公开(公告)号：US06696319B2

公开(公告)日：2004-02-24

申请号：US10244256

申请日：2002-09-16

申请人： Gerd Frankowsky ,  Thorsten Meyer

发明人： Gerd Frankowsky ,  Thorsten Meyer

IPC分类号： H01L2144

CPC分类号： H01L24/81 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/17517 ,  H01L2224/45144 ,  H01L2224/81136 ,  H01L2224/81801 ,  H01L2924/0001 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01055 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/00

摘要： A method of attaching semiconductor devices, the contact devices of which have preferably already been applied at wafer level, on a switching device and such a device includes having the electrical contacts remain free of solder by using flexible contact elements, and performing the mechanical attachment by additional attachment elements or compression stops used as attachment elements.

摘要翻译： 将其接触装置优选地已经以晶片级施加在其上的半导体器件的方法在开关器件上，并且这种器件包括通过使用柔性接触元件使电触头保持不含焊料，并且通过使用柔性接触元件执行机械附接 用作附件的附加附件或压缩挡块。

公开(公告)号：US10170409B2

公开(公告)日：2019-01-01

申请号：US15037276

申请日：2013-12-23

申请人： Sanka Ganesan ,  John S. Guzek ,  Nitesh Nimkar ,  Klaus Reingruber ,  Thorsten Meyer

发明人： Sanka Ganesan ,  John S. Guzek ,  Nitesh Nimkar ,  Klaus Reingruber ,  Thorsten Meyer

IPC分类号： H01L23/02 ,  H01L23/52 ,  H01L23/522 ,  H01L21/56 ,  H01L21/768 ,  H01L23/498 ,  H01L23/00 ,  H01L25/065 ,  H01L25/10 ,  H01L25/00 ,  H01L23/31 ,  H01L23/538

摘要： Embodiments of the present disclosure are directed to package assemblies and methods for fabricating package assemblies. In one embodiment, a package assembly includes a die at least partially embedded in a mold compound; and a through mold via (TMV). The TMV may have vertical sides or may include two different portions with varying shapes. In some instances, prefabricated via bars may be used during fabrication. Package assemblies of the present disclosure may include package-on-package (POP) interconnects having a pitch of less than 0.3 mm. Other embodiments may be described and/or claimed.

公开(公告)号：US09331057B2

公开(公告)日：2016-05-03

申请号：US11924691

申请日：2007-10-26

申请人： Thorsten Meyer ,  Grit Sommer ,  Ralf Plieninger

发明人： Thorsten Meyer ,  Grit Sommer ,  Ralf Plieninger

IPC分类号： H01L21/20 ,  H01L25/16 ,  H01L23/522 ,  H01L23/64 ,  H01L23/00 ,  H01L25/00 ,  H01L49/02 ,  H01L21/56

CPC分类号： H01L25/16 ,  H01L21/568 ,  H01L23/5223 ,  H01L23/642 ,  H01L24/19 ,  H01L24/96 ,  H01L24/97 ,  H01L25/50 ,  H01L28/40 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/05548 ,  H01L2224/12105 ,  H01L2224/13022 ,  H01L2224/20 ,  H01L2224/24195 ,  H01L2224/92 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/19041 ,  H01L2924/30105 ,  H01L2224/96 ,  H01L2224/82

摘要： A semiconductor device is disclosed. One embodiment provides a semiconductor chip. The semiconductor chip includes a first electrode of a capacitor. An insulating layer is arranged on top of the first electrode. A second electrode of the capacitor is applied over the insulating layer, wherein the second electrode is made of a conductive layer arranged over the semiconductor chip.

