公开(公告)号：US20110140255A1

公开(公告)日：2011-06-16

申请号：US13034584

申请日：2011-02-24

申请人： Yong Liu ,  Jiangyuan Zhang ,  Qiuxiao Qian

发明人： Yong Liu ,  Jiangyuan Zhang ,  Qiuxiao Qian

IPC分类号： H01L23/495 ,  H01L21/50

CPC分类号： H01L23/49575 ,  H01L23/49524 ,  H01L23/49551 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/05554 ,  H01L2224/371 ,  H01L2224/37124 ,  H01L2224/37147 ,  H01L2224/40245 ,  H01L2224/48095 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2924/00014 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/07802 ,  H01L2924/1305 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor die package. Embodiments of the semiconductor die package are usable in backlight circuitry. Systems in packages may include a bridge circuit or a part thereof, and a integrated circuit die, such as a driver die, encapsulated by a molding material or other package. The bridge circuit may be stacked on opposing surfaces of a leadframe.

摘要翻译： 半导体管芯封装。 半导体管芯封装的实施例可用于背光电路。 封装中的系统可以包括桥接电路或其一部分，以及由模制材料或其它封装封装的集成电路管芯，例如驱动器管芯。 桥接电路可以堆叠在引线框架的相对表面上。

公开(公告)号：US20110134816A1

公开(公告)日：2011-06-09

申请号：US12964534

申请日：2010-12-09

申请人： Yong Liu ,  Harish Ramamurthy ,  Ken Kinwah Ho ,  Raja Banerjea ,  Hongyuan Zhang

发明人： Yong Liu ,  Harish Ramamurthy ,  Ken Kinwah Ho ,  Raja Banerjea ,  Hongyuan Zhang

IPC分类号： H04B7/24

CPC分类号： H04W28/06 ,  H04L1/06 ,  H04L1/1614 ,  H04L1/1685 ,  H04L5/001 ,  H04L5/0023 ,  H04L5/0032 ,  H04L5/0037 ,  H04L5/0064 ,  H04L5/0094 ,  H04L69/324 ,  H04W72/042 ,  H04W84/12

摘要： Systems and techniques relating to wireless communications are described. A described technique includes obtaining data for a transmission to a wireless communication device. The wireless communication device can be configured to process incoming transmissions based on an aggregate data unit format that specifies signaling for aggregating multiple medium access control (MAC) data units. The technique includes, in a physical (PHY) frame, an aggregate data unit that is based on the data and the aggregate data unit format, the aggregate data unit including a single MAC data unit. The technique includes, in the PHY frame, an indication to signal that the MAC data unit in the aggregate data unit is singular and to cause the wireless communication device to accept the aggregate data unit without a corresponding block acknowledgement agreement.

摘要翻译： 描述与无线通信相关的系统和技术。 所描述的技术包括获得用于向无线通信设备发送的数据。 无线通信设备可以被配置为基于指定用于聚合多个媒体访问控制（MAC）数据单元的信令的聚合数据单元格式来处理传入传输。 该技术在物理（PHY）帧中包括基于数据和聚合数据单元格式的聚合数据单元，聚合数据单元包括单个MAC数据单元。 该技术在PHY帧中包括用于表明聚合数据单元中的MAC数据单元是奇异的并且使无线通信设备接受聚合数据单元而没有相应的块确认协议的指示。

公开(公告)号：US07954719B2

公开(公告)日：2011-06-07

申请号：US11900651

申请日：2007-09-12

申请人： Xiaoxun Zhu ,  Anatoly Kotlarsky ,  Tao Xian ,  Timothy Good ,  Jie Ren ,  Yong Liu ,  Konstantin Yakovlev ,  John Gardner ,  Steven Essinger ,  Patrick Giordano ,  Sean Kearney ,  Xi Tao ,  JiBin Liu ,  Ming Zhuo ,  Duane Ellis ,  C. Harry Knowles

发明人： Xiaoxun Zhu ,  Anatoly Kotlarsky ,  Tao Xian ,  Timothy Good ,  Jie Ren ,  Yong Liu ,  Konstantin Yakovlev ,  John Gardner ,  Steven Essinger ,  Patrick Giordano ,  Sean Kearney ,  Xi Tao ,  JiBin Liu ,  Ming Zhuo ,  Duane Ellis ,  C. Harry Knowles

IPC分类号： G06K7/10

CPC分类号： G07G1/0036 ,  A47F9/046 ,  G06K7/10544 ,  G06K7/10782 ,  G06K7/10861 ,  G06K2017/0067 ,  G07G3/00

摘要： A tunnel-type digital imaging-based self-checkout system capable of generating and projecting coplanar illumination and imaging planes into a 3D imaging volume within a tunnel structure. The tunnel structure is supported above a package conveyor in a retail POS environment, and employs automatic package identification, profiling and tracking techniques during self-checkout operations.

