公开(公告)号：US3953418A

公开(公告)日：1976-04-27

申请号：US488855

申请日：1974-07-15

申请人： Noboru Yanaihara ,  Osamu Ikeda

发明人： Noboru Yanaihara ,  Osamu Ikeda

IPC分类号： G01N33/53 ,  C07K1/113 ,  C07K14/00 ,  C07K14/62 ,  G01N33/74 ,  G21H5/00 ,  G21H5/02 ,  C07C103/52 ,  A61K37/26

CPC分类号： C07K14/62 ,  Y10S436/804 ,  Y10S436/815 ,  Y10S436/817

摘要： A peptide having an amino acid sequence of Arg-Arg-Glu-Ala-Glu-Asp-Leu-Gln-Val-Gly-Gln-Val-Glu-Leu-Gly-Gly-Gly-Pro-Gly-Ala-Gly-Ser-Leu-Gln-Pro-Leu-Ala-Leu-Glu-Gly-Ser-Leu-Gln-Lys-Arg; Tyr-Arg-Arg-Glu-Ala-Glu-Asp-Leu-Gln-Val-Gly-Gln-Val-Glu-Leu-Gly-Gly-Gly-Pro-Gly-Ala-Gly-Ser-Leu-Gln-Pro-Leu-Ala-Leu-Glu-Gly-Ser-Leu-Gln-Lys-Arg; or Tyr-Arg-Arg-Glu-Ala-Glu-Asp-Leu-Gln-Val-Gly-Gly-Gln-Val-Glu-Leu-Gly-Gly-Gly-Pro-Gly-Ala-Gly-Ser-Leu-Gln-Pro-Leu-Ala-Leu-Glu-Gly-Ser-Leu-Gln-Lys-Arg; and the N.sup..epsilon. formyl-Lys derivative thereof.

摘要翻译： 具有Arg-Arg-Glu-Ala-Glu-Asp-Leu-Gln-Val-Gly-Gln-Val-Glu-Leu-Gly-Gly-Gly-Pr-Gly-Ala-Gly的氨基酸序列的肽 -Ser-Leu-Gln-Pro-Leu-Ala-Leu-Glu-Gly-Ser-Leu-Gln-Lys-Arg; Tyr-Arg-Arg-Glu-Ala-Glu-Asp-Leu-Gln-Val-Gly-Gln-Val-Glu-Leu-Gly-Gly-Gly-Pro-Gly-Ala-Gly-Ser-Leu-Gln -Pro-Leu-Ala-Leu-Glu-Gly-Ser-Leu-Gln-Lys-Arg; 或Tyr-Arg-Arg-Glu-Ala-Glu-Asp-Leu-Gln-Val-Gly-Gly-Gln-Val-Glu-Leu-Gly-Gly-Gly-Pro-Gly-Ala-Gly-Ser- Leu-Gln-Pro-Leu-Ala-Leu-Glu-Gly-Ser-Leu-Gln-Lys-Arg; 及其N-甲酰基-Lys衍生物。

公开(公告)号：US08525330B2

公开(公告)日：2013-09-03

申请号：US13382633

申请日：2010-08-30

申请人： Masahide Okamoto ,  Osamu Ikeda ,  Yuki Murasato

发明人： Masahide Okamoto ,  Osamu Ikeda ,  Yuki Murasato

IPC分类号： H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC分类号： C22C18/04 ,  B22F2998/00 ,  B23K1/0016 ,  B23K2101/42 ,  B32B15/017 ,  C22C21/00 ,  C22C21/06 ,  H01L23/04 ,  H01L23/3107 ,  H01L23/49582 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/29118 ,  H01L2224/29147 ,  H01L2224/29211 ,  H01L2224/2929 ,  H01L2224/29299 ,  H01L2224/29347 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/83101 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01012 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/0133 ,  H01L2924/0134 ,  H01L2924/10253 ,  H01L2924/13055 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/351 ,  Y10T29/49826 ,  Y10T428/12736 ,  B22F7/062 ,  H01L2924/0105 ,  H01L2924/00012 ,  H01L2924/01013 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01014 ,  H01L2924/01083 ,  H01L2924/01031 ,  H01L2924/01082 ,  H01L2924/01049 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/05599

摘要： Provided is a connecting part for a semiconductor device including a semiconductor element, a frame, and a connecting part which connects the semiconductor element and the frame to each other, in which an interface between the connecting part and the semiconductor element and an interface between the connecting part and the frame respectively have the area of Al oxide film which is more than 0% and less than 5% of entire area of the respective interfaces. The connecting part has an Al-based layer and first and second Zn-based layers on main surfaces of the Al-based layer, a thickness ratio of the Al-based layer relative to the Zn-based layers being less than 0.59.