摘要翻译： 公开了一种半导体器件。 一个实施例提供一种半导体芯片。 半导体芯片包括电容器的第一电极。 绝缘层设置在第一电极的顶部。 电容器的第二电极被施加在绝缘层上，其中第二电极由布置在半导体芯片上的导电层制成。

公开(公告)号：US09205868B2

公开(公告)日：2015-12-08

申请号：US14237232

申请日：2012-08-03

申请人： Axel Hebenstreit ,  Hans-Dieter Loeffler ,  Thorsten Meyer

发明人： Axel Hebenstreit ,  Hans-Dieter Loeffler ,  Thorsten Meyer

IPC分类号： B62D1/16 ,  B62D7/06 ,  B62D1/20 ,  F16D1/08 ,  F16D3/38

CPC分类号： B62D7/06 ,  B62D1/20 ,  F16D1/0876 ,  F16D1/0882 ,  F16D1/0888 ,  F16D3/387

摘要： A steering spindle has a steering spindle connection connected to a fork crown of a steering coupling via an intermediate piece. The steering spindle connection and the intermediate piece are formed as plug partners at ends facing each other, by means of at least one tongue and groove guide element pair, which provides a torque-transmitting priority control. A groove and a tongue of the at least one tongue and groove guide element pair are positioned in the longitudinal axial direction on the steering spindle connection and the intermediate piece. The steering arrangement includes a clamping device that clamps the plug partners to each other in a plugging position.

摘要翻译： 转向主轴具有通过中间件连接到转向联轴器的叉头的转向主轴连接。 转向主轴连接件和中间件通过至少一个榫舌和槽导向元件对形成为彼此面对的端部处的插塞配合，其提供扭矩传递优先级控制。 所述至少一个舌槽导向元件对的槽和舌部沿着纵向轴向位于转向主轴连接件和中间件上。 该转向装置包括夹紧装置，该夹紧装置将插塞合体彼此夹持在堵塞位置。

公开(公告)号：US09126622B2

公开(公告)日：2015-09-08

申请号：US14237289

申请日：2012-08-03

申请人： Axel Hebenstreit ,  Hans-Dieter Loeffler ,  Thorsten Meyer

发明人： Axel Hebenstreit ,  Hans-Dieter Loeffler ,  Thorsten Meyer

IPC分类号： B62D1/16 ,  B62D1/20 ,  F16D1/08 ,  F16D3/38 ,  F16D1/06

CPC分类号： B62D1/16 ,  B62D1/20 ,  F16D1/06 ,  F16D1/0876 ,  F16D1/0882 ,  F16D1/0888 ,  F16D3/387 ,  Y10T403/7026

摘要： A steering arrangement includes a steering spindle and a steering coupling provided with a fork crown bearing a connecting element that connects an end of the steering spindle to the steering coupling in the form of a plug connection. To enable the combined steering spindle and steering coupling ends to be connected to each other in the correct relative position and thus to be able to prevent a defective assembly, the steering spindle end and the connecting element are coaxial plug partners on ends facing each other, by means of at least one tongue and groove guide element pair that provides a torque-transmitting priority control. The at least one groove and/or the at least one tongue of the guide element pair is molded on the interior of the shaft. A clamping device clamps the plug partners against each other in a plugging position so that they cannot come loose.

摘要翻译： 转向装置包括转向主轴和转向联轴器，该转向联轴器设置有叉形冠，其具有将转向主轴的端部与插头连接形式的转向联轴器连接的连接元件。 为了使组合的转向主轴和转向联轴器端部能够以正确的相对位置彼此连接，并且因此能够防止组装不良，转向主轴端部和连接元件是彼此相对的端部上的同轴插头配件， 通过提供转矩传递优先级控制的至少一个舌槽导向元件对。 引导元件对的至少一个凹槽和/或至少一个舌片模制在轴的内部上。 夹紧装置将插塞合体彼此夹紧在堵塞位置，使其不会松动。

公开(公告)号：US09093322B2

公开(公告)日：2015-07-28

申请号：US11777694

申请日：2007-07-13

申请人： Thorsten Meyer ,  Markus Brunnbauer ,  Recai Sezi

发明人： Thorsten Meyer ,  Markus Brunnbauer ,  Recai Sezi

IPC分类号： H01L23/48 ,  H01L23/00 ,  B81C1/00 ,  H01L21/56 ,  H01L23/31

CPC分类号： H01L24/12 ,  B81B2207/07 ,  B81B2207/097 ,  B81C1/00301 ,  H01L21/568 ,  H01L23/3114 ,  H01L24/11 ,  H01L2224/02311 ,  H01L2224/0401 ,  H01L2224/05147 ,  H01L2224/05164 ,  H01L2224/05166 ,  H01L2224/05647 ,  H01L2224/1132 ,  H01L2224/1147 ,  H01L2224/13099 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/01074 ,  H01L2924/013