摘要翻译： 一种基于隧道式数字成像的自检系统，能够将共面照明和成像平面生成并投影到隧道结构内的3D成像体积中。 隧道结构在零售POS环境中的包装输送带上方支撑，并且在自动结帐操作期间采用自动包装识别，分析和跟踪技术。

公开(公告)号：US20110121413A1

公开(公告)日：2011-05-26

申请号：US12947543

申请日：2010-11-16

申请人： Howard Allen ,  Luke England ,  Douglas Alan Hawks ,  Yong Liu ,  Stephen Martin

发明人： Howard Allen ,  Luke England ,  Douglas Alan Hawks ,  Yong Liu ,  Stephen Martin

IPC分类号： H01L29/84

CPC分类号： B81B7/0041 ,  B81B2201/0257 ,  B81B2203/0127 ,  H01L2224/16245 ,  H01L2924/10155 ,  H04R31/00 ,  H04R2201/003

摘要： This document discusses, among other things, a conductive frame, a silicon die coupled to the conductive frame, the silicon die including a vibratory diaphragm, the die having a silicon die top opposite a silicon die bottom, with a silicon die port extending through the silicon die to the vibratory diaphragm, with a silicon die terminal in electrical communication with the conductive frame and an insulator affixed to the conductive frame and the silicon die, with the insulator extending through interstices in the conductive frame to a conductive frame bottom of the conductive frame, and around an exterior of the silicon die to the silicon die top, with the insulator physically affixed to the silicon die and to the conductive frame, with the silicon die port exposed and with a conductive frame terminal disposed at the conductive frame bottom in electrical communication with the silicon die terminal.

摘要翻译： 本文件尤其涉及导电框架，耦合到导电框架的硅芯片，包括振动膜片的硅模具，该模具具有与硅模底部相对的硅模顶部，硅模头端口延伸穿过 硅芯片连接到振动膜片，其中硅晶片端子与导电框架电连通，并且绝缘体固定到导电框架和硅模具，其中绝缘体延伸通过导电框架中的间隙到导电框架底部的导电 框架，并且围绕硅晶片的外部到硅晶片顶部，其中绝缘体物理地固定到硅晶片和导电框架，硅晶片端口暴露，导电框架端子设置在导电框架底部 与硅晶片端子进行电气通信。

公开(公告)号：US20110103280A1

公开(公告)日：2011-05-05

申请号：US12938260

申请日：2010-11-02

申请人： Yong Liu ,  Hongyuan Zhang

发明人： Yong Liu ,  Hongyuan Zhang

IPC分类号： H04W40/00 ,  H04W52/02

CPC分类号： H04W52/58 ,  H04W52/0219 ,  H04W52/0222 ,  H04W52/0229 ,  H04W74/0808 ,  H04W74/0816 ,  H04W84/12 ,  H04W88/08 ,  Y02D70/1262 ,  Y02D70/142

摘要： A method in a communication device for processing a received data unit includes determining whether the communication device is an intended receiver based on the received data unit, determining whether the received data unit includes an exclusive use indication, where the exclusive use indication indicates that a plurality of data units are transmitted only to the at least one intended receiver during a time period, where each of the plurality of data units has at least a respective physical layer (PHY) preamble, and determining a time interval during which the communication device need not listen for incoming data units using (i) a result of determining whether the received data unit includes an exclusive use indication and (ii) a result of determining whether the communication device is an intended receiver.

