公开(公告)号：US5110342A

公开(公告)日：1992-05-05

申请号：US755826

申请日：1991-09-06

申请人： Tetsuo Jikihara ,  Toyohiko Shike ,  Manabu Katsurada ,  Hisao Watanabe ,  Osamu Ikeda

发明人： Tetsuo Jikihara ,  Toyohiko Shike ,  Manabu Katsurada ,  Hisao Watanabe ,  Osamu Ikeda

IPC分类号： C07D213/50 ,  A01N35/06 ,  A01N41/04 ,  A01N43/20 ,  A01N43/40 ,  A01N43/42 ,  C07C45/64 ,  C07C45/68 ,  C07C49/683 ,  C07C49/697 ,  C07C49/747 ,  C07C205/45 ,  C07C309/65 ,  C07C309/66 ,  C07C309/73 ,  C07C309/75 ,  C07C309/77 ,  C07D213/61 ,  C07D213/64 ,  C07D303/32

CPC分类号： C07D303/32 ,  A01N35/06 ,  A01N41/04 ,  A01N43/20 ,  A01N43/40 ,  A01N43/42 ,  C07C205/45 ,  C07C309/65 ,  C07C309/66 ,  C07C309/73 ,  C07C309/75 ,  C07C309/77 ,  C07C45/64 ,  C07C45/68 ,  C07C49/683 ,  C07C49/697 ,  C07C49/747 ,  C07D213/61 ,  C07D213/64 ,  C07C2102/10

摘要： The present invention provides an indan-1,3-dione derivative represented by the following formula (I): ##STR1## wherein R.sup.1 represents a hydrogen atom or a lower alkyl group; R.sup.2 represents a group represented by ##STR2## wherein E represents a (substituted) phenyl group or a (substituted) pyridyl group; Y represents a hydroxyl group; and Z represents a halogen atom, a (substituted) alkylsulfonyloxy group or a (substituted) phenylsulfonyloxy group, or Y and Z are bonded to represent --O--; and A represents a (substituted) 1,3-butadienylene group or a (substituted) 1,3-azabutadienylene group, and a herbicidal composition containing the same as an active ingredient.

公开(公告)号：US3953418A

公开(公告)日：1976-04-27

申请号：US488855

申请日：1974-07-15

申请人： Noboru Yanaihara ,  Osamu Ikeda

发明人： Noboru Yanaihara ,  Osamu Ikeda

IPC分类号： G01N33/53 ,  C07K1/113 ,  C07K14/00 ,  C07K14/62 ,  G01N33/74 ,  G21H5/00 ,  G21H5/02 ,  C07C103/52 ,  A61K37/26

CPC分类号： C07K14/62 ,  Y10S436/804 ,  Y10S436/815 ,  Y10S436/817

摘要： A peptide having an amino acid sequence of Arg-Arg-Glu-Ala-Glu-Asp-Leu-Gln-Val-Gly-Gln-Val-Glu-Leu-Gly-Gly-Gly-Pro-Gly-Ala-Gly-Ser-Leu-Gln-Pro-Leu-Ala-Leu-Glu-Gly-Ser-Leu-Gln-Lys-Arg; Tyr-Arg-Arg-Glu-Ala-Glu-Asp-Leu-Gln-Val-Gly-Gln-Val-Glu-Leu-Gly-Gly-Gly-Pro-Gly-Ala-Gly-Ser-Leu-Gln-Pro-Leu-Ala-Leu-Glu-Gly-Ser-Leu-Gln-Lys-Arg; or Tyr-Arg-Arg-Glu-Ala-Glu-Asp-Leu-Gln-Val-Gly-Gly-Gln-Val-Glu-Leu-Gly-Gly-Gly-Pro-Gly-Ala-Gly-Ser-Leu-Gln-Pro-Leu-Ala-Leu-Glu-Gly-Ser-Leu-Gln-Lys-Arg; and the N.sup..epsilon. formyl-Lys derivative thereof.