摘要： A semiconductor device is disclosed. One embodiment includes a semiconductor substrate and at least two insulating elements located above the semiconductor substrate or above a mold compound embedding the semiconductor substrate. The at least two insulating elements have a first face facing the semiconductor substrate or the mold compound and a second face facing away from the semiconductor substrate or the mold compound. A conductive element for each of the at least two insulating elements extends from the first face of the insulating element to the second face of the insulating element.

摘要翻译： 公开了一种半导体器件。 一个实施例包括半导体衬底和位于半导体衬底之上或在嵌入半导体衬底的模具化合物上方的至少两个绝缘元件。 所述至少两个绝缘元件具有面对半导体衬底或模具化合物的第一面和背离半导体衬底或模具化合物的第二面。 用于至少两个绝缘元件中的每一个的导电元件从绝缘元件的第一面延伸到绝缘元件的第二面。

公开(公告)号：US20140332937A1

公开(公告)日：2014-11-13

申请号：US14330066

申请日：2014-07-14

申请人： Markus Brunnbauer ,  Thorsten Meyer ,  Stephan Bradl ,  Ralf Plieninger ,  Jens Pohl ,  Klaus Pressel ,  Recai Sezi

发明人： Markus Brunnbauer ,  Thorsten Meyer ,  Stephan Bradl ,  Ralf Plieninger ,  Jens Pohl ,  Klaus Pressel ,  Recai Sezi

IPC分类号： H01L23/60 ,  H01L23/48

CPC分类号： H01L25/50 ,  H01L21/4853 ,  H01L21/486 ,  H01L21/561 ,  H01L21/565 ,  H01L21/568 ,  H01L23/3128 ,  H01L23/48 ,  H01L23/5389 ,  H01L23/552 ,  H01L23/60 ,  H01L24/19 ,  H01L24/96 ,  H01L24/97 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/20 ,  H01L2224/97 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01033 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/1617 ,  H01L2924/181 ,  H01L2924/19043 ,  H01L2924/3025 ,  H01L2224/82 ,  H01L2924/00

摘要： A workpiece has at least two semiconductor chips, each semiconductor chip having a first main surface, which is at least partially exposed, and a second main surface. The workpiece also comprises an electrically conducting layer, arranged on the at least two semiconductor chips, the electrically conducting layer being arranged at least on regions of the second main surface, and a molding compound, arranged on the electrically conducting layer.

摘要翻译： 工件具有至少两个半导体芯片，每个半导体芯片具有至少部分暴露的第一主表面和第二主表面。 所述工件还包括布置在所述至少两个半导体芯片上的导电层，所述导电层至少布置在所述第二主表面的区域上，所述模制化合物布置在所述导电层上。

公开(公告)号：US08878335B2

公开(公告)日：2014-11-04

申请号：US12977104

申请日：2010-12-23

申请人： Thorsten Meyer ,  Josef Boeck ,  Rudolf Lachner ,  Herbert Schaefer

发明人： Thorsten Meyer ,  Josef Boeck ,  Rudolf Lachner ,  Herbert Schaefer

IPC分类号： H01L29/00 ,  H01L23/525 ,  H01L21/66

CPC分类号： H01L23/5258 ,  H01L22/14 ,  H01L22/22 ,  H01L2924/0002 ,  H01L2924/014 ,  H01L2924/12044 ,  H01L2924/00

摘要： A method and a system for providing fusing after packaging of semiconductor devices are disclosed. In one embodiment, a semiconductor device is provided comprising a substrate comprising a fuse area, at least one fuse disposed in the fuse area, and at least one layer disposed over the substrate, wherein the at least one layer comprises at least one opening exposing the at least one fuse.

