摘要:
A method of forming a SiGe layer having a relatively high Ge content includes preparing a silicon substrate; depositing a layer of strained SiGe to a thickness of between about 100 nm to 500 nm, wherein the Ge content of the SiGe layer is equal to or greater than 20%, by molecular weight; implanting H2+ ions into the SiGe layer; irradiating the substrate and SiGe layer, to relax the SiGe layer; and depositing a layer of tensile-strained silicon on the relaxed SiGe layer to a thickness of between about 5 nm to 30 nm.
摘要:
A method of fabricating a Si1−XGeX film on a silicon substrate includes preparing a silicon substrate; epitaxially depositing a Si1−XGeX layer on the silicon substrate forming a Si1−XGeX/Si interface there between; amorphizing the Si1−XGeX layer at a temperature greater than Tc to form an amorphous, graded SiGe layer; and annealing the structure at a temperature of between about 650° C. to 1100° C. for between about ten seconds and sixty minutes to recrystallize the SiGe layer.
摘要:
A method of forming a multi-layered, spin-coated perovskite thin film on a wafer includes preparing a perovskite precursor solution including mixing solid precursor material into acetic acid forming a mixed solution; heating the mixed solution in air for between about one hour to six hours; and filtering the solution when cooled; placing a wafer in a spin-coating mechanism; spinning the wafer at a speed of between about 500 rpm to 3500 rpm; injecting the precursor solution onto the wafer surface; baking the coated wafer at a temperature of between about 100° C. to 300° C.; annealing the coated wafer at a temperature of between about 400° C. to 650° C. in an oxygen atmosphere for between about two minutes to ten minutes; repeating the spinning, injecting, baking and annealing steps until a perovskite thin film of desired thickness is obtained; and annealing the perovskite thin film at a temperature of between about 500° C. to 750° C. in an oxygen atmosphere for between about ten minutes to two hours.
摘要:
A method of forming a semiconductor structure having a ferroelectric memory (FEM) gate unit on a silicon substrate includes implanting doping impurities of a first type into the substrate to form a conductive channel of a first type, implanting doping impurities of a second type in the conductive channel of the first type to form a conductive channel well of a second type, implanting doping impurities of a third type in the conductive channel well of the second type to form a conductive channel of a third type for use as a gate junction region, implanting doping impurities of a fourth type in the conductive channel sub-well of the third type on either side of the gate junction region to form plural conductive channels of a fourth type for use as a source junction region and a drain junction region; and depositing an FEM gate unit over the gate junction region. A ferroelectric memory cell includes a silicon substrate of a first conductive type, a well structure of a second conductive type formed in the substrate, a structure of a third conductive type formed in the well structure, for use as a gate junction region. A source junction region and a drain junction region are located in the sub-well on either side of the gate junction region, doped to form conductive channels of a fourth type. A FEM gate unit overlays the conductive channel of the third type. An insulating layer overlays the junction regions, the FEM gate unit and the substrate. Suitable electrodes are connected to the various active regions in the memory cell.
摘要:
A MOS transistor having a multilevel gate oxide layer is provided for use in an ESD protection circuit. A thick gate oxide layer near the drain insures that the transistor has a relatively large drain to gate breakdown voltage. A thin gate oxide layer near the source permits the gate voltage to turn the transistor on and off with rapid switching speeds. The thick portion of the MOS transistor multilevel gate oxide layer is formed with a local oxidation of silicon (LOCOS) process, while the thin gate layer is formed in a separate step. An ESD protection circuit and method for fabricating the above-mentioned multilevel gate oxide layer MOS transistor are also provided.
摘要:
A transition metal hexacyanoferrate (TMH) cathode battery is provided. The battery has a AxMn[Fe(CN)6]y.zH2O cathode, where the A cations are either alkali or alkaline-earth cations, such as sodium or potassium, where x is in the range of 1 to 2, where y is in the range of 0.5 to 1, and where z is in the range of 0 to 3.5. The AxMn[Fe(CN)6]y.zH2O has a rhombohedral crystal structure with Mn2+/3+ and Fe2+3+ having the same reduction/oxidation potential. The battery also has an electrolyte, and anode made of an A metal, an A composite, or a material that can host A atoms. The battery has a single plateau charging curve, where a single plateau charging curve is defined as a constant charging voltage slope between 15% and 85% battery charge capacity. Fabrication methods are also provided.
摘要:
A structure of intimately contacting carbon-hexacyanometallate is provided for forming a metal-ion battery electrode. Several methods are provided for forming the carbon-hexacyanometallate intimate contact. These methods include (1) adding conducting carbon during the synthesis of hexacyanometallate and forming the carbon-hexacyanometallate powder prior to forming the paste for electrode printing; (2) coating with conducting carbon after hexacyanometallate powder formation and prior to forming the paste for electrode printing; and (3) coating a layer of conducting carbon over the hexacyanometallate electrode.
摘要:
A three-terminal light emitting device (LED) chip, associated fabrication method, and LED array are provided. The method forms an n-doped semiconductor layer overlying a substrate, an active semiconductor layer overlying the n-doped semiconductor layer, and a p-doped semiconductor layer overlying the active semiconductor layer. A trench is formed through the p-doped and active semiconductor layers, exposing the n-doped semiconductor layer. In one aspect, the trench is formed at least part way, but not completely, through the n-doped semiconductor layer. Then, an LED P electrode is formed overlying a first region of the p-doped semiconductor layer, a diode P electrode is formed overlying a second region of the p-doped semiconductor layer that is separated from the first region of the p-doped semiconductor layer by the trench, and an N electrode is formed overlying a top surface of the exposed n-doped semiconductor layer in the trench, shared by the LED and diode.
摘要:
A method is provided for forming a solution-processed metal and mixed-metal selenide semiconductor using selenium (Se) nanoparticles (NPs). The method forms a first solution including SeNPs dispersed in a solvent. Added to the first solution is a second solution including a first material set of metal salts, metal complexes, or combinations thereof, which are dissolved in a solvent, forming a third solution. The third solution is deposited on a conductive substrate, forming a first intermediate film comprising metal precursors, from corresponding members of the first material set, and embedded SeNPs. As a result of thermally annealing, the metal precursors are transformed and the first intermediate film is selenized, forming a first metal selenide-containing semiconductor. In one aspect, the first solution further comprises ligands for the stabilization of SeNPs, which are liberated during thermal annealing. In another aspect, the metal selenide-containing semiconductor comprises copper, indium, gallium diselenide (CIGS).
摘要:
A battery is provided with an associated method for transporting metal-ions in the battery using a low temperature molten salt (LTMS). The battery comprises an anode, a cathode formed from a LTMS having a liquid phase at a temperature of less than 150° C., a current collector submerged in the LTMS, and a metal-ion permeable separator interposed between the LTMS and the anode. The method transports metal-ions from the separator to the current collector in response to the LTMS acting simultaneously as a cathode and an electrolyte. More explicitly, metal-ions are transported from the separator to the current collector by creating a liquid flow of LTMS interacting with the current collector and separator.