公开(公告)号：US06821485B2

公开(公告)日：2004-11-23

申请号：US10071846

申请日：2002-02-08

Applicant: David J. Beebe ,  Jeffrey S. Moore ,  Bin Zhao

Inventor： David J. Beebe ,  Jeffrey S. Moore ,  Bin Zhao

IPC: B01L302

CPC classification number: B82Y30/00 ,  B01L3/5027 ,  B01L3/502707 ,  B01L2300/089 ,  B01L2400/0672 ,  Y10T436/11 ,  Y10T436/117497 ,  Y10T436/118339 ,  Y10T436/2575

Abstract: A flow of liquids is carried out on a microscale utilizing surface effects to guide the liquid on flow paths to maintain laminar flow. No sidewall confining structure is required, minimizing resistance to flow and allowing laminar flow to be maintained at high flow rates. The guiding structure has flow guiding stripes formed on one or both of facing base and cover surfaces which are wettable by a selected liquid to direct the liquid from a source location to a destination location. The regions adjacent to the guiding stripes on the base and cover surfaces are non-wettable. The smooth interface between the gas and liquid along the flowing stream allows gas-liquid reactions to take place as a function of diffusion across the interface without mixing of the gas and liquid. Liquid-liquid flows may also be guided with such structures.

Abstract translation: 使用表面效应在微尺度上进行液体流动以将液体引导到流动路径上以保持层流。 不需要侧壁约束结构，使流动阻力最小化，并允许层流维持在高流速。 引导结构具有形成在一个或两个相对的基底和盖表面上的流动引导条纹，其可被选定的液体润湿以将液体从源位置引导到目的地位置。 在基部和盖表面上与引导条相邻的区域是不可润湿的。 沿着流动流动的气体和液体之间的平滑界面允许气 - 液反应作为扩散跨越界面而发生，而不会混合气体和液体。 液 - 液流也可以用这种结构引导。

公开(公告)号：US06740985B1

公开(公告)日：2004-05-25

申请号：US09716350

申请日：2000-11-20

Applicant: Bin Zhao

Inventor： Bin Zhao

IPC: H01L2348

CPC classification number: H01L24/05 ,  H01L24/03 ,  H01L2224/02166 ,  H01L2224/04042 ,  H01L2224/05093 ,  H01L2224/05556 ,  H01L2224/05647 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48647 ,  H01L2224/48747 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01063 ,  H01L2924/01068 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01084 ,  H01L2924/04953 ,  H01L2924/05042 ,  H01L2924/14 ,  H01L2924/30105 ,  H01L2924/00

Abstract: A copper bonding pad is directly supported by a copper via pad structure, the copper via pad structure having substantially the same geometry and dimensions as the copper bonding pad. The combination of the copper bonding pad and the copper via pad structure results in an increase in effective thickness of the copper bonding pad. Due to this effective increase in the bonding pad thickness, the bonding pad is more tolerant to the potential dishing problem caused by the CMP process. Additional metal pad structures and via pad structures are used below the bonding pad. The additional metal pad structures and via pad structures comprise alternating segments of interconnect metal and dielectric fillers, and alternating segments of via metal and dielectric fillers, respectively. The alternating segments of interconnect metal and dielectric fillers and the alternating segments of via metal and dielectric fillers prevent or reduce the potential dishing problem that otherwise exists in damascene and CMP processing. The alternating segments of interconnect metal and dielectric fillers and the alternating segments of via metal and dielectric fillers are arranged such that there are a number of columns of solid metal support under the bonding pad. The columns of solid metal support significantly improve the poor mechanical support otherwise provided by the low dielectric constant materials that are presently used in fabrication of modern copper integrated circuits. The columns of solid metal support also improve thermal conductivity of the bonding pad.

Abstract translation: 铜焊盘由铜通孔焊盘结构直接支撑，铜通孔焊盘结构具有与铜焊盘基本上相同的几何形状和尺寸。 铜焊盘和铜通孔焊盘结构的组合导致铜焊盘的有效厚度的增加。 由于焊盘厚度的这种有效增加，焊盘更能承受由CMP工艺引起的潜在的凹陷问题。 在焊盘下面使用附加的金属焊盘结构和通孔焊盘结构。 附加的金属焊盘结构和通孔焊盘结构分别包括互连金属和介电填料的交替段，以及通孔金属和电介质填料的交替段。 互连金属和电介质填料的交替段和通孔金属和电介质填料的交替段防止或减少在镶嵌和CMP加工中存在的潜在凹陷问题。 互连金属和电介质填料的交替段和通孔金属和电介质填料的交替段布置成使得在接合焊盘下方有许多固体金属支撑柱。 固体金属载体的柱显着地改善了目前用于制造现代铜集成电路的低介电常数材料提供的差的机械支撑。 固体金属载体的柱也提高了焊盘的导热性。

