公开(公告)号：US5407121A

公开(公告)日：1995-04-18

申请号：US155020

申请日：1993-11-19

申请人： Nicholas G. Koopman ,  Sundeep Nangalia

发明人： Nicholas G. Koopman ,  Sundeep Nangalia

IPC分类号： B23K1/20 ,  B23K35/38 ,  H05K3/34

CPC分类号： B23K35/38 ,  B23K1/20 ,  B23K2201/36 ,  H05K3/3489

摘要： A method of soldering a copper layer without the use of fluxing agents by exposing the copper layer to a fluorine-containing plasma. Solder is then placed onto the surface of the copper layer and reflowed. Reflow can take place at low temperatures, atmospheric pressure and in an inert or oxidizing atmosphere using standard solder reflow equipment.

摘要翻译： 一种通过将铜层暴露于含氟等离子体而不使用助熔剂来焊接铜层的方法。 然后将焊料放置在铜层的表面上并回流。 回流可以使用标准的回流焊设备在低温，大气压和惰性或氧化性气氛中进行。

公开(公告)号：US5325265A

公开(公告)日：1994-06-28

申请号：US819571

申请日：1992-01-07

申请人： Iwona Turlik ,  Arnold Reisman ,  Deepak Nayak ,  Lih-Tyng Hwang ,  Giora Dishon ,  Scott L. Jacobs ,  Robert F. Darveaux ,  Neil M. Poley

发明人： Iwona Turlik ,  Arnold Reisman ,  Deepak Nayak ,  Lih-Tyng Hwang ,  Giora Dishon ,  Scott L. Jacobs ,  Robert F. Darveaux ,  Neil M. Poley

IPC分类号： H01L23/373 ,  H01L23/473 ,  H01L23/538 ,  H01L25/065 ,  H05K7/20

CPC分类号： H01L24/32 ,  H01L23/3736 ,  H01L23/473 ,  H01L23/5383 ,  H01L25/0655 ,  H01L2224/16225 ,  H01L2224/27013 ,  H01L2224/73253 ,  H01L2224/73257 ,  H01L2224/83051 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15312 ,  H01L2924/15787 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/351

摘要： A high performance integrated circuit chip package includes a support substrate having conductors extending from one face to the opposite face thereof and a multilayer wiring substrate on the opposite face of the support substrate for connecting chips mounted thereon to one another and to the conductors. A heat sink includes microchannels at one face thereof, with thermally conductive cushions connecting the one face of the heat sink with the exposed back sides of the chips, to provide a high density chip package with high heat dissipation. The support substrate and heat sink may be formed of blocks of material having thermal expansion matching silicon. The cushions are a low melting point solder, preferably pure indium, and are sufficiently thick to absorb thermal stresses, but sufficiently thin to efficiently conduct heat from the chips to the heat sink.

摘要翻译： 高性能集成电路芯片封装包括：支撑基板，其具有从一个面向其相对面延伸的导体，以及在该支撑基板的相对面上的多层布线基板，用于将安装在其上的芯片彼此连接并连接至导体。 散热器包括在其一个面上的微通道，其中导热垫将散热片的一个面与芯片的暴露的背面连接起来，以提供具有高散热性的高密度芯片封装。 支撑衬底和散热器可以由具有热膨胀匹配硅的材料块形成。 垫子是低熔点焊料，优选纯铟，并且足够厚以吸收热应力，但是足够薄以有效地将热量从芯片传导到散热器。

公开(公告)号：US5248760A

公开(公告)日：1993-09-28

申请号：US646362

申请日：1991-01-25

申请人： Thomas D. DuBois ,  Farid M. Tranjan ,  Stephen M. Bobbio

发明人： Thomas D. DuBois ,  Farid M. Tranjan ,  Stephen M. Bobbio

IPC分类号： C08G73/10

CPC分类号： C08G73/1028

摘要： The invention comprises curing polyamic acid solutions into polyimide solutions by adding a hydrophilic reagent to a polyamic acid solution. The hydrophilic reagent is selected to have little or no reactivity with amines or carboxylic acids, and is of the type that will react with water to form by-products that shift the equilibrium between polyamic acid as a reactant and polyimide and water as products toward the production of polyimide.

摘要翻译： 本发明包括通过向聚酰胺酸溶液中加入亲水性试剂将聚酰胺酸溶液固化成聚酰亚胺溶液。 选择亲水试剂与胺或羧酸几乎没有或没有反应性，并且是与水反应以形成副产物的类型，其将作为反应物的聚酰胺酸和聚酰亚胺和水之间的平衡作为产物转移到 生产聚酰亚胺。

公开(公告)号：US5179316A

公开(公告)日：1993-01-12

申请号：US766418

申请日：1991-09-26

申请人： Mark D. Kellam

发明人： Mark D. Kellam

IPC分类号： H01L33/00

CPC分类号： H01L33/0008

摘要： An electroluminescent display device including a semiconductor substrate having a phosphor layer on one face thereof, and a space charge removing means in the semiconductor substrate. The space charge removing means continuously removes carriers, typically electrons, from the space charge barrier region formed during device operation, to thereby reduce space charge barrier related brightness limitations. The space charge removing means may comprise a doped region in the semiconductor substrate adjacent the phosphor layer, which is DC biased to continuously remove electrons from the space charge region. Alternatively, the doped region in the substrate adjacent the phosphor layer may inject electrons into the phosphor layer, with space charge removal being accomplished by a DC biased substrate contact. The space charge region in the substrate is reduced or eliminated thereby increasing the maximum number of electrons which can be injected into the electroluminescent layer and increasing the brightness of the display device.

