公开(公告)号：US09246203B2

公开(公告)日：2016-01-26

申请号：US14362166

申请日：2012-11-16

申请人： Akira Miyata

发明人： Akira Miyata

IPC分类号： H01P3/02 ,  H01Q1/22 ,  G06K19/077 ,  H01P3/08 ,  G06K7/10 ,  G06K17/00 ,  H04B13/00

CPC分类号： H01P3/02 ,  G06K7/10178 ,  G06K19/0772 ,  H01P3/081 ,  H01Q1/2208

摘要： A communication sheet (100) according to the present invention that transmits an electromagnetic wave for communication, includes a dielectric layer (120) including a dielectric substrate, a first conductor layer (110) including a mesh sheet-like mesh conductor disposed on one surface of the dielectric substrate; and a second conductor layer (130) including a sheet-like conductor disposed on another surface of the dielectric substrate opposite to the first conductor layer (110). The communication sheet (100) is provided which includes an opening whose width in a direction perpendicular to a traveling direction of the electromagnetic wave for communication traveling through the dielectric layer (120) is not less than 1/20 and not greater than ⅗ of a width in the direction perpendicular to the traveling direction of the dielectric substrate, the opening penetrating from the first conductor layer (110) to the second conductor layer.

摘要翻译： 根据本发明的用于通信的电磁波的通信片（100）包括：电介质层（120），包括介电基片;第一导体层（110），包括设置在一个表面上的网状网状导体 的电介质基板; 以及第二导体层（130），其包括布置在与第一导体层（110）相对的电介质基板的另一表面上的片状导体。 通信片（100）设置有开口，该开口的宽度在垂直于通过电介质层（120）行进的连通的电磁波的行进方向的宽度不小于1/20并且不大于 宽度在垂直于电介质基板的行进方向的方向上，该开口从第一导体层（110）穿透到第二导体层。

公开(公告)号：US20150270616A1

公开(公告)日：2015-09-24

申请号：US14217682

申请日：2014-03-18

申请人： Peraso Technologies, Inc.

发明人： Saman Jafarlou ,  Mohammad Fakharzadeh

IPC分类号： H01Q13/02 ,  H01P5/00 ,  H01P11/00 ,  H01P3/02

CPC分类号： H01Q13/02 ,  H01P5/107 ,  H01Q13/0283 ,  Y10T29/49018 ,  Y10T29/49165

摘要： An IC package includes an IC die disposed at a first surface of a substrate, which includes a signal via extending between first and second metal layers. The first metal layer is proximate to the first surface and includes a first coplanar waveguide. The first coplanar waveguide has a first signal line coupling a die bump to the signal via and has a first ground plane co-planar with the first signal line. The second metal layer is proximate to a second surface and includes a second coplanar waveguide that has a second signal line coupling the signal via to a launcher element and has a second ground plane co-planar with the second signal line. The IC package further includes a waveguide channel aperture comprising a region surrounding the launcher element and which is substantially devoid of conductive material and a via fence disposed at a perimeter of the first region.

摘要翻译： IC封装包括设置在基板的第一表面处的IC管芯，其包括在第一和第二金属层之间延伸的信号通路。 第一金属层靠近第一表面并且包括第一共面波导。 第一共面波导具有将管芯凸起与信号通孔相连的第一信号线，并具有与第一信号线共面的第一接地平面。 第二金属层靠近第二表面并且包括第二共面波导，其具有将信号通孔耦合到发射元件的第二信号线，并具有与第二信号线共面的第二接地平面。 IC封装还包括波导沟道孔，该波导通道孔包括围绕发射器元件的区域，并且其基本上不含导电材料，并且布置在第一区域周边的通孔栅栏。

