公开(公告)号：US20090241005A1

公开(公告)日：2009-09-24

申请号：US12442020

申请日：2007-09-21

申请人： Tae-Chul Hong ,  Kun-Seok Kang ,  Do-Seob Ahn ,  Ho-Jin Lee

发明人： Tae-Chul Hong ,  Kun-Seok Kang ,  Do-Seob Ahn ,  Ho-Jin Lee

IPC分类号： H04L1/18 ,  G06F11/14

CPC分类号： H04L1/1887 ,  H04L1/1819 ,  H04L1/1835

摘要： There is provided a method for packet scheduling in a selective hybrid automatic repeat request (HARQ) including the steps of: increasing a priority of a receiver buffer after a packet is transmitted to the receiver; receiving a feedback packet for the transmitted packet and determining whether the feedback packet is an ACK packet or a NACK packet; lowering the priority of the receiver buffer if the feedback packet is an ACK packet; determining whether the feedback packet is a NACK packet for initial transmission or the feedback packet is a NACK packet for retransmission if the feedback packet is the NACK packet, increasing the priority of the receiver buffer if the feedback packet is the NACK packet for the initial transmission, and lowering the priority of the receiver buffer if the feedback packet is the NACK packet for retransmission; and scheduling packets after calculating a priority of each receiver buffer by performing the priority increasing step to the determining step for all of receivers.

摘要翻译： 提供了一种用于选择性混合自动重复请求（HARQ）中的分组调度的方法，包括以下步骤：在分组被发送到接收机之后增加接收机缓冲器的优先级; 接收所发送的分组的反馈分组，并确定反馈分组是ACK分组还是NACK分组; 如果反馈分组是ACK分组，则降低接收机缓冲器的优先级; 确定反馈分组是否是用于初始传输的NACK分组，或者如果反馈分组是NACK分组，则反馈分组是用于重传的NACK分组，如果反馈分组是用于初始传输的NACK分组，则增加接收机缓冲器的优先级 并且如果反馈分组是用于重发的NACK分组，则降低接收机缓冲器的优先级; 以及通过对所有接收机执行到确定步骤的优先级增加步骤来计算每个接收器缓冲器的优先级之后调度分组。

公开(公告)号：US20090154421A1

公开(公告)日：2009-06-18

申请号：US12186670

申请日：2008-08-06

申请人： Hyun-Ha Hong ,  Ki-Seop Han ,  Dae-Ig Chang ,  Ho-Jin Lee

发明人： Hyun-Ha Hong ,  Ki-Seop Han ,  Dae-Ig Chang ,  Ho-Jin Lee

IPC分类号： H04Q7/00

CPC分类号： H04L12/66 ,  H04W36/0016 ,  H04W36/14 ,  H04W40/36 ,  H04W80/04 ,  H04W84/005

摘要： Provided is a method for handover between heterogeneous networks using a link trigger signal in a multi-interface mobile router. The method includes: maintaining a state of a second network access interface in a sleep state, activating a first network access interface, receiving and transmitting the first network service to a subordinate node in the mobile router located in a first network; when the mobile router senses a second network link-up trigger signal while moving to the second network, changing the state of the second network access interface into an active state and performing handover; and receiving a second network service through the activated second network access interface in the mobile router performing the handover and transmitting the second network service to the subordinate node.

摘要翻译： 提供了一种使用多接口移动路由器中的链路触发信号在异构网络之间切换的方法。 该方法包括：将第二网络接入接口的状态保持在睡眠状态，激活第一网络接入接口，将第一网络服务接收并发送到位于第一网络中的移动路由器中的下级节点; 当移动路由器在移动到第二网络时感测到第二网络链接触发信号，将第二网络接入接口的状态改变为活动状态并执行切换; 以及通过执行切换的移动路由器中的激活的第二网络接入接口接收第二网络服务，并将第二网络服务发送到下级节点。

公开(公告)号：US20080309419A1

公开(公告)日：2008-12-18

申请号：US12096062

申请日：2005-12-07

申请人： Yong-Deuk Lee ,  Cheol-Oh Jeong ,  Jong-Won Eun ,  Seong-Pal Lee ,  Ho-Jin Lee

发明人： Yong-Deuk Lee ,  Cheol-Oh Jeong ,  Jong-Won Eun ,  Seong-Pal Lee ,  Ho-Jin Lee

