公开(公告)号：US09963339B2

公开(公告)日：2018-05-08

申请号：US15452405

申请日：2017-03-07

申请人： Alps Electric Co., Ltd.

发明人： Eiji Umetsu ,  Hisanobu Okawa

IPC分类号： B81B3/00 ,  B81B7/00 ,  G01D5/24 ,  G01D5/16

CPC分类号： B81B3/0021 ,  B81B3/00 ,  B81B3/0018 ,  B81B3/0067 ,  B81B7/0016 ,  B81B7/0048 ,  B81B7/0058 ,  B81B7/007 ,  B81B2201/0264 ,  B81B2203/0127 ,  B81B2203/0163 ,  B81B2207/012 ,  G01D5/16 ,  G01D5/24

摘要： A sensor device includes: a sensor portion having a movable thin film and a detection element configured to output a signal corresponding to displacement of the movable thin film; a frame portion disposed to surround an outside of the sensor portion; a spring portion provided between the frame portion and the sensor portion; and a circuit board including a circuit configured to process the signal output from the detection element, in which the frame portion is laminated on the circuit board, and the sensor portion is cantilevered from the frame portion by the spring portion such that a gap is formed between the sensor portion and the circuit board.

公开(公告)号：US09958348B2

公开(公告)日：2018-05-01

申请号：US15110261

申请日：2014-11-17

申请人： Robert Bosch GmbH

发明人： Johannes Classen ,  Jochen Reinmuth ,  Arnd Kaelberer

IPC分类号： G01L9/00 ,  G01L13/02 ,  G01L19/06 ,  B81B7/00

CPC分类号： G01L9/0041 ,  B81B7/0048 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81B2201/0264 ,  B81B2207/012 ,  G01L9/0073 ,  G01L13/026 ,  G01L19/0636

摘要： A micromechanical pressure sensor device and a corresponding manufacturing method. The micromechanical pressure sensor device includes an ASIC wafer having a front side and a rear side, and a rewiring system, formed on the front side of the ASIC wafer, which includes a plurality of stacked strip conductor levels and insulation layers. The pressure sensor device also includes a MEMS wafer having a front side and a rear side, a first micromechanical functional layer which is formed above the front side of the MEMS wafer, and a second micromechanical functional layer which is formed above the first micromechanical functional layer.

公开(公告)号：US20180047675A1

公开(公告)日：2018-02-15

申请号：US15670868

申请日：2017-08-07

申请人： ANALOG DEVICES, INC.

发明人： Xiaojie Xue ,  Dipak Sengupta

IPC分类号： H01L23/552 ,  H01L23/495 ,  H01L23/043 ,  H01L23/498

CPC分类号： H01L23/552 ,  B81B7/0048 ,  B81B7/007 ,  H01L23/043 ,  H01L23/49503 ,  H01L23/49541 ,  H01L23/49861 ,  H01L23/562 ,  H01L24/16 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/16145 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/45099 ,  H01L2224/48247 ,  H01L2224/73207 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/1433 ,  H01L2924/1461 ,  H01L2924/15159 ,  H01L2924/16251 ,  H01L2924/16315 ,  H01L2924/1632 ,  H01L2924/181 ,  H01L2924/207 ,  H01L2924/00012 ,  H01L2924/00

摘要： An integrated device package is disclosed. The package can include a package substrate comprising a composite die pad having an upper surface and a lower surface spaced from the upper surface along a vertical direction. The composite die pad can include an insulator die pad and a metal die pad. The insulator die pad and the metal die pad can be disposed adjacent one another along the vertical direction. The substrate can include a plurality of leads disposed about at least a portion of a perimeter of the composite die pad. An integrated device die can be mounted on the upper surface of the composite die pad.

