公开(公告)号：US11815823B2

公开(公告)日：2023-11-14

申请号：US17947841

申请日：2022-09-19

Applicant: Applied Materials, Inc.

Inventor： Yongan Xu ,  Ludovic Godet

IPC: G03F9/00 ,  G03F7/00

CPC classification number: G03F9/7088 ,  G03F7/70775

Abstract: A method for aligning a substrate for fabrication of an optical device is disclosed that includes receiving a substrate having a first side and a second side opposite the first side, the first side of the substrate being oriented towards a scanner, the substrate having an alignment mark formed on the first side of the substrate, scanning the alignment mark with the scanner, and fabricating a first pattern for a first optical device on the first side of the substrate. The method includes positioning the substrate such that the second side is oriented toward the scanner, scanning the alignment mark on the first side with the scanner, through the second side, and fabricating a second pattern for a fourth optical device on the second side of the substrate.

公开(公告)号：US11739418B2

公开(公告)日：2023-08-29

申请号：US16823182

申请日：2020-03-18

Applicant: Applied Materials, Inc

Inventor： Mingwei Zhu ,  Zihao Yang ,  Nag B. Patibandla ,  Ludovic Godet ,  Yong Cao ,  Daniel Lee Diehl ,  Zhebo Chen

IPC: C23C14/34 ,  C23C14/56 ,  C23C14/06 ,  H01J37/34

CPC classification number: C23C14/564 ,  C23C14/0641 ,  C23C14/34 ,  H01J37/3405 ,  H01J37/3441 ,  H01J37/3464 ,  H01J2237/24514

Abstract: A structure including a metal nitride layer is formed on a workpiece by pre-conditioning a chamber that includes a metal target by flowing nitrogen gas and an inert gas at a first flow rate ratio into the chamber and igniting a plasma in the chamber before placing the workpiece in the chamber, evacuating the chamber after the preconditioning, placing the workpiece on a workpiece support in the chamber after the preconditioning, and performing physical vapor deposition of a metal nitride layer on the workpiece in the chamber by flowing nitrogen gas and the inert gas at a second flow rate ratio into the chamber and igniting a plasma in the chamber. The second flow rate ratio is less than the first flow rate ratio.

公开(公告)号：US11735420B2

公开(公告)日：2023-08-22

申请号：US17014975

申请日：2020-09-08

Applicant: Applied Materials, Inc.

Inventor： Chang Ke ,  Lei Zhou ,  Biao Liu ,  Cheng Pan ,  Yuanhong Guo ,  Liqi Wu ,  Michael S. Jackson ,  Ludovic Godet ,  Tobin Kaufman-Osborn ,  Erica Chen ,  Paul F. Ma

IPC: H01L21/027 ,  H01L21/02 ,  H01L21/67 ,  H01L21/3105 ,  H01L21/683 ,  H01L21/32

CPC classification number: H01L21/0271 ,  H01L21/0206 ,  H01L21/0228 ,  H01L21/02057 ,  H01L21/02181 ,  H01L21/02266 ,  H01L21/02274 ,  H01L21/02334 ,  H01L21/3105 ,  H01L21/67207 ,  H01L21/32 ,  H01L21/6831

Abstract: Methods of depositing a film selectively onto a first material relative to a second material are described. The substrate is pre-cleaned by heating the substrate to a first temperature, cleaning contaminants from the substrate and activating the first surface to promote formation of a self-assembled monolayer (SAM) on the first material. A SAM is formed on the first material by repeated cycles of SAM molecule exposure, heating and reactivation of the first material. A final exposure to the SAM molecules is performed prior to selectively depositing a film on the second material. Apparatus to perform the selective deposition are also described.

公开(公告)号：US11581189B2

公开(公告)日：2023-02-14

申请号：US17344700

申请日：2021-06-10

Applicant: Applied Materials, Inc.

Inventor： Ludovic Godet ,  Rutger Meyer Timmerman Thijssen

IPC: H01L21/304 ,  H01L21/308 ,  H01L21/263 ,  H01L21/3065

Abstract: Embodiments described herein relate to methods forming optical device structures. One embodiment of the method includes exposing a substrate to ions at an ion angle relative to a surface normal of a surface of the substrate to form an initial depth of a plurality of depths. A patterned mask is disposed over the substrate and includes two or more projections defining exposed portions of the substrate or a device layer disposed on the substrate. Each projection has a trailing edge at a bottom surface contacting the device layer, a leading edge at a top surface of each projection, and a height from the top surface to the device layer. Exposing the substrate to ions at the ion angle is repeated to form at least one subsequent depth of the plurality of depths.

公开(公告)号：US11462386B2

公开(公告)日：2022-10-04

申请号：US16716965

申请日：2019-12-17

Applicant: Applied Materials, Inc.

Inventor： Kartik Ramaswamy ,  Yang Yang ,  Manivannan Thothadri ,  Chien-An Chen ,  Ludovic Godet ,  Rutger Meyer Timmerman Thijssen

IPC: H01J37/305 ,  H01J37/32 ,  G02B6/13 ,  H01L21/3065 ,  G02B5/18 ,  H01J37/05 ,  G02B6/12 ,  G02B6/124 ,  G06T19/00 ,  H01J37/073 ,  H01J37/304 ,  H01J37/147

Abstract: Aspects of the disclosure relate to apparatus for the fabrication of waveguides. In one example, an angled ion source is utilized to project ions toward a substrate to form a waveguide which includes angled gratings. In another example, an angled electron beam source is utilized to project electrons toward a substrate to form a waveguide which includes angled gratings. Further aspects of the disclosure provide for methods of forming angled gratings on waveguides utilizing an angled ion beam source and an angled electron beam source.