IPC分类号： H03B7/14

CPC分类号： H03B7/143 ,  H03B5/30

摘要： Provided is a voltage controlled oscillator having a new type of a resonator and a negative resistance part capable of finely tuning negative resistance. Thus, the voltage controlled oscillator has an excellent quality factor characteristic and can finely tune the negative resistance even after its fabrication is completed. The voltage controlled oscillator having an active element includes: a resonating unit for generating an oscillation frequency according to a resonance capacitance; a frequency tuning unit, connected to a source terminal of the active element, for tuning the oscillation frequency; and a negative resistance adjusting unit, connected to the frequency tuning unit, for generating a negative resistance to adjust the oscillation frequency, the negative resistance adjusting unit including a varactor diode for finely adjusting the negative resistance.

摘要翻译： 提供了具有新型谐振器的压控振荡器和能够微调负电阻的负电阻部分。 因此，压控振荡器具有优异的品质因数特性，并且即使在其制造完成之后也可以微调负电阻。 具有有源元件的压控振荡器包括：谐振单元，用于根据谐振电容产生振荡频率; 频率调谐单元，连接到有源元件的源极端子，用于调谐振荡频率; 负电阻调节单元，连接到频率调谐单元，用于产生负电阻以调节振荡频率，负电阻调节单元包括用于精细调节负电阻的变容二极管。

公开(公告)号：US20080230912A1

公开(公告)日：2008-09-25

申请号：US12053478

申请日：2008-03-21

申请人： In-Young Lee ,  Ho-Jin Lee ,  Hyun-Soo Chung ,  Ju-Il Choi ,  Son-Kwan Hwang

发明人： In-Young Lee ,  Ho-Jin Lee ,  Hyun-Soo Chung ,  Ju-Il Choi ,  Son-Kwan Hwang

IPC分类号： H01L23/48 ,  H01L21/4763

CPC分类号： H01L21/76898 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L24/81 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/05009 ,  H01L2224/0557 ,  H01L2224/06181 ,  H01L2224/11462 ,  H01L2224/13009 ,  H01L2224/13022 ,  H01L2224/13025 ,  H01L2224/13099 ,  H01L2224/13147 ,  H01L2224/16 ,  H01L2224/81801 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2924/0002 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01022 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01055 ,  H01L2924/0106 ,  H01L2924/01078 ,  H01L2924/014 ,  H01L2924/04941 ,  H01L2924/14 ,  H01L2924/19043 ,  H01L2224/05552

摘要： A method of manufacturing a semiconductor device includes forming an integrated circuit region on a semiconductor wafer. A first metal layer pattern is formed over the integrated circuit region. A via hole is formed to extend through the first metal layer pattern and the integrated circuit region. A final metal layer pattern is formed over the first metal layer pattern and within the via hole. A plug is formed within the via hole. Thereafter, a passivation layer is formed to overlie the final metal layer pattern.

摘要翻译： 一种制造半导体器件的方法包括在半导体晶片上形成集成电路区域。 在集成电路区域上形成第一金属层图案。 通孔形成为延伸穿过第一金属层图案和集成电路区域。 最终的金属层图案形成在第一金属层图案之上并且在通孔内。 在通孔内形成插头。 此后，形成钝化层以覆盖最终金属层图案。

公开(公告)号：US20080164410A1

公开(公告)日：2008-07-10

申请号：US12004288

申请日：2007-12-20

申请人： Ho-Jin Lee

发明人： Ho-Jin Lee

IPC分类号： G21K7/00

CPC分类号： H01J37/28 ,  G01R31/305 ,  H01J37/228 ,  H01J37/244 ,  H01J37/256 ,  H01J2237/2445 ,  H01J2237/2482 ,  H01J2237/2808 ,  H01J2237/2817 ,  H01J2237/3174

摘要： According to an emission detecting analysis system and method, a test target is placed on a stage inside a chamber. A scanning electron microscope (SEM) column is installed at the chamber to obtain an image of the test target, and an emission detector column is installed at the chamber to detect light emission of the test target. High-magnification emission analysis and accurate detection of an emission point at a test target are obtained. In addition, a physical structure of the emission point is analyzed at the test target to reduce time required for analyzing a failure.

