material being removed during the polishing. The method of polishing includes determining a value of a characteristic of the selected spectral feature for each of the spectra in the sequence of spectra to generate a sequence of values for the characteristic, fitting a function to the sequence of values, and determining either a polishing endpoint or an adjustment for a polishing rate based on the function.

Abstract translation: 在一个方面，抛光方法包括抛光衬底，以及接收所选择的光谱特征的识别和所选择的光谱特征的特征以在抛光期间进行监测。 该方法包括测量在衬底被抛光时从衬底反射的光的光谱序列，其中序列的至少一些光谱由于在抛光期间被去除的材料而不同。 抛光方法包括确定光谱序列中的每个光谱的所选光谱特征的特征值，以产生特征值的序列，将功能拟合到值序列，以及确定抛光 端点或基于该功能的抛光速率的调整。

公开(公告)号：US20150120243A1

公开(公告)日：2015-04-30

申请号：US14063917

申请日：2013-10-25

Applicant: Applied Materials, Inc.

Inventor： Jeffrey Drue David ,  Boguslaw A. Swedek ,  Benjamin Cherian

IPC: G01B11/06 ,  G06F17/16

CPC classification number: B24B37/013 ,  B24B49/12 ,  G01B11/06 ,  G01B11/0625 ,  H01L21/30625 ,  H01L22/12 ,  H01L22/20 ,  H01L22/26

Abstract: Among other things, a machine based method comprises representing a plurality of spectra reflected from one or more substrates at a plurality of different positions on the one or more substrates in the form of a first matrix; decomposing, by one or more computers, the first matrix into products of at least two component matrixes of a first set of component matrixes; reducing dimensions of each of the at least two component matrixes to produce a second set of component matrixes containing the at least two matrixes with reduced dimensions; and generating, by the one or more computers, a second matrix by taking a product of the matrixes of the second set of component matrixes.

Abstract translation: 除其他之外，基于机器的方法包括表示在一个或多个基板上的第一矩阵形式的多个不同位置处的一个或多个基板反射的多个光谱; 通过一个或多个计算机将第一矩阵分解成第一组分矩阵的至少两个分量矩阵的乘积; 减少所述至少两个组分矩阵中的每一个的尺寸以产生包含具有减小的尺寸的所述至少两个矩阵的第二组分量矩阵; 以及由所述一个或多个计算机通过获取所述第二组分量矩阵的矩阵的乘积来生成第二矩阵。

公开(公告)号：US20150118765A1

公开(公告)日：2015-04-30

申请号：US14066509

申请日：2013-10-29

Applicant: Applied Materials, Inc.

Inventor： Kun Xu ,  Shih-Haur Shen ,  Boguslaw A. Swedek ,  Ingemar Carlsson ,  Doyle E. Bennett ,  Wen-Chiang Tu ,  Hassan G. Iravani ,  Tzu-Yu Liu

IPC: H01L21/66 ,  B24B37/013 ,  B24B49/10 ,  H01L21/321

CPC classification number: H01L22/26 ,  B24B37/013 ,  B24B49/105 ,  H01L21/3212 ,  H01L22/14

Abstract: In one aspect, a method of controlling polishing includes receiving a measurement of an initial thickness of a conductive film on a first substrate prior to polishing the first substrate from an in-line or stand-alone monitoring system, polishing one or more substrates in a polishing system, the one or more substrates including the first substrate, during polishing of the one or more substrates, monitoring the one or more substrates with an eddy current monitoring system to generate a first signal, determining a starting value of the first signal for a start of polishing of the first substrate, determining a gain based on the starting value and the measurement of the initial thickness, for at least a portion of the first signal collected during polishing of at least one substrate of the one or more substrates, and calculating a second signal based on the first signal and the gain.

Abstract translation: 一方面，一种控制抛光的方法包括：在从第一基板或独立监视系统抛光第一基板之前，在第一基板上接收导电膜的初始厚度的测量，在一个或多个基板中抛光一个或多个基板 抛光系统，所述一个或多个衬底包括第一衬底，在一个或多个衬底的抛光期间，用涡流监视系统监测该一个或多个衬底以产生第一信号，确定第一信号的起始值 开始抛光第一衬底，对于在一个或多个衬底的至少一个衬底的抛光期间收集的第一信号的至少一部分，基于起始值和初始厚度的测量来确定增益，并且计算 基于第一信号和增益的第二信号。

公开(公告)号：US08858298B2

公开(公告)日：2014-10-14

申请号：US13748456

申请日：2013-01-23

Applicant: Applied Materials, Inc.