摘要翻译： 提供了一种半导体器件的连接部件，其包括半导体元件，框架和将半导体元件和框架彼此连接的连接部分，其中连接部分和半导体元件之间的界面和 连接部和框架分别具有比各界面的整个面积大于0％且小于5％的Al氧化物膜的面积。 连接部分在Al基层的主表面上具有Al基层和第一和第二Zn基层，Al基层相对于Zn基层的厚度比小于0.59。

公开(公告)号：US20110037694A1

公开(公告)日：2011-02-17

申请号：US12898570

申请日：2010-10-05

申请人： Masahiro Juen ,  Kenji Toyoda ,  Osamu Ikeda ,  Hisato Ide

发明人： Masahiro Juen ,  Kenji Toyoda ,  Osamu Ikeda ,  Hisato Ide

IPC分类号： G06F3/033

CPC分类号： G06F3/033 ,  G06F3/04845 ,  G06T1/00 ,  H04N1/00352 ,  H04N1/00397 ,  H04N1/00411 ,  H04N2101/00

摘要： An image processing apparatus provided with a display unit for displaying an operation picture, showing control indicia (e.g., icons) corresponding to multiple image processing functions, is operated to display the operation picture on an external display device. The operator selects one of the indicia shown on the external display device by operating an input device, such as touch screen of the apparatus or a remote control, to indicate the position of the desired one of the indicia. The operator can thereby quickly and reliably select an image processing function to be executed, without any need to view an operation picture on the display unit when making the selection.

摘要翻译： 操作具有用于显示操作画面的显示单元的图像处理设备，显示与多个图像处理功能对应的控制标记（例如，图标），以在外部显示设备上显示操作画面。 操作者通过操作诸如设备的触摸屏或遥控器的输入设备来指示所需的一个标记的位置来选择外部显示设备上所示的一个标记。 因此，操作者能够快速，可靠地选择要执行的图像处理功能，而不需要在进行选择时在显示单元上观看操作画面。

公开(公告)号：US07719106B2

公开(公告)日：2010-05-18

申请号：US11780375

申请日：2007-07-19

申请人： Minori Kajimoto ,  Osamu Ikeda ,  Masaki Momodomi

发明人： Minori Kajimoto ,  Osamu Ikeda ,  Masaki Momodomi

IPC分类号： H01L23/12

CPC分类号： H01L23/49855 ,  G06K19/077 ,  H01L23/49838 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/05599 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/484 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/014 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2924/00012

摘要： A semiconductor device comprises a substrate, an external terminal provided on the substrate, an internal wiring pattern electrically connected to the external terminal, a semiconductor chip mounted on the substrate and electrically connected to the internal wiring pattern, and an antenna pattern. The antenna pattern provided at each of adjacent two corner portions of the substrate and is grounded.

摘要翻译： 半导体器件包括衬底，设置在衬底上的外部端子，与外部端子电连接的内部布线图案，安装在衬底上并电连接到内部布线图案的半导体芯片和天线图案。 天线图案设置在基板的相邻两个角部的每一个处并接地。

公开(公告)号：US07338273B2

公开(公告)日：2008-03-04

申请号：US10437063

申请日：2003-05-14

申请人： Masashi Konno ,  Nobuki Nagami ,  Yasuo Yoshii ,  Osamu Ikeda ,  Yoshiaki Nakata ,  Kazuo Iritani

发明人： Masashi Konno ,  Nobuki Nagami ,  Yasuo Yoshii ,  Osamu Ikeda ,  Yoshiaki Nakata ,  Kazuo Iritani

IPC分类号： B29B9/00 ,  B29C47/08 ,  F16D3/26 ,  B26D7/26

CPC分类号： B29B9/065 ,  B26D1/28 ,  B26D7/2628 ,  B29B9/06 ,  Y10S83/913 ,  Y10T83/9319 ,  Y10T83/9379 ,  Y10T83/9464

摘要： A cutter machine has a knife holder 13 mounted onto a cutter shaft 6 at the center portion, wherein a material to be cut is cut with knives 15 mounted onto the outer circumference of the knife holder 13 by rotating the knife holder 13 around the cutter shaft 6. The knife holder 13 is separated into a fixing member 17 mounted onto the cutter shaft 6 and a mounting member 18 onto which the knives 15 are mounted. The mounting member 18 is pivotally supported around two axes with respect to the fixing member 17. In the cutter machine, the knives and a die plate come into contact with each other by a small press force of the knives, thereby enabling a satisfactory cutting to be obtained.

