摘要:
A system, method and program product for enhancing dose uniformity during ion implantation are disclosed. The present invention is directed to allowing the use of an at least partially un-tuned ion beam to obtain a uniform implant by scanning the beam in multiple rotationally-fixed orientations (scan directions) of the target at variable or non-uniform scan velocities. The non-uniform scan velocities are dictated by a scan velocity profile that is generated based on the ion beam profile and/or the scan direction. The beam can be of any size, shape or tuning. A platen holding a wafer is rotated to a new desired rotationally-fixed orientation after a scan, and a subsequent scan occurs at the same scan velocity profile or a different scan velocity profile. This technique may be used independently or in conjunction with other uniformity approaches to achieve the required level of uniformity.
摘要:
Methods and systems are described for verifying stored data by receiving a first set of metadata associated with a first set of stored data, generating a second set of metadata associated with a second set of stored data which is associated with the first set of stored data, and comparing the first set of metadata and second set of metadata. Alternatively, the storage system can also generate a first set of metadata associated with a first set of stored data, generate a second set of stored data which is a copy of the first set of stored data, generate a second set of metadata associated with the second set of stored data, and compare the first set of metadata and the second set of metadata.
摘要:
Composite laminate interlayers for adhering a glass laminate comprising two sheets of polyethylene terephthalate (PET) between layers of plasticized polyvinyl butyral (PVB) adhesive layers, wherein the two PET layers provide increased stiffness for the laminate without sacrificing the optical clarity of the laminate.
摘要:
A system and method are provided for operating a variable aperture (30) for adjusting the amount of ion beam current passing therethrough in an ion implantation system (10). The system and method comprise means or steps for (i) measuring ion beam current at an implanter location using a current detector (35); (ii) comparing the measured ion beam current with a desired ion beam current; (iii) outputting a control signal (126, 128) based on the comparison of the measured ion beam current with the desired ion beam current; and (iv) adjusting a gap (50), through which through ion beam passes and which is defined by opposing first and second aperture plates (44A, 44B), in response to the control signal to control the amount of ion beam current passing therethrough. The current detector (35) provides ion beam current feedback, and a position sensor (116, 118) may be utilized to provide aperture plate (44A, 44B) position feedback. The system and method provide a quick, direct, and precise mechanism for effecting significant changes in ion beam current without requiring re-tuning of the source. The gap (50) of the aperture (44) is adjustable in increments of about 5 microns (&mgr;m).
摘要:
FIG. 1 is a top, front, right side perspective view of an AUDIO INTERFACE, showing my design. FIG. 2 is a bottom, rear, left side perspective view thereof. FIG. 3 is a front elevation view thereof. FIG. 4 is a rear elevation view thereof. FIG. 5 is a left side elevation view thereof. FIG. 6 is a right side elevation view thereof. FIG. 7 is a top plan view thereof. FIG. 8 is a bottom plan view thereof. FIG. 9 is an enlarged view of an area labeled 9 in FIG. 1. FIG. 10 is an enlarged view of an area labeled 10 in FIG. 1. The evenly spaced dashed broken lines depict portions of the Audio Interface that form no part of the claimed design. The dot-dash line circles depict the limits of the enlarged views and form no part of the claimed design.
摘要:
A device, method and system of displaying a file on a mobile communication device may comprise duplicating at least a leftmost part of a file to obtain a duplicated leftmost part of the file, and displaying a frame through moving a display window along the frame, the frame comprising a rightmost part of the file and the duplicated leftmost part of the file, wherein the duplicated leftmost part of the file is placed on right of the rightmost part of the file. In some embodiments, the mobile communication device may control the display window to automatically move to a leftmost side of the frame, if the display window moves to a rightmost side of the frame, and further in response to a user instruction of continuing viewing the file.
摘要:
The invention provides a method for generating Li2O2 or composites of it, the method uses mixing lithium ions with oxygen ions in the presence of a catalyst. The catalyst comprises a plurality of metal clusters, their alloys and mixtures, each cluster consisting of between 3 and 18 metal atoms. The invention also describes a lithium-air battery which uses a lithium metal anode, and a cathode opposing the anode. The cathode supports metal clusters, each cluster consisting of size selected clusters, taken from a range of between approximately 3 and approximately 18 metal atoms, and an electrolyte positioned between the anode and the cathode.
摘要翻译:本发明提供了一种生成Li 2 O 2或其复合物的方法,该方法在催化剂存在下使用锂离子与氧离子混合。 催化剂包括多个金属簇,它们的合金和混合物,每个簇由3至18个金属原子组成。 本发明还描述了使用锂金属阳极和与阳极相对的阴极的锂空气电池。 阴极支撑金属簇,每个簇由尺寸选定的簇组成,取自大约3至大约18个金属原子之间的范围,以及位于阳极和阴极之间的电解质。
摘要:
A power semiconductor package has an ultra thin chip with front side molding to reduce substrate resistance; a lead frame unit with grooves located on both side leads provides precise positioning for connecting numerous bridge-shaped metal clips to the front side of the side leads. The bridge-shaped metal clips are provided with bridge structure and half or fully etched through holes for relieving superfluous solder during manufacturing process.
摘要:
This invention discloses a semiconductor package with adhesive material pre-printed on the lead frame and chip, and the manufacturing method. The adhesive material is applied onto the chip carrier and the pin of the lead frame and also on the front electrode of the semiconductor chip via pre-printing. The back of the semiconductor chip is adhered on the chip carrier, and the front electrode of the semiconductor chip and the pin are connected respectively with a metal connector. The size, shape and thickness of the adhesive material are applied according to different application requirements according to size and shapes of the contact zone of the semiconductor chip and the metal connector. Particularly, the adhesive zones are formed by pre-printing the adhesive material thus significantly enhance the quality and performance of semiconductor products, and improves the productivity.