Inventor： Boguslaw A. Swedek ,  Manoocher Birang

IPC: B24B1/00 ,  B24D11/02 ,  B24B37/013 ,  B24B49/02 ,  B24B49/10 ,  G01B7/06 ,  B24B37/20 ,  B24B49/12 ,  B24B37/26

CPC classification number: B24B37/26 ,  B24B37/013 ,  B24B37/205 ,  B24B49/02 ,  B24B49/10 ,  B24B49/105 ,  B24B49/12 ,  B24D11/02 ,  G01B7/105

Abstract: A method of forming a polishing pad with a polishing layer having a polishing surface and a back surface. A plurality of grooves are formed on the polishing surface, and an indentation is formed in the back surface of the polishing layer. A region on the polishing surface corresponding to the indentation in the back surface is free of grooves or has shallower grooves.

Abstract translation: 一种用具有研磨面和背面的研磨层形成研磨垫的方法。 在研磨面上形成有多个凹槽，在研磨层的背面形成有凹部。 与后表面的凹部对应的研磨面上的区域没有凹槽或具有较浅的凹槽。

公开(公告)号：US20140242883A1

公开(公告)日：2014-08-28

申请号：US13779682

申请日：2013-02-27

Applicant: Applied Materials, Inc.

Inventor： Benjamin Cherian ,  Jeffrey Drue David ,  Boguslaw A. Swedek ,  Thomas H. Osterheld ,  Jun Qian ,  Thomas Li ,  Doyle E. Bennett ,  David J. Lischka ,  Steven M. Zuniga

IPC: B24B49/12

CPC classification number: B24B49/12 ,  B24B27/0023 ,  B24B37/013

Abstract: A polishing apparatus includes a carrier head configured to hold a wafer in a first plane, the wafer having a perimeter and a fiducial, a drive shaft having an axis perpendicular to the first plane and configured to rotate the carrier head about the axis, a light source configured to direct light onto an outer face of the wafer at a position adjacent the perimeter of the wafer; a detector configured to detect the light collected from the wafer while the drive shaft rotates the carrier head and the wafer; and a controller configured to receive a first signal indicating an angular position of the drive shaft and receive a second signal from the detector, the controller configured to determine based on the first signal and the second signal an angular position of the fiducial with respect the carrier head.

Abstract translation: 抛光装置包括：承载头，其构造成将晶片保持在第一平面中，晶片具有周边和基准;驱动轴，其具有垂直于第一平面的轴线，并且构造成使承载头绕轴线旋转;光 源被配置为在与晶片的周边相邻的位置处将光引导到晶片的外表面; 检测器，配置成在驱动轴旋转载体头和晶片时检测从晶片收集的光; 以及控制器，被配置为接收指示所述驱动轴的角位置并接收来自所述检测器的第二信号的第一信号，所述控制器被配置为基于所述第一信号和所述第二信号确定所述基准相对于所述载体的角位置 头。

公开(公告)号：US08718810B2

公开(公告)日：2014-05-06

申请号：US13666578

申请日：2012-11-01

Applicant: Applied Materials, Inc.

Inventor： Dominic J. Benvegnu ,  Boguslaw A. Swedek ,  Jeffrey Drue David ,  Harry Q. Lee

IPC: G06F19/00

CPC classification number: H01L22/12 ,  B24B37/013 ,  B24B49/12 ,  H01L22/26

Abstract: While a substrate is polished, it is also irradiated with light from a light source. A current spectrum of the light reflected from the surface of the substrate is measured. A selected peak, having a first parameter value, is identified in the current spectrum. A value of a second parameter associated with the first parameter is determined from a lookup table using a processor. Depending on the value of the second parameter, the polishing of the substrate is changed. An initial spectrum of light reflected from the substrate before the polishing of the substrate can be measured and a wavelength corresponding to a selected peak of the initial spectrum can be determined.

Abstract translation: 当抛光衬底时，也照射来自光源的光。 测量从基板的表面反射的光的当前光谱。 在当前光谱中识别具有第一参数值的选定峰。 使用处理器从查找表确定与第一参数相关联的第二参数的值。 根据第二参数的值，改变衬底的抛光。 可以测量在衬底的抛光之前从衬底反射的光的初始光谱，并且可以确定与初始光谱的选定峰对应的波长。

公开(公告)号：US20140093987A1

公开(公告)日：2014-04-03

申请号：US13791622

申请日：2013-03-08

Applicant: Applied Materials, Inc.

