Abstract:
Provided is a method of assigning a physical layer cell identity (PCI) to a femtocell base station. The method includes obtaining location information from a femtocell base station and storing the location information, a first step of determining whether a PCI does not collide and is not confused with PCIs of base stations present in an area having a radius of a first multiple of a the femtocell radius and a second step of determining whether a PCI does not collide and is not confused with PCIs of base stations present in an area having a radius of a second multiple of the femtocell radius when a PCI does not collide and is not confused with PCIs of base stations is not found in an area having a radius of a first multiple of the femtocell radius.
Abstract:
An LED package includes a body; a first lead frame having a first cavity in the body; a second lead frame having a second cavity in the body; a first bonding part protruding into a region between a first lateral side of the body and the first cavity from the first lead frame; a second bonding part protruding into a region between a second lateral side of the body, and the second cavity from the second lead frame; a first LED in the first cavity; a second LED in the second cavity; a third lead frame disposed between the first lateral side and the first cavity; a fourth lead frame disposed between the second lateral side and the second cavity; a first protective device on one of the third lead frame and the first bonding part; and a second protective device on one of the fourth lead frame and the second bonding part.
Abstract:
A deposition mask includes a mask main body and a coating layer. The mask main body includes a plurality of slits penetrating the mask main body. The coating layer is coated on an entire surface of the mask main body. The coating layer is made of a material different from a material of the main body, and it has a magnetic force stronger than that of the main body. Each of the slits has an open area, and a thickness of the coating layer controls a width of the open area. A photolithography process is used to form the plurality of slits.
Abstract:
A pedal force adjusting apparatus for an accelerator pedal regulates a resilient force of a resilient member through movement of an upper carrier and a lower carrier due to rotation of a lead screw. Accordingly, a pedal force of a pedal arm can be easily regulated if necessary.
Abstract:
A system for detecting and diagnosing a faultive state of an airplane engine, including: at least one vibration sensor attached to an airplane; a reference model database construction unit; and a fault detection and diagnosis unit which estimates a parameter of a model, obtains a test variable and a numerator coefficient value difference of a transfer function between the models, and the covariance of parameter estimation error, and diagnoses the faultive state and the faultive cause of the airplane engine. Accordingly, the present invention can determine the faultive state and the detective cause of the airplane engine using the vibration data of the airplane engine.
Abstract:
Disclosed are a method and apparatus for recommending personalized content in an Internet Protocol Television (IPTV) service environment. The content recommending method includes: acquiring a user's viewing history information regarding broadcasting content; analyzing the user's preference for each content item based on the user's viewing history information; creating a list of recommended content items based on the analysis of the user's preference; and providing the list of recommended content items to the user's terminal. Accordingly, it is possible to recommend personalized content according to users' preference.
Abstract:
A wafer inspection apparatus that performs surface inspection and internal inspection of solar cells using a single apparatus. The wafer inspection apparatus includes a loading unit configured to allow a cassette to be lifted up or lowered by an elevator. A surface inspection unit includes a plurality of stages, thus performing surface inspection of each wafer using a first vision module. A wafer transfer unit has a rotatably installed center portion and has both ends provided with adsorption parts. An internal inspection unit is configured such that a conveyor is installed to allow the wafer to be transferred, thus performing internal inspection of the transferred wafer through a second vision module. An unloading unit enables wafers having completed the internal inspection to be sequentially loaded onto the unloading unit. A control unit controls a series of wafer inspection procedures.
Abstract:
Disclosed are a wing assembly including a wing movably accommodated in a launch tube, and a buffer unit detachably mounted to the wing to come in contact with the launch tube and configured to be separated from the wing after the wing comes out of an inner space of the launch tube, and an apparatus for launching a flying object having the same.
Abstract:
An organic light emitting diode (OLED) display device and a method of fabricating the same are provided. The OLED display device includes a substrate having a thin film transistor region and a capacitor region, a buffer layer disposed on the substrate, a gate insulating layer disposed on the substrate, a lower capacitor electrode disposed on the gate insulating layer in the capacitor region, an interlayer insulating layer disposed on the substrate, and an upper capacitor electrode disposed on the interlayer insulating layer and facing the lower capacitor electrode, wherein regions of each of the buffer layer, the gate insulating layer, the interlayer insulating layer, the lower capacitor electrode, and the upper capacitor electrode have surfaces in which protrusions having the same shape as grain boundaries of the semiconductor layer are formed. The resultant capacitor has an increased surface area, and therefore, an increased capacitance.
Abstract:
A first semiconductor chip having a first projection electrode formed on an upper surface thereof is prepared. A second semiconductor chip having a second projection electrode is mounted on the first semiconductor chip to expose the first projection electrode. An insulating film is formed between the first projection electrode and the second projection electrode. A groove is formed in the insulating film. An interconnection configured to fill an inside of the groove and connected to the first projection electrode and the second projection electrode is formed.