公开(公告)号：US20180040514A1

公开(公告)日：2018-02-08

申请号：US15784764

申请日：2017-10-16

申请人： STMicroelectronics Pte Ltd

发明人： Kim-Yong Goh ,  Xueren Zhang ,  Yiyi Ma

IPC分类号： H01L21/78

CPC分类号： H01L21/78 ,  B81B7/0048 ,  H01L23/053 ,  H01L24/13 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/83 ,  H01L27/14618 ,  H01L2224/13101 ,  H01L2224/16225 ,  H01L2224/27013 ,  H01L2224/29101 ,  H01L2224/29198 ,  H01L2224/32058 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2224/83007 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/10157 ,  H01L2924/10158 ,  H01L2924/12042 ,  H01L2924/16151 ,  H01L2924/014

摘要： Embodiments are directed to a package that includes an electric device having a recess. In one embodiment, the electric device is a sensor and the recess reduces signal drift of the sensor caused by thermal expansion of the package. In another embodiment, the recess is substantially filled with adhesive material, thus increasing adhesion between the electric device and a substrate of the package while at the same time allowing for lower adhesive fillets.

公开(公告)号：US20170197823A1

公开(公告)日：2017-07-13

申请号：US15134574

申请日：2016-04-21

申请人： Texas Instruments Incorporated

发明人： Kurt Peter Wachtler ,  Makoto Yoshino ,  Ayumu Kuroda ,  Brian E. Goodlin ,  Karen Kirmse ,  Benjamin Cook ,  Genki Yano ,  Stuart Jacobsen

IPC分类号： B81C1/00 ,  H01L21/02 ,  B81B7/00

CPC分类号： B81B7/0048 ,  B81B7/0054 ,  B81B2207/012 ,  B81B2207/097 ,  B81B2207/99 ,  B81C1/00325 ,  B81C2203/0136 ,  B81C2203/0154 ,  H01L23/3107 ,  H01L23/3135 ,  H01L23/49541 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00

摘要： A packaged micro-electro-mechanical system (MEMS) device (100) comprises a circuitry chip (101) attached to the pad (110) of a substrate with leads (111), and a MEMS (150) vertically attached to the chip surface by a layer (140) of low modulus silicone compound. On the chip surface, the MEMS device is surrounded by a polyimide ring (130) with a surface phobic to silicone compounds. A dome-shaped glob (160) of cured low modulus silicone material covers the MEMS and the MEMS terminal bonding wire spans (180); the glob is restricted to the chip surface area inside the polyimide ring and has a surface non-adhesive to epoxy-based molding compounds. A package (190) of polymeric molding compound encapsulates the vertical assembly of the glob embedding the MEMS, the circuitry chip, and portions of the substrate; the molding compound is non-adhering to the glob surface yet adhering to all other surfaces.

公开(公告)号：US09643837B1

公开(公告)日：2017-05-09

申请号：US15009909

申请日：2016-01-29

申请人： Infineon Technologies AG

发明人： Matthias Friedrich Herrmann

IPC分类号： H01L29/84 ,  H01L23/06 ,  H01L21/00 ,  B81B3/00

CPC分类号： B81B3/0072 ,  B81B7/0048 ,  B81B2201/0264 ,  B81B2207/015 ,  B81B2207/09 ,  B81C1/00309 ,  B81C2203/0721 ,  B81C2203/0735

摘要： A sensor device may include an electronic device that has at least one integrated circuit device and a MEMS sensor that are each monolithically integrated with a semiconductor substrate. The sensor device may include a suspension structure that suspends the MEMS sensor over a back cavity within the semiconductor substrate. The suspension structure may be springs or a spring structure formed from etching the front side of the substrate.

公开(公告)号：US20170113920A1

公开(公告)日：2017-04-27

申请号：US15299600

申请日：2016-10-21

申请人： Robert Bosch GmbH

发明人： Frank Reichenbach ,  Jochen Reinmuth ,  Jens Frey ,  Julia Amthor

IPC分类号： B81B7/00 ,  B81C1/00

CPC分类号： B81B7/0048 ,  B81B7/02 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81C1/00293 ,  B81C1/00325 ,  B81C2201/013 ,  B81C2203/0145

摘要： A method for manufacturing a micromechanical component including a substrate and a cap connected to the substrate and together with the substrate enclosing a first cavity, a first pressure prevailing and a first gas mixture with a first chemical composition being enclosed in the first cavity. An access opening, connecting the first cavity to surroundings of the micromechanical component, is formed in the substrate or the cap. The first pressure and/or the first chemical composition is adjusted in the first cavity. The access opening is sealed by introducing energy and heat into an absorbing part of the substrate or cap with the aid of a laser. A recess is formed in a surface of the substrate or of the cap facing away from the first cavity in the area of the access opening for accommodating a material area of the substrate or the cap converted into a liquid aggregate state.