Inventor： Jeffrey Drue David ,  Boguslaw A. Swedek ,  Wen-Chiang Tu

IPC: H01L21/66 ,  G01J3/46 ,  G01N21/88

CPC classification number: H01L22/10 ,  G01J3/0218 ,  G01J3/42 ,  G01J3/46 ,  G01N21/88 ,  G01N21/9501 ,  G01N21/95607 ,  H01L22/12

Abstract: Detecting residue of a filler material over a patterned underlying layer includes causing relative motion between a probe of an optical metrology system and a substrate, obtaining a plurality of measured spectra with the optical metrology system through the probe from a plurality of different measurement spots within an area on the substrate, comparing each of the plurality of measured spectra to a reference spectrum to generate a plurality of similarity values, the reference spectrum being a spectrum reflected from the filler material, combining the similarity values to generate a scalar value, and determining the presence of residue based on the scalar value.

Abstract translation: 在图案化的下层上检测填充材料的残留物包括引起光学测量系统的探针与衬底之间的相对运动，通过探针从光学测量系统中获得多个测量光谱，该测量光谱来自多个不同的测量点 将所述多个测量光谱中的每一个与参考光谱进行比较以生成多个相似度值，所述参考光谱是从所述填充材料反射的光谱，组合所述相似度值以生成标量值，并且确定 基于标量值存在残差。

公开(公告)号：US12257665B2

公开(公告)日：2025-03-25

申请号：US18163835

申请日：2023-02-02

Applicant: Applied Materials, Inc.

Inventor： Benjamin Cherian ,  Jun Qian ,  Nicholas A. Wiswell ,  Dominic J. Benvegnu ,  Boguslaw A. Swedek ,  Thomas H. Osterheld

IPC: B24B37/013 ,  G06N3/084

Abstract: During chemical mechanical polishing of a substrate, a signal value that depends on a thickness of a layer in a measurement spot on a substrate undergoing polishing is determined by a first in-situ monitoring system. An image of at least the measurement spot of the substrate is generated by a second in-situ imaging system. Machine vision processing, e.g., a convolutional neural network, is used to determine a characterizing value for the measurement spot based on the image. Then a measurement value is calculated based on both the characterizing value and the signal value.

公开(公告)号：US12103135B2

公开(公告)日：2024-10-01

申请号：US18183138

申请日：2023-03-13

Applicant: Applied Materials, Inc.

Inventor： Hassan G. Iravani ,  Kun Xu ,  Denis Ivanov ,  Shih-Haur Shen ,  Boguslaw A. Swedek

IPC: G01N27/02 ,  B24B49/04 ,  B24B49/10 ,  G01B7/06 ,  H01L21/66

CPC classification number: B24B49/045 ,  B24B49/10 ,  B24B49/105 ,  G01B7/105 ,  G01N27/025 ,  H01L22/14 ,  H01L22/26

Abstract: An apparatus for chemical mechanical polishing includes a support for a polishing pad having a polishing surface, and an electromagnetic induction monitoring system to generate a magnetic field to monitor a substrate being polished by the polishing pad. The electromagnetic induction monitoring system includes a core and a coil wound around a portion of the core. The core includes a back portion, a center post extending from the back portion in a first direction normal to the polishing surface, and an annular rim extending from the back portion in parallel with the center post and surrounding and spaced apart from the center post by a gap. A width of the gap is less than a width of the center post, and a surface area of a top surface of the annular rim is at least two times greater than a surface area of a top surface of the center post.

公开(公告)号：US11691244B2

公开(公告)日：2023-07-04

申请号：US17360138

申请日：2021-06-28

Applicant: Applied Materials, Inc.

Inventor： Boguslaw A. Swedek

IPC: B24B37/32 ,  B24B49/04 ,  B24B37/013

CPC classification number: B24B37/32 ,  B24B37/013 ,  B24B49/045

Abstract: A system and method for polishing a substrate, and a retaining ring assembly therefor, are described herein. A retaining ring assembly is configured to be attached to a carrier head. The retaining ring assembly includes a retaining ring including a lower surface, an inner surface, an outer surface and a plurality of grooves, where the lower surface is configured to contact a polishing pad during a polishing process, and each of the plurality of grooves are formed in the lower surface and extend from the inner surface to the outer surface. The retaining ring assembly includes a plurality of retainers, each retainer including a movable tooth at least partially disposed in a respective groove of the retaining ring and moveable relative to the lower surface.