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80 条记录 (耗时 0.034 秒)

    Tamper-respondent assemblies with bond protection
    71.
    发明授权
    Tamper-respondent assemblies with bond protection 有权

    公开(公告)号：US10264665B2

    公开(公告)日：2019-04-16

    申请号：US15835557

    申请日：2017-12-08

    申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION

    发明人： William L. Brodsky ,  James A. Busby ,  Zachary T. Dreiss ,  Michael J. Fisher ,  David C. Long ,  William Santiago-Fernandez ,  Thomas Weiss

    IPC分类号： H05K1/02 ,  H05K5/02 ,  G06F21/87 ,  H05K1/18

    摘要： Tamper-respondent assemblies and methods of fabrication are provided which include at least one tamper-respondent sensor having unexposed circuit lines forming, at least in part, one or more tamper-detect network(s), and the tamper-respondent sensor having at least one external bond region. The tamper-respondent assembly further includes at least one conductive trace and an adhesive. The conductive trace(s) forms, at least in part, the one or more tamper-detect network(s), and is exposed, at least in part, on the tamper-respondent sensor(s) within the external bond region(s). The adhesive contacts the conductive trace(s) within the external bond region(s) of the tamper-respondent sensor(s), and the adhesive, in part, facilitates securing the at least one tamper-respondent sensor within the tamper-respondent assembly. In enhanced embodiments, the conductive trace(s) is a chemically compromisable conductor susceptible to damage during a chemical attack on the adhesive within the external bond region(s).

    Circuit boards and electronic packages with embedded tamper-respondent sensor
    72.
    发明授权
    Circuit boards and electronic packages with embedded tamper-respondent sensor 有权

    公开(公告)号：US10168185B2

    公开(公告)日：2019-01-01

    申请号：US14941908

    申请日：2015-11-16

    申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION

    发明人： William L. Brodsky ,  Silvio Dragone ,  Roger S. Krabbenhoft ,  David C. Long ,  Stefano S. Oggioni ,  Michael T. Peets ,  William Santiago-Fernandez

    IPC分类号： H05K1/02 ,  G01D5/16 ,  H05K1/18 ,  H05K3/30 ,  H05K3/32

    摘要： Methods of fabricating electronic circuits and electronic packages are provided. The electronic circuit includes a multilayer circuit board, and a tamper-respondent sensor embedded within the circuit board. The tamper-respondent sensor defines, at least in part, a secure volume associated with the multilayer circuit board. In certain implementations, the tamper-respondent sensor includes multiple tamper-respondent layers embedded within the circuit board including, for instance, one or more tamper-respondent frames and one or more tamper-respondent mat layers, with the tamper-respondent frame(s) being disposed, at least in part, above the tamper-respondent mat layer(s), which together define the secure volume where extending into the multilayer circuit board. In certain embodiments, one or more of the tamper-respondent layers are divided into multiple, separate tamper-respondent circuit zones, with the tamper-respondent layers, including the circuit zones, being electrically connected to monitor circuitry within the secure volume.

    Electromagnetic gaskets for a cable connection
    74.
    发明授权
    Electromagnetic gaskets for a cable connection 有权

    公开(公告)号：US10028419B2

    公开(公告)日：2018-07-17

    申请号：US15424924

    申请日：2017-02-06

    申请人： International Business Machines Corporation

    发明人： William L. Brodsky ,  Robert R. Genest ,  John J. Loparco ,  Michael T. Peets

    IPC分类号： H05K9/00 ,  H01R13/6584 ,  H01R13/6592 ,  H01R13/74

    摘要： A gasket assembly structure including a frame which includes a front half and a back half joined together with a plurality of interlocking tabs located around a perimeter of the frame, defining a window, and an electromagnetic gasket, constrained between the front half and the back half of the frame; where the electromagnetic gasket lines an interior perimeter of the window and partially extends from the frame into the window, and a passageway through the window of the frame with boarders defined by the constrained electromagnetic gasket. A housing structure including a receptacle recessed within an opening on a front side of the housing, the receptacle is rigidly attached to the housing, and a gasket assembly recessed within the opening and located between the front side of the housing and the receptacle, where the gasket assembly is directly secured to the housing.

    Electromagnetic gaskets for a cable connection
    78.
    发明授权
    Electromagnetic gaskets for a cable connection 有权

    公开(公告)号：US09615492B2

    公开(公告)日：2017-04-04

    申请号：US14687947

    申请日：2015-04-16

    申请人： International Business Machines Corporation

    发明人： William L. Brodsky ,  Robert R. Genest ,  John J. Loparco ,  Michael T. Peets

    IPC分类号： H05K9/00

    CPC分类号： H05K9/0016 ,  H01R13/6584 ,  H01R13/6592 ,  H01R13/74 ,  H05K9/0015

    摘要： A gasket assembly structure including a frame which includes a front half and a back half joined together with a plurality of interlocking tabs located around a perimeter of the frame, defining a window, and an electromagnetic gasket, constrained between the front half and the back half of the frame; where the electromagnetic gasket lines an interior perimeter of the window and partially extends from the frame into the window, and a passageway through the window of the frame with boarders defined by the constrained electromagnetic gasket. A housing structure including a receptacle recessed within an opening on a front side of the housing, the receptacle is rigidly attached to the housing, and a gasket assembly recessed within the opening and located between the front side of the housing and the receptacle, where the gasket assembly is directly secured to the housing.

    Enclosure with inner tamper-respondent sensor(s)
    79.
    发明授权
    Enclosure with inner tamper-respondent sensor(s) 有权
    带有内部篡改传感器的外壳

    公开(公告)号：US09591776B1

    公开(公告)日：2017-03-07

    申请号：US14865651

    申请日：2015-09-25

    申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION

    发明人： William L. Brodsky ,  John R. Dangler ,  Zachary T. Dreiss ,  David C. Long ,  Michael T. Peets ,  William Santiago-Fernandez ,  Thomas Weiss

    IPC分类号： G06F1/16 ,  H05K5/00 ,  H05K7/00 ,  H05K5/02

    CPC分类号： H05K5/0247 ,  G06F1/00 ,  H05K5/0208 ,  H05K13/00

    摘要： Tamper-respondent assemblies and methods of fabrication are provided which include an electronic enclosure and a tamper-respondent electronic circuit structure. The electronic enclosure encloses, at least in part, at least one electronic component to be protected, and includes an inner main surface, and an inner sidewall surface which has at least one inner-sidewall corner. The tamper-respondent electronic circuit structure includes a tamper-respondent sensor covering, at least in part, the inner sidewall surface of the electronic enclosure. The tamper-respondent sensor includes multiple slots provided therein. The multiple slots facilitate disposing the tamper-respondent sensor to cover the at least one inner-sidewall corner of the inner sidewall surface by allowing for one or more regions of overlap of the tamper-respondent sensor at the at least one inner-sidewall corner of the electronic enclosure.

    摘要翻译： 提供了防篡改组件和制造方法，其包括电子外壳和篡改响应的电子电路结构。 电子外壳至少部分地包围至少一个待保护的电子部件，并且包括内部主表面和具有至少一个内侧壁角的内侧壁表面。 篡改答复电子电路结构包括至少部分地覆盖电子外壳的内侧壁表面的防篡改传感器。 篡改传感器包括其中提供的多个槽。 多个插槽有助于将篡改答复传感器设置成覆盖内侧壁表面的至少一个内侧壁角，通过允许篡改响应传感器的至少一个内侧壁角的一个或多个重叠区域 电子机箱。