公开(公告)号：US09118097B2

公开(公告)日：2015-08-25

申请号：US13303013

申请日：2011-11-22

申请人： Guang-Hwa Shiue ,  Che-Ming Hsu

发明人： Guang-Hwa Shiue ,  Che-Ming Hsu

IPC分类号： H05K1/02 ,  H01P3/08 ,  H01P3/02

CPC分类号： H01P3/08 ,  H01P3/026 ,  H05K1/0245 ,  H05K1/025

摘要： A differential mode transmission line with a weak coupling structure is presented. The differential mode transmission line with a weak coupling structure includes a first transmission line and a second transmission line. The first transmission line includes a first wiring portion, a second wiring portion, and a third wiring portion. The second transmission line also includes a first wiring portion, a second wiring portion, and a third wiring portion. The wiring portions of the present disclosure are connected through connection portions, and the connection portions are designed as a corner structure. Due to the characteristics of the corner structure of the present disclosure, a pitch between the second wiring portions is greater than that between the first wiring portions or the third wiring portions, thereby generating a weak coupling structure to suppress common mode noises.

摘要翻译： 提出了具有弱耦合结构的差模传输线。 具有弱耦合结构的差模传输线包括第一传输线和第二传输线。 第一传输线包括第一布线部分，第二布线部分和第三布线部分。 第二传输线还包括第一布线部分，第二布线部分和第三布线部分。 本公开的布线部分通过连接部分连接，连接部分被设计成角部结构。 由于本公开的角结构的特征，第二布线部分之间的间距大于第一布线部分或第三布线部分之间的间距，从而产生弱耦合结构以抑制共模噪声。

公开(公告)号：US08981881B2

公开(公告)日：2015-03-17

申请号：US13741730

申请日：2013-01-15

申请人： Fujitsu Limited

发明人： Satoshi Masuda

IPC分类号： H01P1/00 ,  H01P3/02 ,  H01L23/498 ,  H01L23/66 ,  H01L25/065 ,  H01L23/047 ,  H01L25/16 ,  H01L23/15

CPC分类号： H01P3/02 ,  H01L23/047 ,  H01L23/15 ,  H01L23/49822 ,  H01L23/49833 ,  H01L23/66 ,  H01L25/0655 ,  H01L25/162 ,  H01L2223/6644 ,  H01L2223/6683 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2924/19107 ,  H05K1/021 ,  H05K1/0215 ,  H05K1/0243 ,  H05K1/141 ,  H05K3/4697 ,  H05K2201/1056 ,  H01L2924/00014

摘要： A stacked module includes a first multilayer substrate including an opening having a stepwise wall face, and a first transmission line including a first grounding conductor layer, a second multilayer substrate supported on a stepped portion of the stepwise wall face and including a second transmission line including a second grounding conductor layer, a first chip mounted on a bottom of the opening and coupled to a third transmission line provided on the first multilayer substrate, and a second chip mounted on the front face of the second multilayer substrate and coupled to the second transmission line. A face to which the second grounding conductor layer or a fourth grounding conductor layer coupled thereto is exposed is joined to the stepped portion to which the first grounding conductor layer or a third grounding conductor layer coupled thereto is exposed, and the first and second grounding conductor layers are coupled.

摘要翻译： 堆叠模块包括：第一多层基板，包括具有逐步壁面的开口;以及第一传输线，包括第一接地导体层，第二多层基板，支撑在阶梯式壁面的阶梯部分上，并且包括第二传输线， 第二接地导体层，安装在所述开口的底部并且耦合到设置在所述第一多层基板上的第三传输线的第一芯片，以及安装在所述第二多层基板的前表面上并耦合到所述第二传输层的第二芯片 线。 第二接地导体层或耦合到其的第四接地导体层露出的面接合到第一接地导体层或与其耦合的第三接地导体层露出的台阶部分，第一和第二接地导体 层耦合。

公开(公告)号：US20150061795A1

公开(公告)日：2015-03-05

申请号：US14013279

申请日：2013-08-29

申请人： ThinKom Solutions, Inc.