摘要翻译： 一种电致发光显示装置，包括其一面上具有荧光体层的半导体基板和半导体基板中的空间电荷去除装置。 空间电荷去除装置从器件操作期间形成的空间电荷势垒区域连续地去除载流子，一般为电子，从而减少空间电荷势垒相关的亮度限制。 空间电荷去除装置可以包括在与磷光体层相邻的半导体衬底中的掺杂区域，其被直流偏置以从空间电荷区域连续移除电子。 或者，邻近磷光体层的衬底中的掺杂区域可以将电子注入到荧光体层中，通过DC偏置衬底接触来实现空间电荷去除。 衬底中的空间电荷区域被减少或消除，从而增加可以注入到电致发光层中并增加显示装置的亮度的电子的最大数量。

公开(公告)号：US5144191A

公开(公告)日：1992-09-01

申请号：US714275

申请日：1991-06-12

申请人： Gary W. Jones ,  Ching-Tzong Sune

发明人： Gary W. Jones ,  Ching-Tzong Sune

IPC分类号： H01J3/02

CPC分类号： H01J3/022

摘要： A microelectronic field emitter includes a horizontal emitter electrode and a vertical extraction electrode on the horizontal face of a substrate. An end of the horizontal emitter electrode and the end of the vertical extraction electrode form an electron emission gap therebetween. The emitter electrode may be formed on an insulating layer which is formed on a substrate. The insulating layer also includes a sidewall, and the extraction electrode may be formed on the sidewall with one thereof extending adjacent the emitter electrode to form an electron emission gap therebetween. A vertical collector electrode may also be formed on the sidewall of a second insulating layer spaced from the first sidewall. The field emitter may be cylindrical, planar, or of various other shapes. multiple emitters, extractors and collectors may be stacked on one another. The emitters may be formed using conventional microelectronic fabrication techniques, in which an insulating layer is etched to form a sidewall and conformal metallization is used to form extractor and collector electrodes. A low capacitance, high speed, high power horizontal microelectronic emitter may thereby be formed.

摘要翻译： 微电子场发射器在基板的水平面上包括水平发射极电极和垂直引出电极。 水平发射极的端部和垂直引出电极的端部在它们之间形成电子发射间隙。 发射电极可以形成在形成在基板上的绝缘层上。 绝缘层还包括侧壁，并且引出电极可以形成在侧壁上，其中一个延伸邻近发射极电极，以在它们之间形成电子发射间隙。 也可以在与第一侧壁间隔开的第二绝缘层的侧壁上形成垂直集电极。 场发射器可以是圆柱形的，平面的或各种其他形状。 多个发射器，提取器和收集器可以彼此堆叠。 发射体可以使用常规的微电子制造技术形成，其中绝缘层被蚀刻以形成侧壁，并且保形金属化用于形成提取器和集电极。 因此可以形成低电容，高速，高功率的水平微电子发射器。

公开(公告)号：US5025304A

公开(公告)日：1991-06-18

申请号：US277607

申请日：1988-11-29

申请人： Arnold Reisman ,  Iwona Turlik

发明人： Arnold Reisman ,  Iwona Turlik

IPC分类号： H01L21/768 ,  G01N21/01 ,  G01N21/27 ,  H01L23/48 ,  H01L23/535 ,  H01L27/00

CPC分类号： H01L23/535 ,  H01L23/481 ,  H01L2924/0002

摘要： A method of forming a high density semiconductor structure including one or more buried metal layers. One or more metal layers may be formed on a first semiconductor substrate, with the metal layer or layers being insulated from one another and from the substrate. One or more metal layers may be formed on the surface of a second substrate which may or may not be a semiconductor substrate. The topmost metal layers, either or both of which may have an insulating layer thereon, are placed in contact and heated in an oxidizing ambient atmosphere to form a bond therebetween. One or more vias connect the buried metal layers to the active devices in the substrates. The buried metal layers may form buried power and ground planes and buried metallization patterns for device interconnection.

