利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

3945 条记录 (耗时 0.035 秒)

    Heat sink fin including angular dimples
    71.
    发明授权
    Heat sink fin including angular dimples 有权
    散热片包括角凹坑

    公开(公告)号：US09277679B2

    公开(公告)日：2016-03-01

    申请号：US13207062

    申请日：2011-08-10

    申请人： Yuandong Gu ,  Wei Yang

    发明人： Yuandong Gu ,  Wei Yang

    IPC分类号： F28F7/00 ,  H05K7/20 ,  H01L21/48 ,  H01L23/367 ,  H01L23/467

    CPC分类号： H05K7/20563 ,  H01L21/4878 ,  H01L21/4882 ,  H01L23/3672 ,  H01L23/467 ,  H01L2924/0002 ,  Y10T29/4935 ,  H01L2924/00

    摘要： A heat sink fin that has a first substrate. The first substrate includes a first angular dimple and a first micro air channel in fluid communication with the first angular dimple. The first angular dimple includes a first surface that forms an angle relative to a first plane of the first substrate. The first angular dimple includes a first micro diameter hole in fluid communication with the first angular dimple. The heat sink fin also has a second substrate folded against the first substrate. The second substrate includes a second angular dimple and a second micro air channel in fluid communication with the second angular dimple. The second angular dimple includes a second surface that forms an angle relative to a second plane of the second substrate. The second angular dimple includes a second micro diameter hole in fluid communication with the second angular dimple.

    摘要翻译： 具有第一基板的散热片。 第一衬底包括第一角凹坑和与第一角凹坑流体连通的第一微空气通道。 第一角凹坑包括相对于第一基板的第一平面形成一角度的第一表面。 第一角凹坑包括与第一角凹坑流体连通的第一微孔。 散热鳍片还具有折叠在第一衬底上的第二衬底。 第二基板包括与第二角凹坑流体连通的第二角凹坑和第二微空气通道。 第二角凹坑包括相对于第二基板的第二平面形成一角度的第二表面。 第二角凹坑包括与第二角凹坑流体连通的第二微孔。

    HEAT EXCHANGER BEDS COMPOSED OF THERMOMAGNETIC MATERIAL
    74.
    发明申请
    HEAT EXCHANGER BEDS COMPOSED OF THERMOMAGNETIC MATERIAL 审中-公开
    热交换器组成的热交换器床

    公开(公告)号：US20150330721A1

    公开(公告)日：2015-11-19

    申请号：US14813351

    申请日：2015-07-30

    申请人： BASF SE

    发明人： Colman Carroll ,  Bernard Hendrik Reesink ,  Georg Degen

    IPC分类号： F28F7/00 ,  B23P15/26

    CPC分类号： F28F7/00 ,  B23P15/26 ,  F25B21/00 ,  F25B2321/002 ,  H01F1/015 ,  Y02B30/66 ,  Y10T29/4935 ,  Y10T29/49352

    摘要： Provided is a packed heat exchanger bed composed of thermomagnetic material particles having a mean particle diameter of 50 μm to 1 mm. The packed bed has porosity of 30-45%. A thermomagnetic material is a metal containing material such as (AyB1-y)2+δCwDxEz, La(FexAl1-x)13Hy or La(FexSi1-x)13Hy, La(FexAlyCoz)13 or La(FeSiyCoz)13, LaMnxFe2-xGe, Heusler alloys, Gd5(SixGe1-x)4, Fe2P-based compounds, manganites of the perovskite type, Tb5(Si4-xGex), XTiGe, Mn2-xZxSb, or Mn2ZxSb1-x, wherein A- E, P, and Z represent various metal atoms.

    摘要翻译： 提供一种由平均粒径为50μm〜1mm的热磁性材料颗粒构成的填充式热交换器床。 填充床的孔隙率为30-45％。 热磁性材料是诸如（AyB1-y）2 +δCwDxEz，La（FexAl1-x）13Hy或La（FexSi1-x）13Hy，La（FexAlyCoz）13或La（FeSiyCoz）13，LaMnxFe2-xGe ，Heusler合金，Gd5（SixGe1-x）4，Fe2P基化合物，钙钛矿型锰矿，Tb5（Si4-xGex），XTiGe，Mn2-xZxSb或Mn2ZxSb1-x，其中A- E，P和Z 代表各种金属原子。

    Heat pipe heat dissipation structure
    75.
    发明授权
    Heat pipe heat dissipation structure 有权
    热管散热结构

    公开(公告)号：US09170058B2

    公开(公告)日：2015-10-27

    申请号：US13402472

    申请日：2012-02-22

    申请人： Chun-Ming Wu

    发明人： Chun-Ming Wu

    IPC分类号： F28D15/00 ,  F28F7/00 ,  F28D15/04 ,  F28D15/02

    CPC分类号： F28D15/046 ,  F28D15/0233 ,  F28D15/04

    摘要： A heat pipe heat dissipation structure includes a main body. The main body has an evaporation section, a condensation section, a chamber filled with a working fluid and at least one first capillary structure. The first capillary structure is disposed on an inner wall face of the chamber. The first capillary structure has at least one swelling capillary section. The swelling capillary section swells from a part of the first capillary structure in the evaporation section.