公开(公告)号：US20220305588A1

公开(公告)日：2022-09-29

申请号：US17655629

申请日：2022-03-21

Applicant: Applied Materials, Inc.

Inventor： Wei-Sheng LEI ,  Mahendran Chidambaram ,  Kangkang Wang ,  Ludovic Godet ,  Visweswaren Sivaramakrishnan

IPC: B23K26/364 ,  B23K26/40 ,  B23K26/38

Abstract: Embodiments of the present disclosure relate to methods for dicing one or more optical devices from a substrate with a laser machining system. The laser machining system utilizes a laser to perform methods for dicing one or more optical devices from a substrate along a dicing path. The methods use one of forming a plurality of laser spots along the dicing path or forming a plurality of trenches along the dicing path.

公开(公告)号：US11430634B2

公开(公告)日：2022-08-30

申请号：US17080802

申请日：2020-10-26

Applicant: Applied Materials, Inc.

Inventor： Ludovic Godet ,  Rutger Meyer Timmerman Thijssen ,  Kartik Ramaswamy ,  Yang Yang ,  Manivannan Thothadri ,  Chien-An Chen

IPC: H01J37/305 ,  H01J37/32 ,  G02B6/13 ,  H01L21/3065 ,  G02B5/18 ,  H01J37/05 ,  G02B6/12 ,  G02B6/124 ,  G06T19/00 ,  H01J37/073 ,  H01J37/304 ,  H01J37/147

Abstract: Aspects of the disclosure relate to apparatus for the fabrication of waveguides. In one example, an angled ion source is utilized to project ions toward a substrate to form a waveguide which includes angled gratings. In another example, an angled electron beam source is utilized to project electrons toward a substrate to form a waveguide which includes angled gratings. Further aspects of the disclosure provide for methods of forming angled gratings on waveguides utilizing an angled ion beam source and an angled electron beam source.

公开(公告)号：US11333896B2

公开(公告)日：2022-05-17

申请号：US16454642

申请日：2019-06-27

Applicant: Applied Materials, Inc.

Inventor： Ludovic Godet ,  Wayne McMillan ,  Rutger Meyer Timmerman Thijssen

IPC: G02B27/09 ,  G02B5/18 ,  G03F1/80 ,  G03F7/00

Abstract: The systems and methods discussed herein are for the fabrication of diffraction gratings, such as those gratings used in waveguide combiners. The waveguide combiners discussed herein are fabricated using nanoimprint lithography (NIL) of high-index and low-index materials in combination with and directional etching high-index and low-index materials. The waveguide combiners can be additionally or alternatively formed by the directional etching of transparent substrates. The waveguide combiners that include diffraction gratings discussed herein can be formed directly on permanent transparent substrates. In other examples, the diffraction gratings can be formed on temporary substrates and transferred to a permanent, transparent substrate.

公开(公告)号：US20220091314A1

公开(公告)日：2022-03-24

申请号：US17448619

申请日：2021-09-23

Applicant: Applied Materials, Inc.

Inventor： Kang Luo ,  Xiaopei Deng ,  Daihua Zhang ,  Ludovic Godet

IPC: G02B5/18 ,  G03F7/00 ,  G03F7/16

Abstract: Embodiments of the present disclosure generally relate to optical devices. More specifically, embodiments described herein relate to optical devices and methods of manufacturing optical devices having optical device structures with at least one of varying depths or refractive indices across the surface of a substrate. According to certain embodiments, an inkjet process is used to deposit a volumetrically variable optical device that is etched to form a diffractive optic element (DOE). Volumetrically variable can relate to the thickness of the optical device, or the relative volume of two or more diffractive materials deposited in combination. According to other embodiments, a single-profile DOE is deposited on a substrate and an inkjet process deposits a volumetrically variable organic material over the DOE. The DOE and organic material are etched to modify the profile of the structure, after which the organic material is removed, leaving the modified-profile DOE.

公开(公告)号：US11205978B2

公开(公告)日：2021-12-21

申请号：US16713744

申请日：2019-12-13

Applicant: Applied Materials, Inc.

Inventor： Wayne McMillan ,  Visweswaren Sivaramakrishnan ,  Joseph C. Olson ,  Ludovic Godet ,  Rutger Meyer Timmerman Thijssen ,  Naamah Argaman

IPC: H02N13/00 ,  C23F1/00 ,  G02B6/34 ,  H01L21/683 ,  C23C16/453 ,  H05H1/24 ,  H01L21/265

Abstract: Embodiments of the present disclosure generally relate to substrate support assemblies for retaining a surface of a substrate having one or more devices disposed on the surface without contacting the one or more devices and deforming the substrate, and a system having the same. In one embodiment, the substrate support assembly includes an edge ring coupled to a body of the substrate support assembly. A controller is coupled to actuated mechanisms of a plurality of pixels coupled to the body of the substrate support assembly such that portions of pixels corresponding to a portion of the surface of a substrate to be retained are positioned to support the portion without contacting one or more devices disposed on the surface of the substrate to be retained on the support surface.