公开(公告)号：US4968582A

公开(公告)日：1990-11-06

申请号：US212440

申请日：1988-06-28

申请人： Farid M. Tranjan ,  Thomas D. DuBois ,  Rudolf G. Frieser ,  Stephen M. Bobbio ,  Susan K. S. Jones

发明人： Farid M. Tranjan ,  Thomas D. DuBois ,  Rudolf G. Frieser ,  Stephen M. Bobbio ,  Susan K. S. Jones

IPC分类号： G03F7/004 ,  G03F7/022 ,  G03F7/36 ,  H01L21/027

CPC分类号： G03F7/0226 ,  G03F7/004 ,  G03F7/36 ,  Y10S430/136

摘要： The invention is a modified organic photoresist which is resistant to etching in oxygen-containing plasmas and therefore particularly useful for masking and etching organic polymer materials in VLSI and advanced packaging applications. The invention comprises adding a phosphorous-containing compound to a conventional photoresist. The phosphorous-containing compound is of a type and in an amount effective to substantially prevent etching of the modified photoresist in an oxygen-containing plasma without substantially adversely affecting the photosensitivity of the photoresist or the elasticity or the adhesion of the etch resistant film formed during oxygen-containing plasma exposure to an underlying material to be patterned and etched.

公开(公告)号：US20040228417A1

公开(公告)日：2004-11-18

申请号：US10435047

申请日：2003-05-12

申请人： MCNC Research and Development Institute

发明人： Levi Kennedy ,  Paul Robert Runkle ,  Brett Dean Bradford Guenther

IPC分类号： H04K001/10 ,  H04L027/28 ,  H04B001/10

CPC分类号： H04L25/0236 ,  H04L25/022 ,  H04L25/03159 ,  H04L27/2601

摘要： Adaptive methods and systems for applying a channel correction factor to received signals to correct errors caused by channel distortion. The channel correction factor is dynamically calculated and updated based on the received signal or signals. A receiver continuously calculates an error factor representing a deviation of the received signal from the signal being transmitted, and generates the channel correction factor based on the error factor. Since the error factor includes information related to channel distortions, the channel correction factor so calculated adapts to the change of channel characteristics. If preferred, an advanced algorithm can be used to predict the channel response for the next incoming signal such that the receiver can correct channel errors on a substantially real-time basis.

摘要翻译： 用于将信道校正因子应用于接收信号以校正由信道失真引起的误差的自适应方法和系统。 基于接收的信号或信号动态地计算和更新信道校正因子。 接收机连续计算表示接收信号与被发送信号的偏差的误差因子，并根据误差因子产生信道校正因子。 由于误差因子包括与信道失真有关的信息，因此如此计算的信道校正因子适应于信道特性的变化。 如果优选，则可以使用高级算法来预测下一个输入信号的信道响应，使得接收机可以基本上实时地校正信道错误。

公开(公告)号：US20040071469A1

公开(公告)日：2004-04-15

申请号：US10268424

申请日：2002-10-10

申请人： MCNC

发明人： Ilia Baldine ,  Laura Jackson

IPC分类号： H04J014/02

CPC分类号： H04J14/0227 ,  H04J14/0228 ,  H04J14/0238 ,  H04J14/0282 ,  H04Q11/0062 ,  H04Q11/0066 ,  H04Q11/0067 ,  H04Q2011/0018 ,  H04Q2011/0064 ,  H04Q2011/0086 ,  H04Q2011/0088 ,  H04Q2011/0094

摘要： An optical-inclusive, dWDM local area network and the accompanying signaling protocol necessary to facilitate communication between nodes in a network. This network architecture provides for a packet-oriented network, independent of the number of nodes and the number of supported wavelengths, and provides for scheduled access to the medium, which guarantees higher utilization.

摘要翻译： 一种光学包含的dWDM局域网和伴随的信令协议，以促进网络中节点之间的通信。 该网络架构提供独立于节点数量和支持波长数量的面向分组的网络，并提供对介质的预定访问，这保证了更高的利用率。

公开(公告)号：US20040017644A1

公开(公告)日：2004-01-29

申请号：US10139527

申请日：2002-05-06

申请人： MCNC

发明人： Scott H. Goodwin-Johansson

IPC分类号： H01H051/22

CPC分类号： H01H59/0009 ,  H01H1/06 ,  H01H1/20 ,  H01H2037/008 ,  H01H2059/0081

摘要： A MEMS (Micro Electro Mechanical System) electrostatically operated high voltage switch or relay device is provided. These devices can switch high voltages while using relatively low electrostatic operating voltages. The MEMS device comprises a substrate, a substrate electrode, and one or more substrate contacts. The MEMS device also includes a flexible composite overlying the substrate, one or more composite contacts, and at least one insulator. The switch or relay device is provided overdrive potential through protrusions on the contact surface of the switch or relay contacts. In one embodiment the substrate contacts define protrusions on the contact surface that extend toward the flexible composite contacts. In another embodiment the flexible composite contacts define protrusions on the contact surface that extend toward the substrate contacts.

摘要翻译： 提供了一种MEMS（微机电系统）静电操作的高压开关或继电器。 这些器件可以在使用相对较低的静电工作电压的同时切换高电压。 MEMS器件包括衬底，衬底电极和一个或多个衬底触点。 MEMS器件还包括覆盖衬底，一个或多个复合触点和至少一个绝缘体的柔性复合材料。 开关或继电器装置通过开关或继电器触点的接触表面上的突起提供过驱动电位。 在一个实施例中，基板触点限定了朝向柔性复合触点延伸的接触表面上的凸起。 在另一个实施例中，柔性复合触点限定在接触表面上朝向基板触点延伸的凸起。