摘要翻译： 切割机具有在中心部分安装到切割器轴6上的刀架13，其中通过将刀架13围绕切割轴旋转而切割安装在刀架13的外周上的刀15切割的材料 6。 刀架13被分离成安装在刀轴6上的固定件17和安装件18，刀架15安装在该安装件18上。 安装构件18相对于固定构件17围绕两个轴线枢转地支撑。 在切割机中，通过刀的小的压力使刀和模板彼此接触，从而能够获得令人满意的切割。

公开(公告)号：US20080025701A1

公开(公告)日：2008-01-31

申请号：US11898455

申请日：2007-09-12

申请人： Osamu Ikeda

发明人： Osamu Ikeda

IPC分类号： H04N5/76 ,  H04N5/225

CPC分类号： H04N5/232 ,  H04N5/23245 ,  H04N5/772 ,  H04N5/85 ,  H04N9/7921 ,  H04N9/8063 ,  H04N9/8227

摘要： A dynamic image recording button and a still image recording button are provided at the main unit of a movie camera. A magneto-optical recording medium is loaded in a slot. If the dynamic image recording button or the still image recording button is operated during a reproduction operation, the reproduction operation is interrupted in a state in which the mechanical drive (rotation) of the magneto-optical recording medium is sustained. At this point, a dynamic image signal or a still image signal obtained through a photographing operation performed at the camera unit is temporarily recorded in a buffer memory, and is written in the magneto-optical recording medium when a write in the magneto-optical recording medium becomes enabled. Instructions to record dynamic images and to record still images can be issued to the movie camera through a touch-panel provided on the screen of a liquid crystal display unit. Even when operation cannot be performed through the touch-panel, the instructions can be issued through the dynamic image recording button or the still image recording button.

摘要翻译： 动画图像记录按钮和静止图像记录按钮设置在电影摄像机的主单元处。 磁光记录介质装载在槽中。 如果动态图像记录按钮或静止图像记录按钮在再现操作期间被操作，则在保持磁光记录介质的机械驱动（旋转）的状态下中断再现操作。 此时，通过在相机单元执行的拍摄操作获得的动态图像信号或静止图像信号被临时记录在缓冲存储器中，并且当写入磁光记录时被写入磁光记录介质 媒体启用 通过设置在液晶显示单元的屏幕上的触摸面板，可以向摄像机发出用于记录动态图像和记录静止图像的指令。 即使不能通过触摸面板执行操作，也可以通过动态图像记录按钮或静止图像记录按钮来发出指令。

公开(公告)号：US07253509B2

公开(公告)日：2007-08-07

申请号：US11005438

申请日：2004-12-06

申请人： Minori Kajimoto ,  Osamu Ikeda ,  Masaki Momodomi

发明人： Minori Kajimoto ,  Osamu Ikeda ,  Masaki Momodomi

IPC分类号： H01L23/02

CPC分类号： H01L23/49855 ,  G06K19/077 ,  H01L23/49838 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/05599 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/484 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/014 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2924/00012

摘要： A semiconductor device comprises a substrate, an external terminal provided on the substrate, an internal wiring pattern electrically connected to the external terminal, a semiconductor chip mounted on the substrate and electrically connected to the internal wiring pattern, and an antenna pattern. The antenna pattern provided at each of adjacent two corner portions of the substrate and is grounded.

公开(公告)号：US20070096294A1

公开(公告)日：2007-05-03

申请号：US11594077

申请日：2006-11-08

申请人： Osamu Ikeda ,  Toshiyuki Ohkoda

发明人： Osamu Ikeda ,  Toshiyuki Ohkoda

IPC分类号： H01L23/12

CPC分类号： B81B7/007 ,  B81C2203/0118 ,  H01L27/14618 ,  H01L27/1462 ,  H01L27/14806 ,  H01L2924/16235 ,  Y10S257/924

摘要： This invention miniaturizes a package of a semiconductor device and simplifies a manufacturing procedure to reduce a manufacturing cost. A semiconductor wafer formed of a plurality of semiconductor chips formed with MEMS devices and wiring thereof on front surface thereof and a cap arrayed wafer disposed with a plurality of sealing caps are attached to seal the MEMS devices in cavities between them. Then, a plurality of via-holes is provided penetrating through the semiconductor wafer to form embedded electrodes therein, and bump electrodes are formed thereon. After this procedure, this structure is cut along scribe lines to be divided into each of packages.