摘要翻译： 用于处理接收到的数据单元的通信设备中的方法包括：基于接收的数据单元确定通信设备是否是预期的接收机，确定接收到的数据单元是否包括专用指示，其中专用指示指示多个 在多个数据单元中的每个数据单元至少具有相应的物理层（PHY）前导码的时间周期期间仅将数据单元仅发送到至少一个预期的接收机，并且确定通信设备不需要的时间间隔 使用（i）确定接收到的数据单元是否包括专用指示的结果来监听输入数据单元，以及（ii）确定通信设备是否是预期接收机的结果。

公开(公告)号：US07934430B2

公开(公告)日：2011-05-03

申请号：US11933650

申请日：2007-11-01

申请人： Scott Irving ,  Yong Liu ,  Timwah Luk

发明人： Scott Irving ,  Yong Liu ,  Timwah Luk

IPC分类号： G01N3/00

CPC分类号： G01L1/2262 ,  G01L1/2281 ,  G01L1/2287

摘要： A chip with resistive, metallic strain gauges distributed on surfaces on and buried within the chip. Also, vertically arranged vias and vertical thin film resistive strain gauges are described. The resistive strain gauges can be multiplexed wherein strain can be measured across the topology of the chip in each of the top, bottom and buried layers and any vertical strain. The resistive strain gauges may be in serpentine patterns and may be arranged on via or on vertical edges of grooves that extend from an upper or lower surface of the chip to buried layers. In this fashion, the distributed strain gauges may be used to map the strain throughout the body of a chip. A Kelvin bridge may be used to measure the strain, but other such measuring techniques and devices may be used.

摘要翻译： 具有电阻性金属应变计的芯片分布在芯片上并埋入芯片内的表面上。 此外，还描述了垂直布置的通孔和垂直薄膜电阻应变计。 可以复用电阻应变计，其中可以在顶部，底部和掩埋层以及任何垂直应变中的每个中的芯片的拓扑结构上测量应变。 电阻应变计可以是蛇形图案，并且可以布置在从芯片的上表面或下表面延伸到掩埋层的凹槽的通孔或垂直边缘上。 以这种方式，分布式应变计可用于将应变映射到芯片的整个体内。 可以使用开尔文桥来测量应变，但是可以使用其它这样的测量技术和装置。

公开(公告)号：US20110069688A1

公开(公告)日：2011-03-24

申请号：US12876758

申请日：2010-09-07

申请人： Hongyuan Zhang ,  Yong Liu ,  Hui-Ling Lou

发明人： Hongyuan Zhang ,  Yong Liu ,  Hui-Ling Lou

IPC分类号： H04W84/02

CPC分类号： H04L1/0083 ,  H04B7/022 ,  H04B7/0617 ,  H04B7/0619 ,  H04J11/0053 ,  H04L25/03343 ,  H04L2025/03426 ,  H04L2025/03783 ,  H04L2025/03815 ,  H04W16/28

摘要： A method for generating a beamforming training (BFT) unit includes generating a physical layer (PHY) preamble of the BFT unit and generating a first encoding block and a second encoding block using PHY data and MAC data, including at least one of i) using a number of padding bits in a PHY layer of the BFT unit such that the BFT unit consists of the PHY preamble, the first encoding block, and the second encoding block, and ii) generating a MAC protocol data unit (MPDU) having a length such that the BFT unit consists of the PHY preamble, the first encoding block, and the second encoding block.

摘要翻译： 一种用于生成波束形成训练（BFT）单元的方法包括：生成BFT单元的物理层（PHY）前导码并使用PHY数据和MAC数据生成第一编码块和第二编码块，包括以下各项中的至少一个：i）使用 BFT单元的PHY层中的多个填充比特，使得BFT单元由PHY前导码，第一编码块和第二编码块组成，以及ii）生成具有长度的MAC协议数据单元（MPDU） 使得BFT单元由PHY前导码，第一编码块和第二编码块组成。

公开(公告)号：US20110059582A1

公开(公告)日：2011-03-10

申请号：US12940319

申请日：2010-11-05

申请人： Yong Liu

发明人： Yong Liu

IPC分类号： H01L21/60

CPC分类号： H01L23/49572 ,  H01L21/563 ,  H01L21/6835 ,  H01L23/3121 ,  H01L23/488 ,  H01L23/4952 ,  H01L24/19 ,  H01L24/20 ,  H01L24/97 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/16 ,  H01L2224/20 ,  H01L2225/1029 ,  H01L2225/1058 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/15173 ,  H01L2924/15192 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/18162 ,  H01L2924/19105 ,  H01L2924/00

摘要： Disclosed are molded ultra-thin semiconductor die packages, systems that incorporate such packages, and methods of making such packages. An exemplary package comprises a leadframe having an aperture formed between the leadframe's first and second surfaces, and a plurality of leads disposed adjacent to the aperture. The package further comprises a semiconductor disposed in the aperture of the leadframe with its top surface substantially flush with the leadframe's first surface, and at least one gap between at least one side surface of the semiconductor die and at least one lead of the leadframe. A body of electrically insulating material is disposed in the at least one gap. A plurality of conductive members interconnect leads of the leadframe with conductive regions on the die's top surface, with at least one conductive member having a portion disposed over at least a portion of the body of insulating material.