公开(公告)号：US06684006B2

公开(公告)日：2004-01-27

申请号：US10021472

申请日：2001-12-07

Applicant: Bin Zhao

Inventor： Bin Zhao

IPC: G02B628

CPC classification number: G02B6/2938 ,  G02B6/29353 ,  G02B6/29355 ,  G02B6/29386 ,  H04J14/02

Abstract: A dispersion mitigating interleaver assembly has a first unbalanced Mach-Zehnder interferometer (MZI) assembly which includes first and second output ports and which has first transmission vs. wavelength curve and a first dispersion vs. wavelength curve. The dispersion mitigating interleaver assembly also includes a second unbalanced MZI assembly which has a second transmission vs. wavelength curve and a second dispersion vs. wavelength curve. The second unbalanced MZI assembly receives an output from one of the first and second output ports of the first unbalanced MZI assembly. The second transmission vs. wavelength curve is substantially the same as the first transmission vs. wavelength curve and the second dispersion vs. wavelength curve is substantially opposite with respect to the first dispersion vs. wavelength curve, such that dispersion is substantially cancelled by the cooperation of the first and second unbalanced MZI assemblies.

Abstract translation: 分散减轻交错器组件具有第一不平衡马赫 - 曾德干涉仪（MZI）组件，其包括第一和第二输出端口，并且具有第一透射与波长曲线以及第一色散与波长曲线。 色散减轻交错器组件还包括第二不平衡MZI组件，其具有第二透射与波长曲线和第二色散相对于波长曲线。 第二不平衡MZI组件从第一不平衡MZI组件的第一和第二输出端口之一接收输出。 第二透射率与波长曲线基本上与第一透射率相对于波长曲线相同，并且第二色散对波长曲线相对于第一色散相对于波长曲线基本相反，使得色散基本上被合作消除 的第一和第二不平衡MZI组件。

公开(公告)号：US06639707B2

公开(公告)日：2003-10-28

申请号：US10016362

申请日：2001-11-30

Applicant: Bin Zhao

Inventor： Bin Zhao

IPC: G02F103

CPC classification number: G02B6/29302 ,  G02B6/272 ,  G02B6/2766 ,  G02B6/2773 ,  G02B6/29386

Abstract: A low dispersion comb filter or interleaver comprises a first birefringent element assembly having at least one birefringent element and a second birefringent element assembly having at least one other birefringent element. The first birefringent element assembly and the second birefringent element assembly are configured so as to cooperate with one another in a manner which mitigates dispersion of the interleaver. By aligning the polarization directions of the odd channels and the even channels so as to be parallel with respect to one another prior to entering the second birefringent element assembly, zero or nearly zero dispersion is obtained simultaneously for both the odd and even channels.

Abstract translation: 低色散梳状滤波器或交织器包括具有至少一个双折射元件的第一双折射元件组件和具有至少一个其它双折射元件的第二双折射元件组件。 第一双折射元件组件和第二双折射元件组件被配置为以减轻交错器的色散的方式彼此协作。 通过使奇数通道和偶数通道的偏振方向在进入第二双折射元件组件之前相对彼此平行对准，对奇数和偶数通道同时获得零或接近零的色散。

公开(公告)号：US06396122B1

公开(公告)日：2002-05-28

申请号：US09658483

申请日：2000-09-08

Applicant: David Howard ,  Bin Zhao ,  Q. Z. Liu

Inventor： David Howard ,  Bin Zhao ,  Q. Z. Liu

IPC: H01L2900

CPC classification number: H01L28/10 ,  H01L27/08

Abstract: According to various disclosed embodiments, a conductor is patterned in a dielectric. The conductor can be patterned, for example, in the shape of a square spiral. The conductor can comprise, for example, copper, aluminum, or copper-aluminum alloy. The dielectric can be, for example, silicon oxide or a low-k dielectric. A spin-on matrix containing high permeability particles is then deposited adjacent to the patterned conductor. The high permeability particles comprise material having a permeability substantially higher than the permeability of the dielectric. The high permeability particles can comprise, for example, nickel, iron, nickel-iron alloy, or magnetic oxide. As a result, an inductor having a high inductance value is achieved without lowering the quality factor of the inductor.