    摘要翻译： 热管散热结构包括主体。 主体具有蒸发部分，冷凝部分，填充有工作流体的腔室和至少一个第一毛细管结构。 第一毛细结构设置在腔室的内壁面上。 第一毛细结构具有至少一个溶胀毛细管部分。 膨胀毛细管部分从蒸发部分中的第一毛细结构的一部分膨胀。

    Fixed bed reactor heat transfer structure
    76.
    发明授权
    Fixed bed reactor heat transfer structure 有权
    固定床反应器传热结构

    公开(公告)号：US09157689B2

    公开(公告)日：2015-10-13

    申请号：US14078040

    申请日：2013-11-12

    申请人： Ceramatec, Inc.

    发明人： Joseph J. Hartvigsen

    IPC分类号： F28F7/00 ,  B01J8/00 ,  B01J8/02 ,  B01J19/00 ,  B01J19/24

    CPC分类号： F28F7/00 ,  B01J8/067 ,  B01J2208/00115 ,  B01J2208/0015 ,  B01J2208/00168 ,  B01J2208/00212 ,  B01J2208/00238 ,  B01J2208/00513 ,  B01J2208/065 ,  B01J2219/30223 ,  B01J2219/30242 ,  B01J2219/30408 ,  B01J2219/30416 ,  F28D2021/0022 ,  F28F1/40

    摘要： An apparatus includes a heat transfer structure configured to be disposed at least partially within an enclosure of a fixed bed reactor and operable to transfer heat from a heat source to a heat sink. The heat transfer structure includes a plurality of fins each fin including a first end and a second end, the first end contacting an inner surface of the enclosure of the fixed bed reactor, the second end at least partially enclosed within the enclosure of the fixed bed reactor. A path of at least one of the plurality of fins comprises the shortest possible length between the first end of the at least one of the plurality of fins and the second end of the at least one of the plurality of fins.

    摘要翻译： 一种装置包括传热结构，其被配置为至少部分地设置在固定床反应器的外壳内并可操作以将热量从热源传递到散热器。 传热结构包括多个翅片，每个翅片包括第一端和第二端，第一端接触固定床反应器的外壳的内表面，第二端至少部分地封闭在固定床的外壳内 反应堆。 所述多个翅片中的至少一个的路径包括所述多个翅片中的所述至少一个翅片的所述第一端与所述多个翅片中的所述至少一个翅片的所述第二端之间的最短可能长度。

    Heat dissipation device assembly structure
    77.
    发明授权
    Heat dissipation device assembly structure 有权
    散热装置组装结构

    公开(公告)号：US09103601B2

    公开(公告)日：2015-08-11

    申请号：US13469735

    申请日：2012-05-11

    申请人： Jin-Hsun Liu ,  Chih-Ming Chen

    发明人： Jin-Hsun Liu ,  Chih-Ming Chen

    IPC分类号： H05K7/20 ,  F28D15/02 ,  H01L23/367 ,  H01L23/427 ,  H01L23/467 ,  F28F7/00

    CPC分类号： F28D15/0275 ,  H01L23/3672 ,  H01L23/427 ,  H01L23/467 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A heat dissipation device assembly structure includes a heat dissipation unit and at least one fastening member. The heat dissipation unit has a bottom face and a locating section. The locating section is formed with at least one channel in communication with the bottom face. The fastening member is assembled on the bottom face. The fastening member has at least one latch section correspondingly inserted in the locating section. The fastening member further has at least one locking section on one side of the fastening member, which side is distal from the bottom face. The fastening member can be quickly assembled with the heat dissipation unit by means of inserting the latch section into the locating section of the heat dissipation unit. The heat dissipation device assembly structure has higher heat dissipation efficiency and is free from welding process so that the welding cost is saved.

    摘要翻译： 散热装置组件结构包括散热单元和至少一个紧固构件。 散热单元具有底面和定位部。 定位部形成有与底面连通的至少一个通道。 紧固构件组装在底面上。 紧固构件具有相应地插入定位部中的至少一个闩锁部分。 紧固构件还具有在紧固构件的一侧上的至少一个锁定部分，该侧面远离底面。 通过将闩锁部插入到散热单元的定位部中，紧固构件能够与散热单元快速组装。 散热装置组装结构具有较高的散热效率，无焊接工艺，节约了焊接成本。

    Method of lowering temperature of substrate table, computer-readable storage medium, and substrate processing system
    79.
    发明授权
    Method of lowering temperature of substrate table, computer-readable storage medium, and substrate processing system 有权
    降低衬底台，计算机可读存储介质和衬底处理系统温度的方法