摘要翻译： 公开了一种用于在半导体器件封装之后提供熔化的方法和系统。 在一个实施例中，提供了一种半导体器件，其包括衬底，该衬底包括保险丝区域，设置在熔丝区域中的至少一个熔丝以及设置在衬底上的至少一个层，其中至少一个层包括至少一个露出 至少有一个保险丝。

公开(公告)号：US20140264831A1

公开(公告)日：2014-09-18

申请号：US13802843

申请日：2013-03-14

申请人： Thorsten Meyer

发明人： Thorsten Meyer

IPC分类号： H01L23/498 ,  H01L21/48

CPC分类号： H01L25/0657 ,  H01L21/4846 ,  H01L21/56 ,  H01L21/563 ,  H01L21/565 ,  H01L21/568 ,  H01L23/3114 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/49838 ,  H01L23/525 ,  H01L23/5386 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/96 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/1703 ,  H01L2224/73209 ,  H01L2224/94 ,  H01L2224/97 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06548 ,  H01L2924/12042 ,  H01L2924/1461 ,  H01L2924/15311 ,  H01L2924/15321 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2924/18162 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19104 ,  H01L2924/00 ,  H01L2224/81

摘要： A chip arrangement may include: a first semiconductor chip having a first side and a second side opposite the first side; a second semiconductor chip having a first side and a second side opposite the first side, the second semiconductor chip disposed at the first side of the first semiconductor chip and electrically coupled to the first semiconductor chip, the first side of the second semiconductor chip facing the first side of the first semiconductor chip; an encapsulation layer at least partially encapsulating the first semiconductor chip and the second semiconductor chip, the encapsulation layer having a first side and a second side opposite the first side, the second side facing in a same direction as the second side of the second semiconductor chip; and an interconnect structure disposed at least partially within the encapsulation layer and electrically coupled to at least one of the first and second semiconductor chips, wherein the interconnect structure may extend to the second side of the encapsulation layer.

摘要翻译： 芯片布置可以包括：具有第一侧和与第一侧相对的第二侧的第一半导体芯片; 第二半导体芯片，具有与第一侧相对的第一侧和第二侧，第二半导体芯片设置在第一半导体芯片的第一侧并电耦合到第一半导体芯片，第二半导体芯片的第一侧面向第一半导体芯片 第一半导体芯片的第一面; 至少部分地封装所述第一半导体芯片和所述第二半导体芯片的封装层，所述封装层具有与所述第一侧相对的第一侧和第二侧，所述第二侧面向与所述第二半导体芯片的所述第二侧相同的方向 ; 以及互连结构，其至少部分地设置在封装层内并电耦合到第一和第二半导体芯片中的至少一个，其中互连结构可以延伸到封装层的第二侧。

公开(公告)号：US20140264808A1

公开(公告)日：2014-09-18

申请号：US13832200

申请日：2013-03-15

申请人： Andreas Wolter ,  Thorsten Meyer

发明人： Andreas Wolter ,  Thorsten Meyer

IPC分类号： H01L23/48 ,  H01L21/56

CPC分类号： H01L24/19 ,  B81B2207/07 ,  B81B2207/096 ,  B81C1/0023 ,  B81C2203/0792 ,  H01L23/055 ,  H01L23/3128 ,  H01L25/0657 ,  H01L25/16 ,  H01L2224/12105 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/2518 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73259 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06548 ,  H01L2225/06572 ,  H01L2924/07802 ,  H01L2924/07811 ,  H01L2924/12042 ,  H01L2924/1461 ,  H01L2924/15153 ,  H01L2924/15311 ,  H01L2924/1815 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2924/181

摘要： A chip arrangement may include a semiconductor chip; an encapsulation layer at least partially encapsulating the semiconductor chip, the encapsulation layer having a receiving region configured to receive an electronic device, the receiving region comprising a cavity; and an electronic device disposed in the receiving region.

摘要翻译： 芯片布置可以包括半导体芯片; 至少部分地封装所述半导体芯片的封装层，所述封装层具有被配置为接收电子器件的接收区域，所述接收区域包括空腔; 以及设置在接收区域中的电子设备。