公开(公告)号：US20170089943A1

公开(公告)日：2017-03-30

申请号：US15210838

申请日：2016-07-14

申请人： Apple Inc.

发明人： Kuan-Lin Chen ,  Yun-Ju Lai

IPC分类号： G01P15/08 ,  G01C19/5783 ,  G01P15/097

CPC分类号： G01P15/0802 ,  B81B7/0048 ,  B81B2201/0235 ,  B81B2201/0242 ,  G01C19/5783 ,  G01P1/003 ,  G01P2015/0882 ,  H01L2224/48091 ,  H01L2924/00014

摘要： Mechanical low pass filters for motion sensors and methods for making the same are disclosed. In an implementation, a motion sensor package comprises: a substrate; one or more viscous dampers formed on the substrate; one or more mechanically compliant metal springs formed on the substrate; and a sensor stack attached to the one or more metal springs, the sensor stack overlying the one or more viscous dampers and forming a gap between the sensor stack and the one or more viscous dampers and channels between the one or more viscous dampers and metal springs, wherein the one or more metal springs and the one or more viscous dampers provide a mechanical suspension system having a resonant frequency that is higher than a sensing bandwidth of a motion sensor in the sensor stack and lower than a resonant frequency of the motion sensor.

公开(公告)号：US20170070825A1

公开(公告)日：2017-03-09

申请号：US15307814

申请日：2015-04-22

申请人： EPCOS AG

发明人： Wolfgang Pahl

IPC分类号： H04R19/04 ,  H04R31/00 ,  B81C1/00 ,  H04R19/00

CPC分类号： H04R19/04 ,  B81B7/0048 ,  B81B2201/0257 ,  B81C1/00134 ,  H04R1/2892 ,  H04R19/005 ,  H04R31/00 ,  H04R2410/03 ,  H04R2499/11

摘要： A microphone and a method for producing a microphone are disclosed. The microphone includes a substrate, a spring element plastically elongated in a direction perpendicular to the substrate, a transducer element in electrical contact with the substrate by way of the spring element and a cover to which the transducer element is fastened, the cover is arranged in such a way that the transducer element is arranged between the cover and the substrate.

摘要翻译： 公开了麦克风和麦克风的制造方法。 麦克风包括基板，沿着垂直于基板的方向塑性伸长的弹簧元件，通过弹簧元件与基板电接触的换能器元件和换能器元件紧固到的盖，盖被布置在 换能器元件布置在盖和基板之间的方式。

公开(公告)号：US20160340176A1

公开(公告)日：2016-11-24

申请号：US14716515

申请日：2015-05-19

申请人： Rosemount Aerospace Inc.

发明人： David P. Potasek ,  Robert Stuelke

IPC分类号： B81B7/00

CPC分类号： B81B7/0058 ,  B81B7/0048 ,  B81B2207/015 ,  H01L2224/48247

摘要： A sensor package includes a manifold and a MEMS die. The manifold includes a cylindrical body, a flange, and a mounting surface. The cylindrical body defines a first passage that extends longitudinally along a central axis from a first exterior end to an interior end of the cylindrical body. The flange extends from the cylindrical body and has an outer periphery that is configured to support a print circuit board. The mounting surface is disposed at the interior end of the first passage. The surface area of the mounting surface is less than the surface area of a MEMS die configured to mate with the mounting surface.

摘要翻译： 传感器封装包括歧管和MEMS管芯。 歧管包括圆柱体，凸缘和安装表面。 圆柱形主体限定第一通道，该第一通道沿着中心轴线从第一外端纵向延伸到圆柱形主体的内端。 凸缘从圆柱体延伸并且具有被配置为支撑印刷电路板的外周边。 安装表面设置在第一通道的内端。 安装表面的表面积小于被配置为与安装表面配合的MEMS管芯的表面积。