摘要翻译： 具有Arg-Arg-Glu-Ala-Glu-Asp-Leu-Gln-Val-Gly-Gln-Val-Glu-Leu-Gly-Gly-Gly-Pr-Gly-Ala-Gly的氨基酸序列的肽 -Ser-Leu-Gln-Pro-Leu-Ala-Leu-Glu-Gly-Ser-Leu-Gln-Lys-Arg; Tyr-Arg-Arg-Glu-Ala-Glu-Asp-Leu-Gln-Val-Gly-Gln-Val-Glu-Leu-Gly-Gly-Gly-Pro-Gly-Ala-Gly-Ser-Leu-Gln -Pro-Leu-Ala-Leu-Glu-Gly-Ser-Leu-Gln-Lys-Arg; 或Tyr-Arg-Arg-Glu-Ala-Glu-Asp-Leu-Gln-Val-Gly-Gly-Gln-Val-Glu-Leu-Gly-Gly-Gly-Pro-Gly-Ala-Gly-Ser- Leu-Gln-Pro-Leu-Ala-Leu-Glu-Gly-Ser-Leu-Gln-Lys-Arg; 及其N-甲酰基-Lys衍生物。

公开(公告)号：US08872956B2

公开(公告)日：2014-10-28

申请号：US13159019

申请日：2011-06-13

申请人： Osamu Ikeda

发明人： Osamu Ikeda

IPC分类号： H04N5/222 ,  H04N17/00 ,  H04N5/232 ,  G11B31/00 ,  H04N1/21 ,  H04N5/77 ,  H04N5/76 ,  H04N5/85 ,  H04N21/47 ,  H04N101/00

CPC分类号： G11B31/006 ,  H04N1/2112 ,  H04N5/232 ,  H04N5/23293 ,  H04N5/772 ,  H04N5/85 ,  H04N17/00 ,  H04N17/002 ,  H04N21/47 ,  H04N2101/00

摘要： An electronic camera having a plurality of functions including capturing and recording images is provided. The electronic camera includes an operation input unit for inputting external operations that designate corresponding functions of the camera to be performed, an image pickup unit for capturing the image of an object, and a recorder for recording the image captured by the image pickup unit. The electronic camera further includes a playback unit for at least playing back image information that is recorded on the recording medium and a mode selector for selecting one operation mode of the camera from a plurality of available operation modes that include an operation explanation mode. If the operation explanation mode is selected at the mode selector, the playback unit plays back an operation guide that is pre-stored in a memory, the operation guide explaining at least one of the camera operations and functions thereof.

摘要翻译： 提供具有多个功能的电子照相机，包括拍摄和记录图像。 电子照相机包括用于输入指定要执行的相机的相应功能的外部操作的操作输入单元，用于捕获对象的图像的图像拾取单元和用于记录由图像拾取单元捕获的图像的记录器。 电子照相机还包括用于至少回放记录在记录介质上的图像信息的重放单元和用于从包括操作说明模式的多个可用操作模式中选择相机的一个操作模式的模式选择器。 如果在模式选择器处选择了操作说明模式，则播放单元播放预先存储在存储器中的操作指南，该操作指南解释了相机操作及其功能中的至少一个。

公开(公告)号：US08602762B2

公开(公告)日：2013-12-10

申请号：US12718341

申请日：2010-03-05

申请人： Keizo Arita ,  Yasuo Yoshii ,  Kazuo Iritani ,  Osamu Ikeda ,  Yoshiaki Nakata ,  Shin Iwasaki

发明人： Keizo Arita ,  Yasuo Yoshii ,  Kazuo Iritani ,  Osamu Ikeda ,  Yoshiaki Nakata ,  Shin Iwasaki