Abstract translation: 根据各种公开的实施例，导体在电介质中图案化。 导体可以被图案化，例如，呈正方形螺旋形。 导体可以包括例如铜，铝或铜 - 铝合金。 电介质可以是例如氧化硅或低k电介质。 然后将包含高磁导率颗粒的旋涂基体沉积在图案化导体附近。 高磁导率颗粒包括具有比电介质的磁导率显着更高的磁导率的材料。 高磁导率颗粒可以包括例如镍，铁，镍 - 铁合金或磁性氧化物。 结果，实现了具有高电感值的电感器，而不降低电感器的品质因数。

公开(公告)号：US06187672B1

公开(公告)日：2001-02-13

申请号：US09158337

申请日：1998-09-22

Applicant: Bin Zhao ,  Maureen R. Brongo

Inventor： Bin Zhao ,  Maureen R. Brongo

IPC: H01L214763

CPC classification number: H01L21/76802 ,  H01L21/76801 ,  H01L21/76819 ,  H01L21/76834

Abstract: A method is provided for forming an improved interconnect structure on a semiconductor body. A first metal layer is deposited on the semiconductor body. A sacrificial layer having a height is deposited on the first metal layer. The sacrificial layer and the metal layer are patterned to form separate metal lines with the sacrificial layer remaining on said metal lines. A low-k material is then deposited to fill the gaps between metal lines and to cover the sacrificial layer. The low-k material is then removed to a level within the height of the sacrificial layer. The sacrificial layer is then removed. A protective layer is deposited on top of the metal lines and the low-k material. A dielectric layer is deposited over the protective layer. The protective layer protects the low-k material from attack by chemicals utilized by subsequent process steps to etch vias in the dielectric layer, to strip photo-resist, and to clean the vias. The protective layer is then selectively etched away to make contact between a via plug and the metal lines.

Abstract translation: 提供了一种用于在半导体本体上形成改进的互连结构的方法。 第一金属层沉积在半导体本体上。 具有高度的牺牲层沉积在第一金属层上。 牺牲层和金属层被图案化以形成分离的金属线，牺牲层保留在所述金属线上。 然后沉积低k材料以填充金属线之间的间隙并覆盖牺牲层。 然后将低k材料去除到牺牲层的高度内的水平。 然后去除牺牲层。 保护层沉积在金属线和低k材料的顶部。 介电层沉积在保护层上。 保护层保护低k材料免受后续工艺步骤所用化学品的侵蚀，以蚀刻电介质层中的通孔，剥离光致抗蚀剂和清洁通孔。 然后选择性地蚀刻保护层以使通孔塞和金属线之间的接触。

公开(公告)号：US20150381817A1

公开(公告)日：2015-12-31

申请号：US14500984

申请日：2014-09-29

Applicant: Bin Zhao ,  Jonathan Li

Inventor： Bin Zhao ,  Jonathan Li

IPC: H04M3/56

CPC classification number: H04L43/0864 ,  H04L12/18 ,  H04L12/1827 ,  H04L12/1831 ,  H04L41/5038 ,  H04L43/045 ,  H04L43/062 ,  H04L43/0852 ,  H04L43/10 ,  H04L43/50 ,  H04L45/123 ,  H04L47/283 ,  H04L47/722 ,  H04L51/34 ,  H04L65/1066 ,  H04L65/4038 ,  H04M1/2535 ,  H04M1/72547 ,  H04M3/2236 ,  H04M3/432 ,  H04M3/563 ,  H04M3/565 ,  H04M7/0084 ,  H04M2250/62 ,  H04M2250/74 ,  H04W4/16

Abstract: Systems and methods for a call over network (CON) with a visualized summary are provided. In some embodiments, after the call concludes, a visualized summary of the call can be generated. The summary includes any of the recording of the call, transcriptions, scenario information, speaker information and the duration each speaker was talking, etc. Scenario may be generated by comparing the call speaking pattern to known templates of call types. Additionally, participant features employed in the call may be summarized in chronological relation to the calls progression in a visual format.