摘要翻译： 根据排放检测分析系统和方法，将测试对象放置在室内的台上。 在室上安装扫描电子显微镜（SEM）柱以获得测试对象的图像，并且在室处安装发射检测器柱以检测测试对象的光发射。 获得高倍率放射性分析和准确检测测试目标的发射点。 此外，在测试目标处分析发射点的物理结构，以减少分析故障所需的时间。

公开(公告)号：US20070152684A1

公开(公告)日：2007-07-05

申请号：US11647287

申请日：2006-12-29

申请人： Ho-Jin Lee ,  Chan-Soon Park ,  Duck-Young Kim

发明人： Ho-Jin Lee ,  Chan-Soon Park ,  Duck-Young Kim

IPC分类号： G01R31/308

CPC分类号： G01R31/311

摘要： A photo-emission analysis apparatus may include a plate, a socket board on the plate, and configured to receive semiconductor chip package. The apparatus may further include a housing on the plate, the housing having an inlet configured to introduce air into the housing, and a photon detector configured external to the housing.

摘要翻译： 光发射分析装置可以包括板，板上的插座板，并且被配置为接收半导体芯片封装。 所述装置还可以包括在所述板上的壳体，所述壳体具有被配置为将空气引入到所述壳体中的入口，以及配置在所述壳体外部的光子检测器。

公开(公告)号：US20070152349A1

公开(公告)日：2007-07-05

申请号：US11355545

申请日：2006-02-15

申请人： Hyun-Soo Chung ,  Ho-Jin Lee ,  Dong-Hyun Jang ,  Dong-Ho Lee

发明人： Hyun-Soo Chung ,  Ho-Jin Lee ,  Dong-Hyun Jang ,  Dong-Ho Lee

IPC分类号： H01L21/00 ,  H01L23/48

CPC分类号： H01L25/0657 ,  H01L21/76898 ,  H01L23/481 ,  H01L25/50 ,  H01L2224/02371 ,  H01L2224/02372 ,  H01L2224/0401 ,  H01L2224/13025 ,  H01L2224/274 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2924/01079 ,  H01L2924/01087

摘要： In a semiconductor device package having a stress relief spacer, and a manufacturing method thereof, metal interconnect fingers extend from the body of a chip provide for chip interconnection. The metal fingers are isolated from the body of the chip by a stress-relief spacer. In one example, such isolation takes the form of an air gap. In another example, such isolation takes the form of an elastomer material. In either case, mismatch in coefficient of thermal expansion between the metal interconnect fingers and the body of the chip is avoided, alleviating the problems associated with cracking and delamination, and leading to improved device yield and device reliability.

摘要翻译： 在具有应力消除间隔物的半导体器件封装及其制造方法中，从芯片本体延伸的金属互连指状物提供芯片互连。 金属手指通过应力消除间隔物与芯片的主体隔离。 在一个示例中，这种隔离采取气隙的形式。 在另一个实例中，这种隔离采用弹性体材料的形式。 在这两种情况下，都避免了金属互连指和芯体之间的热膨胀系数的不匹配，从而减轻了与开裂和分层相关的问题，从而提高了器件的产量和器件的可靠性。

公开(公告)号：US5805410A

公开(公告)日：1998-09-08

申请号：US758040

申请日：1996-11-27

申请人： Ho-Jin Lee

发明人： Ho-Jin Lee

IPC分类号： H01L27/04 ,  H01L21/822 ,  H01L27/02 ,  H01L27/06 ,  H01G4/005

CPC分类号： H01L27/0259 ,  H01L27/0658

摘要： The present invention relates to a MOS capacitor. According to this invention, the MOS capacitor has a transistor structure. One electrode of the capacitor is connected to an emitter of the transistor and the other electrode of the capacitor is connected to a collector of the transistor. When the MOS capacitor is biased by static electricity the electrostatic durability is improved, since an electrostatic discharge path is formed by breakdown of a collector and an emitter.