IPC分类号： B29B9/06

CPC分类号： B29B9/065 ,  B26D1/28 ,  B26D7/26

摘要： In a resin granulating apparatus of the present invention, a bracket extending in the outward radial direction over an outer peripheral surface of a sleeve is provided for the sleeve for rotatably supporting a cutter shaft of a cutter for shearing a material extruded from a die. Stopper means cooperating with the bracket to regulate movement of the sleeve toward the die and moving a regulation position in the axial direction is provided on the radially outer side over an outer diameter of the sleeve. With such a configuration, installation space is compactified so as to additionally provide the stopper means in the existing facilities, and a position of the cutter relative to a die surface is precisely adjusted so as to stably produce a pellet of a best shape.

摘要翻译： 在本发明的树脂造粒装置中，在套筒的外周面上向外径方向延伸的托架被设置用于可旋转地支撑用于剪切从模具挤出的材料的切割器的切割轴的套筒。 止动器装置与支架配合以调节套筒朝向模具的运动，并且在套筒的外径上的径向外侧上设置有沿轴向移动的调节位置。 利用这种构造，安装空间紧凑，从而在现有设施中另外提供止动装置，并且精确地调节刀具相对于模具表面的位置，以便稳定地产生最佳形状的丸粒。

公开(公告)号：US08421232B2

公开(公告)日：2013-04-16

申请号：US13117544

申请日：2011-05-27

申请人： Osamu Ikeda ,  Masato Nakamura ,  Satoshi Matsuyoshi ,  Koji Sasaki ,  Shinji Hiramitsu

发明人： Osamu Ikeda ,  Masato Nakamura ,  Satoshi Matsuyoshi ,  Koji Sasaki ,  Shinji Hiramitsu

IPC分类号： H01L23/48 ,  H01L23/52

CPC分类号： H05K3/3463 ,  B23K35/262 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/33 ,  H01L24/73 ,  H01L24/83 ,  H01L2224/0401 ,  H01L2224/04026 ,  H01L2224/16 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/29144 ,  H01L2224/29211 ,  H01L2224/29311 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/32507 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/83101 ,  H01L2224/83801 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01022 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/13055 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/351 ,  H05K3/244 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/01016 ,  H01L2924/01028 ,  H01L2924/01032 ,  H01L2924/3512 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299 ,  H01L2224/2929

摘要： A semiconductor device includes a semiconductor element, a support member bonded to a first surface of the semiconductor element with a first bonding material and a lead electrode bonded to a second surface of the semiconductor element supported on the support member with a second bonding material, and further including a method of producing the semiconductor device. Respective connecting parts of the support member and the lead electrode are Ni-plated and each of the first and the second bonding material is a Sn solder having a Cu6Sn5 content greater than a eutectic content.

摘要翻译： 半导体器件包括半导体元件，利用第一接合材料接合到半导体元件的第一表面的支撑构件和利用第二接合材料接合到支撑在支撑构件上的半导体元件的第二表面的引线电极，以及 还包括制造半导体器件的方法。 支撑构件和引线电极的各个连接部分是镀镍的，并且第一和第二接合材料中的每一个是Cu 6 Sn 5含量大于共晶含量的Sn焊料。

公开(公告)号：US08389854B2

公开(公告)日：2013-03-05

申请号：US12602385

申请日：2008-10-14

申请人： Masahide Okamoto ,  Osamu Ikeda

发明人： Masahide Okamoto ,  Osamu Ikeda

IPC分类号： H01B7/00

CPC分类号： H01R13/03 ,  B32B15/01 ,  Y10T428/12646 ,  Y10T428/12722

摘要： A Ni plating is applied on a base metal in a metal strip form, and a brightener-free Sn-(1 to 4% by mass)Cu plating is applied on the Ni plating. The metal strip is heat-treated at a temperature at or above the melting point (solidus line) of a Sn-(1 to 4% by mass)Cu alloy to form a Cu-Sn compound layer or a Cu—Ni—Sn-compound layer on the Ni plating layer and a Sn layer or a Sn—Cu-ally layer on the Cu—Sn compound layer or the Cu—Ni—Sn-compound layer. The metal strip is further fabricated into a connector.