Abstract translation: 提供了具有可视化摘要的网络呼叫（CON）的系统和方法。 在一些实施例中，在呼叫结束之后，可以生成呼叫的可视化摘要。 摘要包括任何记录呼叫，转录，情景信息，说话者信息以及每个发言者在说话的持续时间等。场景可以通过将呼叫说话模式与呼叫类型的已知模板进行比较而产生。 此外，在呼叫中使用的参与者特征可以以与视频格式的呼叫进程的时间顺序关系来总结。

公开(公告)号：US08778226B2

公开(公告)日：2014-07-15

申请号：US12895226

申请日：2010-09-30

Applicant: Ilia N. Ivanov ,  Alexander A. Puretzky ,  Bin Zhao ,  David B. Geohegan ,  David J. Styers-Barnett ,  Hui Hu

Inventor： Ilia N. Ivanov ,  Alexander A. Puretzky ,  Bin Zhao ,  David B. Geohegan ,  David J. Styers-Barnett ,  Hui Hu

IPC: C09K11/02 ,  C09K11/06 ,  C09K11/65

CPC classification number: C09K11/06 ,  C09K11/025 ,  C09K11/65

Abstract: A photoluminescent or electroluminescent system and method of making a non-luminescent nanostructured material into such a luminescent system is presented. The method of preparing the luminescent system, generally, comprises the steps of modifying the surface of a nanostructured material to create isolated regions to act as luminescent centers and to create a charge imbalance on the surface; applying more than one polar molecule to the charged surface of the nanostructured material; and orienting the polar molecules to compensate for the charge imbalance on the surface of the nanostructured material. The compensation of the surface charge imbalance by the polar molecules allows the isolated regions to exhibit luminescence.

Abstract translation: 提出了一种使非发光纳米结构材料制成这种发光系统的光致发光或电致发光系统和方法。 通常，制备发光系统的方法包括以下步骤：改变纳米结构材料的表面以产生作为发光中心的隔离区域并在表面上产生电荷不平衡; 将多于一个极性分子应用于纳米结构材料的带电表面; 并且使极性分子取向以补偿纳米结构材料表面上的电荷不平衡。 通过极性分子对表面电荷的不平衡的补偿允许隔离区域发光。

公开(公告)号：US08725238B2

公开(公告)日：2014-05-13

申请号：US12878800

申请日：2010-09-09

Applicant: Xin Liu ,  Yuanjin Zheng ,  Myint Wai Phyu ,  Bin Zhao

Inventor： Xin Liu ,  Yuanjin Zheng ,  Myint Wai Phyu ,  Bin Zhao

IPC: A61B5/0432

CPC classification number: A61B5/0452 ,  A61B5/0472 ,  A61B5/7203 ,  A61B5/7232 ,  A61B5/726

Abstract: An electrocardiogram signal processing system is provided which includes: a wavelet transformation unit comprising a plurality of outputs, each output being connected to one of a plurality of scales, wherein the wavelet transformation unit is adapted to transform an input electrocardiogram signal into a set of wavelets, each wavelet being output to one of the scales; a plurality of signal processing blocks, each of the signal processing blocks coupled to a respective output of the wavelet transformation unit and configured to receive and process the wavelet from the respective output, wherein the signal processing blocks provide processing functions which differ from one another.

Abstract translation: 提供了一种心电图信号处理系统，其包括：小波变换单元，包括多个输出，每个输出连接到多个刻度中的一个，其中所述小波变换单元适于将输入的心电图信号变换成一组小波 每个小波输出到一个秤; 多个信号处理块，每个信号处理块耦合到小波变换单元的相应输出并且被配置为从相应的输出接收和处理小波，其中信号处理块提供彼此不同的处理功能。

公开(公告)号：US08633680B2

公开(公告)日：2014-01-21

申请号：US13216522

申请日：2011-08-24

Applicant: Bin Zhao ,  Jack Cornish ,  Victor Lee

Inventor： Bin Zhao ,  Jack Cornish ,  Victor Lee

IPC: G05F1/44 ,  G05F1/56

CPC classification number: H02M3/00 ,  H02M2001/0003 ,  Y10T307/25

Abstract: In one general aspect, an apparatus can include a controller, and a power stage coupled to the controller and configured to be coupled to a power source. The power stage is configured to deliver an output voltage to a load module in response to the controller. The apparatus also includes a reference voltage circuit coupled to the controller and configured to be grounded to a first ground voltage different from a second ground voltage associated with the load module.

Abstract translation: 在一个一般方面，装置可以包括控制器和耦合到控制器并被配置为耦合到电源的功率级。 功率级被配置为响应于控制器将输出电压递送到负载模块。 该装置还包括耦合到控制器并被配置为接地到不同于与负载模块相关联的第二接地电压的第一接地电压的参考电压电路。