摘要翻译： 本发明涉及一种MOS电容器。 根据本发明，MOS电容器具有晶体管结构。 电容器的一个电极连接到晶体管的发射极，电容器的另一个电极连接到晶体管的集电极。 当MOS电容器被静电偏压时，静电耐久性得到改善，因为通过集电极和发射极的击穿形成静电放电路径。

公开(公告)号：US20170110445A1

公开(公告)日：2017-04-20

申请号：US15391424

申请日：2016-12-27

申请人： PIL-KYU KANG ,  Byung Lyul Park ,  Taeyeong Kim ,  Yeun-Sang Park ,  Dosun Lee ,  Ho-Jin Lee ,  Jinho Chun ,  JU-IL CHOI ,  Yi Koan Hong

发明人： PIL-KYU KANG ,  Byung Lyul Park ,  Taeyeong Kim ,  Yeun-Sang Park ,  Dosun Lee ,  Ho-Jin Lee ,  Jinho Chun ,  JU-IL CHOI ,  Yi Koan Hong

IPC分类号： H01L25/00 ,  H01L21/304 ,  H01L23/48 ,  H01L25/065 ,  H01L21/66 ,  H01L21/768 ,  H01L23/00

CPC分类号： H01L25/50 ,  H01L21/304 ,  H01L21/561 ,  H01L21/76898 ,  H01L22/32 ,  H01L23/3128 ,  H01L23/481 ,  H01L24/03 ,  H01L24/05 ,  H01L24/06 ,  H01L24/08 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/92 ,  H01L24/94 ,  H01L25/0657 ,  H01L25/18 ,  H01L2224/0401 ,  H01L2224/05568 ,  H01L2224/0557 ,  H01L2224/05573 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/06181 ,  H01L2224/08146 ,  H01L2224/131 ,  H01L2224/13124 ,  H01L2224/13147 ,  H01L2224/16145 ,  H01L2224/16146 ,  H01L2224/16225 ,  H01L2224/81191 ,  H01L2224/81193 ,  H01L2224/9202 ,  H01L2224/94 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06558 ,  H01L2225/06565 ,  H01L2225/06596 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/1431 ,  H01L2924/1434 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2224/81 ,  H01L2224/11 ,  H01L2224/03 ,  H01L2924/00014 ,  H01L2924/014

摘要： A semiconductor device having a chip stack and an interconnection terminal is provided. The chip stack includes a first semiconductor chip, a second semiconductor chip and a third semiconductor chip stacked on each other. The interconnection terminal is electrically coupled to the chip stack. The first semiconductor chip includes a first front surface and a first backside surface. The second semiconductor chip includes a second front surface, a second backside surface, a second circuit layer and a through-electrode which is electrically coupled to the second circuit layer and penetrates the second semiconductor chip. The third semiconductor chip includes a third front surface, a third backside surface opposite to the third front surface and a third circuit layer adjacent to the third front surface. The first front surface and the second front surface face each other. The third front surface and the second backside surface face each other.

公开(公告)号：US09025089B2

公开(公告)日：2015-05-05

申请号：US12948211

申请日：2010-11-17

申请人： Ho-Jin Lee

发明人： Ho-Jin Lee

IPC分类号： G02F1/1335 ,  G02F1/1333 ,  G06F3/041 ,  G06F3/01

CPC分类号： G06F3/041 ,  G06F3/016

摘要： A touch panel device in which a support portion is provided to include an actuator for generating vibration giving an excellent sense of touch without the need for a separate mounting space. To this end, the touch panel device having a front cover portion, a touch sensor unit divided into an upper transparent electrode layer and a lower transparent electrode layer, and a substrate provided under the touch sensor portion includes an actuator for delivering vibration to the front cover portion, a reinforcing portion having the actuator attached thereto to attach the actuator to the touch sensor unit, and a support portion formed on the substrate to provide an opening in a first side thereof and a closed second side, such that the actuator is inserted into and coupled to the opening and the support portion supports the actuator to deliver the vibration of the actuator to the front cover portion.

摘要翻译： 一种触摸面板装置，其中提供支撑部分以包括用于产生振动的致动器，从而具有优异的触摸感，而不需要单独的安装空间。 为此，具有前盖部分，分为上透明电极层和下透明电极层的触摸传感器单元和设置在触摸传感器部分下方的基板的触摸面板装置包括用于将振动传递到前面的致动器 覆盖部分，具有附接到其上的致动器以将致动器附接到触摸传感器单元的加强部分，以及形成在基板上的支撑部分，以在其第一侧和闭合的第二侧提供开口，使得致动器被插入 并且支撑部分支撑致动器以将致动器的振动传递到前盖部分。