摘要翻译： 本发明使半导体器件的封装小型化并且简化制造程序以降低制造成本。 由形成有MEMS器件的多个半导体芯片及其前表面上的布线形成的半导体晶片和安置有多个密封盖的盖阵列晶片被连接以将MEMS器件密封在它们之间的空腔中。 然后，穿过半导体晶片提供多个通孔，以在其中形成嵌入电极，并在其上形成凸起电极。 在该过程之后，沿着划线切割该结构以分成每个包装。

公开(公告)号：US20060246304A1

公开(公告)日：2006-11-02

申请号：US11412090

申请日：2006-04-27

申请人： Shosaku Ishihara ,  Osamu Ikeda ,  Ryouichi Kajiwara ,  Shinji Hiramitsu ,  Satoshi Matsuyoshi

发明人： Shosaku Ishihara ,  Osamu Ikeda ,  Ryouichi Kajiwara ,  Shinji Hiramitsu ,  Satoshi Matsuyoshi

IPC分类号： B32B13/04 ,  B32B15/04

CPC分类号： H01L23/24 ,  B23K35/007 ,  B23K35/264 ,  B23K2101/40 ,  B23K2103/12 ,  B23K2103/18 ,  B23K2103/56 ,  H01L23/49513 ,  H01L24/01 ,  H01L24/32 ,  H01L24/33 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/325 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/83801 ,  H01L2224/83825 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01052 ,  H01L2924/01057 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01084 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/12035 ,  H01L2924/1301 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/181 ,  H01L2924/351 ,  H01L2924/3651 ,  Y10T428/31678 ,  H01L2924/00012 ,  H01L2924/01083 ,  H01L2924/01013 ,  H01L2924/01025 ,  H01L2924/01028 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2224/05599

摘要： The present invention provides a semiconductor device comprising a semiconductor element and a copper member which are bonded to each other by a bismuth-based (Bi-based) bonding material having its melting temperature of not less than 250° C., wherein silver (Ag) is diffused in a region of the bonding material in the vicinity of an interface thereof to the semiconductor element with an inclination of concentration of the silver from the interface, in order to realize a manufacture of the semiconductor device without using lead (Pb) at low cost.

摘要翻译： 本发明提供一种包含半导体元件和铜构件的半导体器件，其通过熔融温度不低于250℃的铋基（Bi系）接合材料彼此接合，其中银（Ag ）在与界面的银浓度倾斜的界面附近在接合材料附近的区域扩散，以实现半导体器件的制造，而不使用铅 低成本。

公开(公告)号：US06776691B2

公开(公告)日：2004-08-17

申请号：US09971692

申请日：2001-10-09

申请人： Matsuomi Nishimura ,  Mikichi Ban ,  Kazuo Takahashi ,  Osamu Ikeda

发明人： Matsuomi Nishimura ,  Mikichi Ban ,  Kazuo Takahashi ,  Osamu Ikeda

IPC分类号： B24B100

CPC分类号： H01L21/67028 ,  B08B3/00 ,  B08B3/04 ,  B08B2203/005 ,  B24B37/04 ,  B24B57/02 ,  Y10T29/49165

摘要： A polishing apparatus that can effectively and efficiently remove potassium and other alkaline metals comprises integrally a polishing unit for polishing an object by means of a polishing agent and a cleaning unit for cleaning the polished object. The polishing unit and the cleaning unit have means for isolating the internal atmosphere from the external atmosphere and the cleaning unit has a means for cleaning the polished object by bringing hot pure water or steam of pure water into contact with the polished object. With a cleaning method hot pure water is brought into contact with the polished object without drying it after having been polished by such a polishing apparatus.

摘要翻译： 能够有效且高效地除去钾等碱金属的研磨装置，通过研磨剂和用于清洗抛光物的清洗单元，一体地研磨用于研磨物体的研磨单元。 抛光单元和清洁单元具有用于将内部空气与外部空气隔离的装置，并且清洁单元具有通过使热纯水或纯水蒸汽与抛光对象接触来清洁抛光对象的装置。 通过清洗方法，在通过这种抛光装置抛光之后，使热纯水与抛光物体接触而不干燥。