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    Method of forming a protective coating for a packaged semiconductor device
    71.
    发明授权
    Method of forming a protective coating for a packaged semiconductor device 有权

    公开(公告)号：US10118816B2

    公开(公告)日：2018-11-06

    申请号：US15388557

    申请日：2016-12-22

    Applicant: Infineon Technologies AG

    Inventor： Klaus Elian ,  Horst Theuss

    IPC: H01L21/00 ,  B81B7/00 ,  B81C1/00

    Abstract: A packaged includes a flip-chip assembly. The flip-chip assembly includes a first semiconductor substrate having at least one integrated semiconductor device, and a second substrate connected to the first substrate. A main surface of the first semiconductor substrate faces and is spaced apart from the second substrate. The packaged semiconductor device further includes a parylene coating covering outer surfaces of the first semiconductor substrate and the second substrate. A first section of the main surface is exposed from the parylene coating.

    Film-Covered Open-Cavity Sensor Package
    79.
    发明申请
    Film-Covered Open-Cavity Sensor Package 有权
    薄膜覆盖开孔传感器封装

    公开(公告)号：US20140346623A1

    公开(公告)日：2014-11-27

    申请号：US13900949

    申请日：2013-05-23

    Applicant: Infineon Technologies AG

    Inventor： Klaus Elian ,  Helmut Wietschorke

    IPC: H01L29/84 ,  H01L23/00

    CPC classification number: H01L29/84 ,  G01L5/0004 ,  G01L19/147 ,  H01L23/04 ,  H01L23/24 ,  H01L24/16 ,  H01L24/48 ,  H01L24/97 ,  H01L27/14618 ,  H01L2224/16245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2924/00014 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/13099 ,  H01L2924/00

    Abstract: Techniques for covering open-cavity integrated-circuit packages in a batch process are disclosed. In an example method, a plurality of open-cavity packages are molded on a single batch leadframe or substrate, each open-cavity package comprising a floor and a plurality of walls arranged around the floor to form a cavity, each of said the walls having a bottom end adjoining said floor and having a top side opposite the bottom end. At least one semiconductor device is attached to the floor and within the cavity of each of the open-cavity packages, and a single flexible membrane is affixed to the top sides of the walls of the plurality of open-cavity packages, so as to substantially cover all of the cavities. The flexible membrane is then severed, between the packages.

    Abstract translation: 公开了一种用于在间歇过程中覆盖开放式集成电路封装的技术。 在一个示例性方法中，多个开放式空腔包装被模制在单个批量引线框架或基板上，每个开放式空腔封装包括地板和布置在地板周围的多个壁，以形成空腔，每个所述壁具有 底端邻接所述底板并且具有与底端相对的顶侧。 至少一个半导体器件附接到每个开口腔封装的地板和空腔内，并且单个柔性膜固定到多个开放式腔封装的壁的顶侧，从而基本上 覆盖所有的空腔。 然后在包装之间切断柔性膜。

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