发明人： William MILROY ,  Alan C. LEMONS ,  James SOR

IPC分类号： H01P5/04 ,  H01P3/02 ,  H01P3/00

CPC分类号： H01P3/023 ,  H01P3/00 ,  H01P5/024 ,  H01P5/103 ,  H01P5/12 ,  H01Q13/20 ,  H01Q21/0012 ,  H01Q21/0031

摘要： A radio frequency (RF) device includes an RF transmission line structure having opposing boundary walls with a non-rectilinear form factor, and a feed structure configured to introduce RF energy into an area between the opposing boundary walls to illuminate the RF transmission line structure with the RF energy across the non-rectilinear form factor. The feed structure includes a plurality of traveling-waveguide-fed leaky line-segment structures, each configured to launch the RF energy into the area with a propagation direction having an oblique angle relative to an axis of the line-segment structure.

摘要翻译： 射频（RF）装置包括具有非直线形状因子的相对边界壁的RF传输线结构以及被配置为将RF能量引入相对边界壁之间的区域以将RF传输线结构照射的馈电结构， 射频能量穿过非直线形状因子。 馈送结构包括多个行进波导馈送的泄漏线路段结构，每个结构被配置为将RF能量发射到相对于线段结构的轴线具有倾斜角的传播方向的区域中。

公开(公告)号：US20150048906A1

公开(公告)日：2015-02-19

申请号：US14531058

申请日：2014-11-03

申请人： Murata Manufacturing Co., Ltd.

发明人： Noboru KATO ,  Satoshi ISHINO ,  Jun SASAKI

IPC分类号： H01P3/08 ,  H01P11/00 ,  H01P3/02

CPC分类号： H01P3/08 ,  H01P3/02 ,  H01P3/085 ,  H01P5/028 ,  H01P11/003 ,  H05K1/0219 ,  H05K1/0225 ,  H05K1/0242 ,  H05K1/0253 ,  H05K1/028 ,  H05K1/0393 ,  H05K1/113 ,  H05K1/147 ,  H05K2201/09454 ,  H05K2201/09618 ,  H05K2201/0969 ,  H05K2201/09727 ,  Y10T29/49123

摘要： A high-frequency signal line includes a first base layer having flexibility, a linear signal line provided on the first base layer and including a first line portion having a first width and a second line portion having a second width greater than the first width, and a first reinforcing conductor provided on the first base layer along the first line portion.

摘要翻译： 高频信号线包括具有柔性的第一基底层，设置在第一基底层上的线性信号线，并且包括具有第一宽度的第一线部分和具有大于第一宽度的第二宽度的第二线部分，以及 沿第一线部分设置在第一基底层上的第一加强导体。

公开(公告)号：US20150008996A1

公开(公告)日：2015-01-08

申请号：US14321961

申请日：2014-07-02

申请人： Roke Manor Research Limited

发明人： Michael Jessup ,  Janice Turner

IPC分类号： H01P3/02

CPC分类号： H01P5/103

摘要： A surface wave launcher for launching electromagnetic surface waves, the launcher comprising: a waveguide having a feed end and a launch end; a feed structure coupled to the feed end of the waveguide; wherein the feed structure includes a first conductor; the waveguide comprises a first planar conductive layer having a feed end and a launch end, the feed end being coupled to the first conductor; and the waveguide is arranged to be positioned adjacent a surface suitable for guiding electromagnetic surface waves, wherein the width of the first planar conductive layer tapers from the launch end towards the feed end.

摘要翻译： 一种用于发射电磁表面波的表面波发射器，所述发射器包括：具有馈送端和发射端的波导; 耦合到波导的馈电端的馈电结构; 其中所述进料结构包括第一导体; 波导包括具有馈电端和发射端的第一平面导电层，馈电端耦合到第一导体; 并且波导被布置成邻近适于引导电磁表面波的表面定位，其中第一平面导电层的宽度从发射端朝向馈送端逐渐变细。