摘要翻译： 以金属带状形式将Ni镀覆在基体金属上，并在Ni镀层上施加不添加光亮剂的Sn（1〜4质量％）Cu电镀。 在Sn-（1〜4质量％）Cu合金的熔点（固相线）以上的温度下对金属带进行热处理，形成Cu-Sn化合物层或Cu-Ni-Sn- Ni镀层上的化合物层和Cu-Sn化合物层或Cu-Ni-Sn化合物层上的Sn层或Sn-Cu-烯层。 金属条进一步制造成连接器。

公开(公告)号：US08356742B2

公开(公告)日：2013-01-22

申请号：US13228169

申请日：2011-09-08

申请人： Osamu Ikeda ,  Masahide Okamoto

发明人： Osamu Ikeda ,  Masahide Okamoto

IPC分类号： B23K31/00 ,  B23K35/12

CPC分类号： H01L23/49582 ,  B23K20/02 ,  B23K20/04 ,  B23K35/0238 ,  B32B15/017 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/743 ,  H01L24/83 ,  H01L2224/291 ,  H01L2224/29111 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/83101 ,  H01L2224/83455 ,  H01L2224/83801 ,  H01L2224/83805 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01009 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/13055 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/351 ,  Y10T428/12736 ,  Y10T428/31678 ,  H01L2924/01014 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/01083 ,  H01L2924/3512 ,  H01L2224/45099 ,  H01L2224/05599

摘要： In a connecting material of the present invention, a Zn series alloy layer is formed on an outermost surface of an Al series alloy layer. In particular, in the connecting material, an Al content of the Al series alloy layer is 99 to 100 wt. % or a Zn content of the Zn series alloy layer is 90 to 100 wt. %. By using this connecting material, the formation of an Al oxide film on the surface of the connecting material at the time of the connection can be suppressed, and preferable wetness that cannot be obtained with the Zn—Al alloy can be obtained. Further, a high connection reliability can be achieved when an Al series alloy layer is left after the connection, since the soft Al thereof functions as a stress buffer material.

摘要翻译： 在本发明的连接材料中，在Al系合金层的最表面上形成Zn系合金层。 特别地，在连接材料中，Al系合金层的Al含量为99〜100重量％。 Zn系合金层的％或Zn含量为90〜100重量％。 ％。 通过使用该连接材料，可以抑制在连接时在连接材料的表面上形成Al氧化膜，并且可以获得优选的用Zn-Al合金不能获得的湿度。 此外，由于其软Al作为应力缓冲材料，所以在连接后留下Al系合金层时，可以实现高的连接可靠性。

公开(公告)号：US08235335B2

公开(公告)日：2012-08-07

申请号：US10505408

申请日：2002-06-28

申请人： Norikazu Sato ,  Osamu Ikeda

发明人： Norikazu Sato ,  Osamu Ikeda

IPC分类号： F16M11/04

CPC分类号： G06F1/1601 ,  G02F1/13336 ,  G06F2200/1612 ,  G09F9/30 ,  Y10S248/919 ,  Y10S248/922 ,  Y10T16/5472

摘要： There is provided a multi-display device capable of displaying the entity of an image even in a case of a large image to be displayed, and capable of changing a horizontally long image screen to a vertically long image screenor vice versa by utilizing no mechanism for rotating, by 90 degrees, a display section and any specific soft therefor. For this purpose, the multi-display device is characterized by arranging a plurality of basic displays each having a function as a display in at least either one of vertical direction and horizontal direction.