摘要翻译： 公开了模制的超薄半导体管芯封装，并入这种封装的系统以及制造这种封装的方法。 示例性封装包括具有形成在引线框架的第一和第二表面之间的孔的引线框架和邻近孔径设置的多个引线。 封装还包括设置在引线框的孔中的半导体，其顶表面基本上与引线框架的第一表面齐平，以及半导体管芯的至少一个侧表面和引线框架的至少一个引线之间的至少一个间隙。 电绝缘材料体设置在所述至少一个间隙中。 多个导电构件将引线框架的引线与芯片顶表面上的导电区域互连，至少一个导电构件具有设置在绝缘材料主体的至少一部分上的部分。

公开(公告)号：US07899053B2

公开(公告)日：2011-03-01

申请号：US11430957

申请日：2006-05-10

申请人： Yong Liu ,  Myung-jong Lee

发明人： Yong Liu ,  Myung-jong Lee

IPC分类号： H04L12/28 ,  H04W40/00

CPC分类号： H04L45/12 ,  H04L45/04 ,  H04L45/28 ,  H04L45/34 ,  H04L45/42 ,  H04L45/48 ,  H04W40/248 ,  H04W40/34

摘要： An optimal path routing method is provided for transmitting data from a source node to a destination node. The optimal path setting method includes transmitting a shortcut request (SCRQ) message from the source node to a topology server; determining shortcut information at the topology server based on the SCRQ message; and transmitting a shortcut notification (SCNF) message containing the shortcut information from the topology server to the destination node.

摘要翻译： 提供了一种最佳路径路由方法，用于将数据从源节点传输到目标节点。 所述最优路径设定方法包括从所述源节点向拓扑服务器发送快捷请求（SCRQ）消息; 基于所述SCRQ消息确定所述拓扑服务器处的快捷信息; 以及从所述拓扑服务器向所述目的地节点发送包含所述快捷信息的快捷通知（SCNF）消息。

公开(公告)号：US20110038332A1

公开(公告)日：2011-02-17

申请号：US12850529

申请日：2010-08-04

申请人： Yong Liu ,  Raja Banerjea ,  Harish Ramamurthy ,  Hongyuan Zhang

发明人： Yong Liu ,  Raja Banerjea ,  Harish Ramamurthy ,  Hongyuan Zhang

IPC分类号： H04W72/12

CPC分类号： H04W72/1263 ,  H04L1/1685 ,  H04L1/1887 ,  H04L2001/0093 ,  H04W16/28 ,  H04W28/04 ,  H04W28/26 ,  H04W74/0816 ,  H04W76/34 ,  H04W76/38

摘要： The present disclosure includes systems and techniques relating to wireless communications. A described system, for example, includes a device configured to transmit signals, in a frequency band, to the wireless communication devices. The signals can include spatially steered first signals that concurrently provide data to the wireless communication devices. The signals can include one or more second signals to the wireless communication devices to control transmission of responses from the wireless communication devices in the frequency band. The device can monitor for the responses in the frequency band. The device can control, based on a lack of reception of an expected response, a transmission of a third signal in the frequency band to prevent a transmission from another wireless communication device different than the wireless communication devices. The third signal can include information to reschedule a transmission of a response from a wireless communication device.

摘要翻译： 本公开包括与无线通信相关的系统和技术。 所描述的系统例如包括被配置为在频带中向无线通信设备发送信号的设备。 信号可以包括同时向无线通信设备提供数据的空间转向的第一信号。 信号可以包括一个或多个第二信号给无线通信设备以控制来自频带中的无线通信设备的响应的传输。 该设备可以监视频段中的响应。 该设备可以基于缺乏预期响应的接收来控制频带中的第三信号的传输，以防止来自与无线通信设备不同的另一无线通信设备的传输。 第三信号可以包括用于重新安排来自无线通信设备的响应的传输的信息。