公开(公告)号：US20130278348A1

公开(公告)日：2013-10-24

申请号：US13976780

申请日：2011-12-19

申请人： Xiaoning Ye

发明人： Xiaoning Ye

IPC分类号： H01P3/02

CPC分类号： H01P1/227 ,  H01P3/026 ,  H01R13/6471 ,  H04L25/03878 ,  H05K1/0228 ,  H05K1/0245 ,  H05K2201/09236 ,  H05K2201/10189

摘要： Some embodiments include a first differential signal pair and a second differential signal pair. The first and second differential signal pairs are arranged relative to each other in a manner to intentionally reduce or cancel crosstalk introduced by a pinout (for example, a section of a pinout, a socket, a connector, etc.) into at least one of the first differential signal pair and the second differential signal pair. Other embodiments are described and claimed.

摘要翻译： 一些实施例包括第一差分信号对和第二差分信号对。 第一和第二差分信号对以有意地减少或消除引脚（例如，引脚分布，插座，连接器等的一部分）引入的串扰的方式相对于彼此布置成至少一个 第一差分信号对和第二差分信号对。 描述和要求保护其他实施例。

公开(公告)号：US08085110B2

公开(公告)日：2011-12-27

申请号：US12523899

申请日：2008-01-30

申请人： Kiyoharu Seino ,  Masahiko Hunada

发明人： Kiyoharu Seino ,  Masahiko Hunada

IPC分类号： H01P3/02 ,  H03H7/38

CPC分类号： H01P5/02 ,  H01P5/028 ,  H03F1/565 ,  H03F3/60

摘要： Since the loss of the conventional microwave device is large, when this device is applied to the microwave component, there are problems; for example, a low-noise amplifier, the noise figure is degraded, and when applied to a high-output amplifier, output and efficiency may be decreased. In particular, in the high-output amplifier of over 100 W class, heat generation at a capacitor which forms the microwave device increases, which causes a problem that the reliability of the microwave device may be decreased. A structure is formed to include a capacitor loaded between two high impedance lines the length of which has ¼ wavelength in the desired frequency band and the characteristic impedance is higher than 50Ω.

摘要翻译： 由于传统的微波装置的损耗大，所以当将该装置应用于微波部件时，存在问题; 例如，低噪声放大器，噪声系数降低，并且当应用于高输出放大器时，可以降低输出和效率。 特别地，在100W以上的高输出放大器中，形成微波装置的电容器的发热增加，导致微波器件的可靠性降低的问题。 一种结构被形成为包括负载在两个高阻抗线之间的电容器，其长度在期望频带中具有1/4波长，并且特征阻抗高于50Ω。

公开(公告)号：US20110210803A1

公开(公告)日：2011-09-01

申请号：US12817193

申请日：2010-06-17

申请人： GUANG-FENG OU

发明人： GUANG-FENG OU

IPC分类号： H01P3/02

CPC分类号： H05K1/0248 ,  H05K1/0243 ,  H05K1/0245 ,  H05K2201/09263 ,  H05K2201/09272

摘要： A differential circuit includes a chip with two terminals in two directions, a first differential signal trace, and a second differential signal trace. The first differential signal trace includes a first parallel section and a first unparallel section connecting the first parallel section to a terminal of the chip. The second differential signal trace includes a second parallel section parallel to the first parallel section, a second unparallel section connecting to the second parallel section, and an equalizing section connecting second unparallel section to the another terminal of the chip. The second parallel section is equal to the first parallel section. The total length of the second unparallel section and the equalizing section is equal to the length of the first unparallel section.

摘要翻译： 差分电路包括在两个方向上具有两个端子的芯片，第一差分信号迹线和第二差分信号迹线。 第一差分信号迹线包括将第一并联部分连接到芯片的端子的第一并联部分和第一不平行部分。 第二差分信号迹线包括平行于第一并联部分的第二并联部分，连接到第二平行部分的第二不平行部分和将第二不平行部分连接到芯片的另一端子的均衡部分。 第二平行段等于第一平行段。 第二不平行部分和均衡部分的总长度等于第一不平行部分的长度。