    公开(公告)号：US09070728B2

    公开(公告)日：2015-06-30

    申请号：US12958955

    申请日：2010-12-02

    申请人： Kenichi Kobayashi ,  Youichi Nakayama ,  Kozo Kai ,  Kenji Shirasaka

    发明人： Kenichi Kobayashi ,  Youichi Nakayama ,  Kozo Kai ,  Kenji Shirasaka

    IPC分类号： F28F7/00 ,  H01L21/677 ,  C23C16/46 ,  H01L21/67

    CPC分类号： H01L21/67745 ,  C23C16/46 ,  H01L21/67103 ,  H01L21/67109

    摘要： A method of lowering a temperature of a substrate table uses a substrate W processing system including a first substrate table 2b; one or more processing chambers 1b, in each of which the first substrate table 2b is disposed, the processing chamber being configured to perform a predetermined process, with the substrate being placed on the first substrate table 2b; a substrate transfer apparatus 31 configured to transfer the substrate to the processing chamber 1b; a transfer chamber in which the substrate transfer apparatus 31 is disposed; and a second substrate table configured to cool the substrate. The method of lowering a temperature of a substrate table comprises the steps of first transfer in which the substrate W placed on the first substrate table 2b is transferred to the second substrate table by the substrate transfer apparatus 31, and second transfer in which the substrate placed on the second substrate table is transferred to the first substrate table 2b. By repeating the step of first transfer and the step of second transfer, a heat of the first substrate table 2b is absorbed by the substrate W placed on the first substrate table 2b, so that a temperature of the first substrate table 2b is lowered.

    摘要翻译： 降低衬底台的温度的方法使用包括第一衬底台2b的衬底W处理系统; 一个或多个处理室1b，其中每个处理室1b设置有第一衬底台2b，处理室被配置为执行预定处理，衬底被放置在第一衬底台2b上; 被配置为将衬底转移到处理室1b的衬底传送装置31; 传送室，其中设置有基板传送装置31; 以及被配置为冷却所述基板的第二基板台。 降低衬底台的温度的方法包括以下步骤：第一转印，其中放置在第一衬底台2b上的衬底W通过衬底转移装置31转移到第二衬底台，第二次转印，其中衬底放置 在第二衬底台上转移到第一衬底台2b。 通过重复第一次转印步骤和第二次转印步骤，第一衬底台2b的热量被放置在第一衬底台2b上的衬底W吸收，使得第一衬底台2b的温度降低。

    Apparatuses and methods for controlling heat for rapid thermal processing of carbonaceous material
    80.
    发明授权
    Apparatuses and methods for controlling heat for rapid thermal processing of carbonaceous material 有权
    用于控制热量以用于碳质材料的快速热处理的装置和方法

    公开(公告)号：US09044727B2

    公开(公告)日：2015-06-02

    申请号：US13240570

    申请日：2011-09-22

    申请人： Sathit Kulprathipanja ,  Paolo Palmas

    发明人： Sathit Kulprathipanja ,  Paolo Palmas

    IPC分类号： C10B51/00 ,  B01J19/00 ,  F28F7/00 ,  B01J8/18 ,  B01J8/26 ,  B01J8/32 ,  B01J8/00 ,  C10B49/22 ,  C10B53/02 ,  F28D7/16 ,  F28F1/14 ,  C10C5/00

    CPC分类号： B01J19/00 ,  B01J8/0055 ,  B01J8/1836 ,  B01J8/26 ,  B01J8/32 ,  B01J2208/00176 ,  B01J2208/00194 ,  B01J2208/00292 ,  B01J2208/00513 ,  C10B49/22 ,  C10B53/02 ,  C10C5/00 ,  F23G2201/304 ,  F23G2203/502 ,  F23G2209/26 ,  F28D7/1615 ,  F28F1/14 ,  F28F7/00 ,  Y02E50/14

    摘要： Embodiments of apparatuses and methods for controlling heat for rapid thermal processing of carbonaceous material are provided herein. The apparatus comprises a reheater for containing a fluidized bubbling bed comprising an oxygen-containing gas, inorganic heat carrier particles, and char and for burning the char into ash to form heated inorganic particles. An inorganic particle cooler is in fluid communication with the reheater to receive a first portion of the heated inorganic particles. The inorganic particle cooler is configured to receive a cooling medium for indirect heat exchange with the first portion of the heated inorganic particles to form first partially-cooled heated inorganic particles that are fluidly communicated to the reheater and combined with a second portion of the heated inorganic particles to form second partially-cooled heated inorganic particles. A reactor is in fluid communication with the reheater to receive the second partially-cooled heated inorganic particles.

    摘要翻译： 本文提供了用于控制用于碳质材料的快速热处理的热量的装置和方法的实施例。 该装置包括一个再热器，用于容纳包含含氧气体，无机热载体颗粒和炭的流化鼓泡床，并用于将炭烧成灰分以形成加热的无机颗粒。 无机颗粒冷却器与再热器流体连通以接收第一部分加热的无机颗粒。 无机颗粒冷却器被配置为接收用于与加热的无机颗粒的第一部分进行间接热交换的冷却介质，以形成第一部分冷却的加热的无机颗粒，其流体连通到再热器并与第二部分加热的无机颗粒 颗粒形成第二部分冷却的加热无机颗粒。 反应器与再热器流体连通以接收第二部分冷却的加热的无机颗粒。