摘要翻译： 提供了即使在要显示大图像的情况下也能够显示图像的实体的多显示设备，并且能够通过利用没有机制来将水平长的图像屏幕改变为垂直长的图像屏幕 旋转90度，显示部分和任何特定的软件。 为此，多显示装置的特征在于，在垂直方向和水平方向中的至少一个中布置具有作为显示器的功能的多个基本显示器。

公开(公告)号：US20100233307A1

公开(公告)日：2010-09-16

申请号：US12718341

申请日：2010-03-05

申请人： Keizo Arita ,  Yasuo Yoshii ,  Kazuo Iritani ,  Osamu Ikeda ,  Yoshiaki Nakata ,  Shin Iwasaki

发明人： Keizo Arita ,  Yasuo Yoshii ,  Kazuo Iritani ,  Osamu Ikeda ,  Yoshiaki Nakata ,  Shin Iwasaki

IPC分类号： B29B9/02

CPC分类号： B29B9/065 ,  B26D1/28 ,  B26D7/26

摘要： In a resin granulating apparatus of the present invention, a bracket extending in the outward radial direction over an outer peripheral surface of a sleeve is provided for the sleeve for rotatably supporting a cutter shaft of a cutter for shearing a material extruded from a die. Stopper means cooperating with the bracket to regulate movement of the sleeve toward the die and moving a regulation position in the axial direction is provided on the radially outer side over an outer diameter of the sleeve. With such a configuration, installation space is compactified so as to additionally provide the stopper means in the existing facilities, and a position of the cutter relative to a die surface is precisely adjusted so as to stably produce a pellet of a best shape.

摘要翻译： 在本发明的树脂造粒装置中，在套筒的外周面上向外径方向延伸的托架被设置用于可旋转地支撑用于剪切从模具挤出的材料的切割器的切割轴的套筒。 止动器装置与支架配合以调节套筒朝向模具的运动，并且在套筒的外径上的径向外侧上设置有沿轴向移动的调节位置。 利用这种构造，安装空间紧凑，从而在现有设施中另外提供止动装置，并且精确地调节刀具相对于模具表面的位置，以便稳定地产生最佳形状的丸粒。

公开(公告)号：US20100175908A1

公开(公告)日：2010-07-15

申请号：US12602385

申请日：2008-10-14

申请人： Masahide Okamoto ,  Osamu Ikeda

发明人： Masahide Okamoto ,  Osamu Ikeda

IPC分类号： H01B5/00 ,  B32B15/01 ,  B32B15/20 ,  B05D5/12

CPC分类号： H01R13/03 ,  B32B15/01 ,  Y10T428/12646 ,  Y10T428/12722

摘要： A Ni plating is applied on a base metal in a metal strip form, and a brightener-free Sn-(1 to 4% by mass)Cu plating is applied on the Ni plating. The metal strip is heat-treated at a temperature at or above the melting point (solidus line) of a Sn-(1 to 4% by mass)Cu alloy to form a Cu—Sn compound layer or a Cu—Ni—Sn-compound layer on the Ni plating layer and a Sn layer or a Sn—Cu-ally layer on the Cu—Sn compound layer or the Cu—Ni—Sn-compound layer. The metal strip is further fabricated into a connector. Thus, a metal strip, which has good soldability on a substrate, is free from the occurrence of whiskers at a terminal part during storage or upon fitting into FPC or FFC, and is necessary for a lead-free connector, can be realized.

摘要翻译： 以金属带状形式将Ni镀覆在基体金属上，并在Ni镀层上施加不添加光亮剂的Sn（1〜4质量％）Cu电镀。 在Sn-（1〜4质量％）Cu合金的熔点（固相线）以上的温度下对金属带进行热处理，形成Cu-Sn化合物层或Cu-Ni-Sn- Ni镀层上的化合物层和Cu-Sn化合物层或Cu-Ni-Sn化合物层上的Sn层或Sn-Cu-烯层。 金属条进一步制造成连接器。 因此，在基板上具有良好的可销售性的金属带在储存期间或在安装到FPC或FFC中时在端子部分没有出现晶须，并且可以实现无铅连接器所必需的。